Polyimide containing crosslinkable group and process for producing the same

ABSTRACT

This invention provides crosslinkable-group-containing polyimides of various known thermoplastic polyimide backbone structures, which are provided with far better heat resistance, chemical resistance and mechanical properties than known polyimides of the structures without impairing excellent moldability or formability, superb sliding property, low water absorption property, outstanding electrical properties, high thermal oxidation stability and high radiation resistance, all of which are inherent to the structures.

TECHNICAL FIELD

This invention relates to crosslinkable-group-containing polyamic acids,melt-moldable or formable, crosslinkable-group-containing polyimides,production processes thereof, and crosslinked thermoplastic polyimidesobtained by heat-treating them. Specifically, the present invention isconcerned with crosslinked thermoplastic polyimides having variousexcellent properties inherent to polyimides, namely, high heatresistance, excellent mechanical properties, superb sliding property,low water absorption property, outstanding electrical properties, highthermal oxidation resistance, high chemical resistance and highradiation resistance, especially those improved more markedly in heatresistance, chemical resistance and mechanical properties,crosslinkable-group-containing polyimides which are thermoplastic andmelt-moldable or formable, crosslinkable-group-containing polyamic acidsas precursors of the crosslinkable-group-containing polyimides,production proceses thereof, and their solutions or suspensions.

BACKGROUND ART

Polyimides have been used widely for many years as molding or otherwiseforming materials, composite materials, or electrical or electronicmaterials in various fields, because in addition to their superb heatresistance, they are also excellent in mechanical properties andelectrical properties.

For example, a polyimide (“Kapton”, “Vespel”, trade names; products ofE.I. DuPont de Nemours & Co., Inc.) of the formula (A) is known as arepresentative polyimide:

This polyimide is non-thermoplastic and is insoluble and infusible, andhence has a drawback in moldability or formability. It is thereforeaccompanied by a problem that no mass production is practicallyfeasible. As a specific processing method, a block is obtained using aspecial molding process called powder sintering molding, and then,mechanical working such as cutting, grinding and polishing is applied tothe block to obtain a formed product.

As an amorphous thermoplastic polyimide with improved moldability orformability, a polyetherimide represented by the formula (B) (“Ultem”,trade name; product of General Electric Company) is known:

However, this polyimide is soluble in amide-type aprotonic polarsolvents and halogenated hydrocarbon solvents and is inferior inchemical resistance. In addition, its glass transition temperature is215° C., and a further improvement in heat resistance is desireddepending on the application.

Further, a polyimide which is imparted with moldability or formabilityand is represented by the formula (C):

shows melt fluidity at its melting point and higher and permits meltmolding or forming while retaining the inherent properties of polyimidesbecause it has a melting point at 385° C. (U.S. Pat. No. 5,043,419).Although the glass transition temperature of this polyimide isrelatively high, i.e., 250° C., marked reductions in properties, whichare accompanied by deformation, softening or the like, take place whenused at the glass transition temperature or higher. Further improvementsare therefore desired depending on its application. Further, thispolyimide is inferior in chemical resistance especially under stress,and an improvement is strongly desired in this respect.

Since the properties of a thermoplastic polyimide depend on the backbonestructure of the polyimide, a variety of polyimides are selected in viewof their inherent performance such as heat resistance, moldability orformability, mechanical properties and chemical resistance. Nonetheless,one or more of these individual properties may be found to beinsufficient depending on the application, leading to an outstandingdesire for the improvement of the above-described various properties.

On the other hand, a variety of thermosetting polyimides are availableon the market. As a representative example of these polyimides, apolyimide available from monomers represented by the formula (D):

is known [“Kerimid-601”, trade name; product of Rhone-Poulenc SA; F. D.Darmory, “National SAMPLE Symposium”, 19, 693 (1974)]. As this polyimideis thermosetting, it is less susceptible to deformation or softeningthan thermoplastic polyimides and therefore, can be used under hightemperature condition. However, this polyimide is not high in mechanicalproperties, especially in toughness and is weak against external forcesuch as an impact. Due to its thermosetting property, no melt molding orforming is feasible. It is therefore necessary to carry out shaping atthe stage of a prepolymer before its hardening and then to conduct heattreatment.

For the purpose of making improvements in the detrimental mechanicalproperties of these thermosetting polyimides, it is known to use alinear polyimide as a backbone and then to introduce crosslinkingmembers into its ends and/or substituent groups. Reference may be had,for example, to U. S. Pat. No. 5,138,028, U.S. Pat. No. 5,478,915, U.S.Pat. No. 5,493,002, U.S. Pat. No. 5,567,800, U.S. Pat. No. 5,644,022,U.S. Pat. No. 5,412,066, and U.S. Pat. No. 5,606,014.

As technical details, U.S. Pat. No. 5,567,800, for example, disclosesthermosetting polyimides available from heat treatment of imideoligomers having carbon-carbon triple bonds at their molecule ends,which can in turn be obtained from monomers represented by the formula(E):

and an end blocking agent, respectively. Although the polyimidesdisclosed in this patent have various excellent properties, they stilldo not permit melt molding or forming, and therefore, their molding orforming is limited to processing which makes use of solutions ofpolyamic acids as precursors. In general, subsequent to the shaping of asolution of a polyamic acid, removal of the solvent and a dehydratingimidation reaction are conducted by heating. As this processing involvesthe removal of the solvent, it is generally impossible to obtain amolded or formed product having a large thickness. This processing istherefore limited in shape to films or sheets, and further, involvesproblems such as foaming due to remaining solvent and a need forrecovery of a great deal of solvent.

DISCLOSURE OF THE INVENTION

An object of the present invention is to providecrosslinkable-group-containing polyimides of various known thermoplasticpolyimide backbone structures, which are provided with far better heatresistance, chemical resistance and mechanical properties than knownpolyimides of the structures without impairing advantages inherent tothe structure, such as excellent moldability or formability, superbsliding property, low water absorption property, outstanding electricalproperties, high thermal oxidation stability and high radiationresistance.

Specifically described, the terms “heat resistance”, “chemicalresistance” and “mechanical properties” the improvements of whichconstitute one of themes sought for attainment by the present inventionmean, for example, physical property values and test results such asthose to be described below.

{circle around (1)} Concerning heat resistance, representative examplescan include glass transition temperature; softening temperature,deflection temperature under load, and mechanical properties at hightemperatures in thermal mechanical analyses; retentions of mechanicalproperties in thermal cycle tests; solder reflow heat resistance test;heat resistance test; and hot air aging test. Among these, the themesthe attainment of which are sought for in the present invention caninclude especially deflection temperature under load, mechanicalproperties at high temperatures, retentions of mechanical properties inthermal cycle tests, and the like.

{circle around (2)} As to chemical resistance, representative examplescan include solvent dissolution resistance test, solvent immersion test,under-stress solvent immersion resistance resistance test, andretentions of various physical properties after immersion in solventunder stress. Among these, the themes the attainment of which are soughtfor in the present invention can include especially under stress solventimmersion resistance test, retentions of various physical propertiesafter immersion in solvent under stress, and the like.

{circle around (3)} In respect to mechanical properties, representativeexamples can include tensile test, compression test, bending test, Izodimpact test, and fatigue test. Among these, the themes the attainment ofwhich is sought for in the present invention can include especiallyyield strength, tensile modulus, flexural modulus, Izod impact value,and the like.

Describing in other words from another viewpoint, the themes theattainment of which is sought for by the present invention are toprovide a crosslinkable-group-containing polyimide imparted withthermoplasticity by additionally providing it with high moldability orformability, which has not been brought about by conventional polyimidesof the end-curing type, while retaining excellent physical propertiesinherent to thermosetting polyimides of the end-curing type, that is,superb sliding property, low water absorption property, outstandingelectrical properties, high thermal oxidation stability, high chemicalresistance and excellent mechanical properties.

Accordingly, an object of the present invention is to provide acrosslinkable-group-containing polyimide, which is thermoplastic andpermits melt moldability or formability, or acrosslinkable-group-containing polyamic acid which is a precursor of thepolyimide. Another object of the present invention is to provide itsproduction process.

It is an important feature of the present invention that thecrosslinkable-group-containing polyimide according to the presentinvention permits melt molding or forming despite its inclusion ofcrosslinkable groups, which allow a crosslinking reaction, and thecrosslinkable-group-containing thermoplastic polyimide showsthermoplasticity. It is here that the crosslinkable-group-containingpolyimide according to the present invention is totally different fromthe conventional thermosetting resins which are crosslinkable. Thepresent invention is based on a novel concept never in existence todate, and has made it possible to achieve mutually contradictory mattersof intermolecular crosslinking and melt fluidity.

To achieve the above-described objects, the present inventors haveproceeded with an extensive investigation. As a result, it has foundthat a crosslinkable-group-containing polyimide molecule ends of whichare blocked with 1 to 80 mole % of a crosslinkable-group-containingdicarboxylic acid anhydride and 99 to 20 mole % of acrosslinkable-group-free dicarboxylic acid anhydride can achieve theabove-described objects and permits melt molding or forming despite ithas been more significantly improved and is outstanding especially inheat resistance, chemical resistance and mechanical properties, leadingto the completion of the present invention.

Described specifically, the present invention provides the followingpolyimides or processes (1)-(35):

(1) A crosslinkable-group-containing polyimide comprising crosslinkablegroups at 1 to 80 mole % of molecule ends thereof.

(2) A crosslinkable-group-containing polyimide as described in claim 1,wherein a backbone structure which forms the polyimide is substantiallyprovided with thermoplasticity.

(3) A crosslinkable-group-containing polyimide as described above under(1) or (2), said polyimide permitting melt molding or forming, wherein 1to 80 mole % of the molecule ends are crosslinkable-group-containingmolecule ends represented by the chemical formula (2a) and 99 to 20 mole% of the molecule ends are crosslinking-group-free molecule endsrepresented by the chemical formula (2b):

wherein Y represents a trivalent aromatic group selected from the groupconsisting:

wherein X represents a divalent linking group selected from the groupconsisting of a direct bond, a carbonyl group, a sulfone group, asulfide group, an ether group, an isopropylidene group and ahexafluoroisopropylidene group; and

wherein T represents a divalent aromatic group consisting of:

wherein X represents a divalent linking group selected from the groupconsisting of a direct bond, a carbonyl group, a sulfone group, asulfide group, an ether group, an isopropylidene group and ahexafluoroisopropylidene group.

(4) A crosslinkable-group-containing polyimide as described above underany one of (1)-(3), wherein the polyimide comprises polyimide moleculesof a structure represented by the chemical formula (2c):

wherein T, PI and Y are groups to be indicated next, respectively, thatis,

T represents a divalent aromatic group selected from the groupconsisting of:

 wherein X represents a divalent linking group selected from the groupconsisting of a direct bond, a carbonyl group, a sulfone group, asulfide group, an ether group, an isopropylidene group and ahexafluoroisopropylidene group;

PI represents a polyimide backbone; and

Y represents a trivalent aromatic group selected from the groupconsisting of:

 wherein X represents a divalent linking group selected from the groupconsisting of a direct bond, a carbonyl group, a sulfone group, asulfide group, an ether group, an isopropylidene group and ahexafluoroisopropylidene group.

(5) A crosslinkable-group-containing polyimide as described above under(3) or (4), wherein in the chemical formula (2b) or (2c), T is thefollowing chemical formula (2d):

(6) A crosslinkable-group-containing polyimide as described above underany one (3)-(5), wherein in the chemical formula (2a) or (2c), Y is thefollowing chemical formula (2e):

(7) A crosslinkable-group-containing polyimide as described above underany one of (1)-(6), wherein a backbone of the polyimide has recurringstructural units represented by the chemical formula (1):

wherein Ar and R are groups to be described next, that is,

Ar represents a divalent aromatic group selected from the groupconsisting of:

 wherein J represents a divalent linking group selected from the groupconsisting of a carbonyl group, an ether group, an isopropylidene groupand a hexafluoroisopropylidene group, K represents a divalent linkinggroup selected from the group consisting of a direct bond, a carbonylgroup, a sulfone group, a sulfide group, an ether group, anisopropylidene group and a hexafluoroisopropylidene group, p and q eachindependently stand for 0 or 1, and a position of each bond, saidposition being unspecified, is a para-position or meta-position; and

R represents a tetravalent aromatic group selected from the groupconsisting of:

 wherein G represents a divalent aromatic group selected from the groupconsisting of a direct bond, a carbonyl group, a sulfone group, asulfide group, an ether group, an isopropylidene group, ahexafluoroisopropylidene group, a 3-oxyphenoxy group, a 4-oxyphenoxygroup, a 4′-oxy-4-biphenoxy group and a4-[1-(4-oxyphenyl)-1-methylethyl]phenoxy group.

(8) A crosslinkable-group-containing polyimide as described above underclaim 7, wherein 50 to 100 mole % of the recurring structural unitsrepresented by the chemical formula. (1) are of a recurring unitstructure represented by the chemical formula (1a):

wherein G is a divalent aromatic group selected from the groupconsisting of a direct bond, a carbonyl group, a sulfone group, asulfide group, an ether group, an isopropylidene group, ahexafluoroisopropylidene group, a 3-oxyphenoxy group, a 4-oxyphenoxygroup, a 4′-oxy-4-biphenoxy group and a4-[1-(4-oxyphenyl)-1-methylethyl]phenoxy group.

(9) A crosslinkable-group-containing polyimide as described above under(8), wherein in the chemical formula (1a), G is a 4′-oxy-4-biphenoxygroup.

(10) A crosslinkable-group-containing polyimide as described above under(8), wherein in the chemical formula (1a), G is a4-[1-(4-oxyphenyl)-1-methylethyl]phenoxy group.

(11) A crosslinkable-group-containing polyimide as described above under(7), wherein 50 to 100 mole % of the recurring structural unitsrepresented by the chemical formula (1) are of a recurring unitstructure represented by the chemical formula (1b):

wherein X and R are groups to be indicated next, respectively, that is,

X represents a divalent linking group selected from the group consistingof a direct bond, a carbonyl group, a sulfone group, a sulfide group, anether group, an isopropylidene group and a hexafluoroisopropylidenegroup; and

R represents a tetravalent linking group selected from the groupconsisting of:

 wherein G represents a divalent aromatic group selected from the groupconsisting of a direct bond, a carbonyl group, a sulfone group, asulfide group, an ether group, an isopropylidene group, ahexafluoroisopropylidene group, a 3-oxyphenoxy group, a 4-oxyphenoxygroup, a 4′-oxy-4-biphenoxy group and a4-[l-(4-oxyphenyl)-1-methylethyl]phenoxy group, and a position of eachbond, said position being unspecified, is a para-position ormeta-position.

(12) A crosslinkable-group-containing polyimide as described above under(11), wherein in the chemical formula (1b),

X is an oxygen atom;

imido-bonded positions of two benzenes to which X is directly bonded area m-position and a para-position, respectively; and

R is a 3,4,3′,4′-substituted biphenyl.

(13) A crosslinkable-group-containing polyimide as described above under(7), wherein among the recurring structural units represented by thechemical formula (1), 50 to 100 mole % are of a recurring unit structurerepresented by the chemical formula (1c):

wherein X and R are groups to be indicated next, respectively, that is,

X represents a divalent linking group selected from the group consistingof a direct bond, a carbonyl group, a sulfone group, a sulfide group, anether group, an isopropylidene group and a hexafluoroisopropylidenegroup; and

R represents a tetravalent linking group selected from the groupconsisting of:

 wherein G represents a divalent aromatic group selected from the groupconsisting of a direct bond, a carbonyl group, a sulfone group, asulfide group, an ether group, an isopropylidene group, ahexafluoroisopropylidene group, a 3-oxyphenoxy group, a 4-oxyphenoxygroup, a 4′-oxy-4-biphenoxy group and a4-[1-(4-oxyphenyl)-1-methylethyl]phenoxy group, and a position of eachbond, said position being unspecified, is a para-position ormeta-position.

(14) A crosslinkable-group-containing polyimide as described above under(13), wherein in the chemical formula (1c), X is an oxygen atom.

(15) A crosslinkable-group-containing polyimide as described above under(13), wherein in the chemical formula (1c),

X is an oxygen atom;

positions of a benzene ring, at which two Xs are directly bonded,respectively, are m-positions relative to each other;

bonded positions of each of two benzenes to each of which X and an imidogroup are directly bonded are p-positions relative to each other; and

R is a 3,4,3′,4′-substituted biphenyl.

(16) A crosslinkable-group-containing polyimide as described above under(7), wherein among the recurring structural units represented by thechemical formula (1), 50 to 100 mole % are of a recurring unit structurerepresented by the chemical formula (1e):

wherein Q, Z and Rare groups to be indicated next, respectively, thatis,

Q represents a divalent aromatic group selected from the groupconsisting of an ether group and an isopropylidene group;

Z represents a divalent aromatic group selected from the groupconsisting of a direct bond, a carbonyl group, a sulfone group, asulfide group, an ether group, an isopropylidene group, ahexafluoroisopropylidene group, and

R represents a tetravalent aromatic group selected from the groupconsisting of:

 wherein G represents a divalent aromatic group selected from the groupconsisting of a direct bond, a carbonyl group, a sulfone group, asulfide group, an ether group, an isopropylidene group, ahexafluoroisopropylidene group, a 3-oxyphenoxy group, a 4-oxyphenoxygroup, a 4′-oxy-4-biphenoxy group and a4-[1-(4-oxyphenyl)-1-methylethyl]phenoxy group, and a position of eachbond, said position being unspecified, is a para-position ormeta-position.

(17) A crosslinkable-group-containing polyimide as described above under(16), wherein in the chemical formula (1e),

Q is an oxygen atom; and

Z is at least one divalent group selected from the group consisting of adirect bond, a carbonyl group, a sulfone group, a sulfide group, anether group, an isopropylidene group and a hexafluoroisopropylidenegroup.

(18) A crosslinkable-group-containing polyimide as described above under(16), wherein in the chemical formula (1e),

Q is an oxygen atom;

Z is a direct bond; and

R is a 1,2,4,5-substituted benzene.

(19) A process for the production of a melt-moldable or formable,crosslinkable-group-containing polyimide, 1 to 80 mole % of moleculeends of the polyimide being crosslinkable-group-containing molecule endsrepresented by a chemical formula (2a) and 99 to 20 mole % of themolecule ends being crosslinkable-group-free molecule ends representedby a chemical formula (2b), which comprises end-blocking ends ofpolyimide backbones by using dicarboxylic acid anhydrides represented bythe chemical formula (3e) and the chemical formula (3b):

wherein Y represents a trivalent aromatic group selected from the groupconsisting:

wherein X represents a divalent linking group selected from the groupconsisting of a direct bond, a carbonyl group, a sulfone group, asulfide group, an ether group, an isopropylidene group and ahexafluoroisopropylidene group;

wherein T represents a divalent aromatic group consisting of:

wherein X represents a divalent linking group selected from the groupconsisting of a direct bond, a carbonyl group, a sulfone group, asulfide group, an ether group, an isopropylidene group and ahexafluoroisopropylidene group;

wherein Y represents a trivalent aromatic group selected from the groupconsisting:

wherein X represents a divalent linking group selected from the groupconsisting of a direct bond, a carbonyl group, a sulfone group, asulfide group, an ether group, an isopropylidene group and ahexafluoroisopropylidene group; and

wherein T represents a divalent aromatic group consisting of:

wherein X represents a divalent linking group selected from the groupconsisting of a direct bond, a carbonyl group, a sulfone group, asulfide group, an ether group, an isopropylidene group and ahexafluoroisopropylidene group.

(20) A process as described above under (19), wherein the dicarboxylicacid anhydrides represented by the chemical formula (3a) and thechemical formula (3b) are used in amounts represented, on a molar ratiobasis, by the numerical formula [1]:

1/99≦the dicarboxylic acid anhydride represented by the chemical formula(3a)/the dicarboxylic acid anhydride represented by the chemical formula(3b)≦80/20  [1]

Y represents a trivalent aromatic group selected from the groupconsisting of:

 wherein X represents a divalent linking group selected from the groupconsisting of a direct bond, a carbonyl group, a sulfone group, asulfide group, an ether group, an isopropylidene group and ahexafluoroisopropylidene group.

T represents a divalent aromatic group selected from the groupconsisting of:

 wherein X represents a divalent linking group selected from the groupconsisting of a direct bond, a carbonyl group, a sulfone group, asulfide group, an ether group, an isopropylidene group and ahexafluoroisopropylidene group.

(21) A process as described above under (19) or (20), wherein in thechemical formula (3a) and/or the chemical formula (3b), T is thechemical formula (2a) and/or Y is the chemical formula (2e):

(22) A process as described above under any one of (19)-(21), whereinthe polyimide backbones have been obtained by thermally and/orchemically imidating a polyamic acid obtained as a polyimide precursorby polymerizing a diamine component and a tetracarboxylic acid anhydridecomponent.

(23) A process as described above under (22), wherein the diaminecomponent is at least one diamine component selected from the groupconsisting of diamine components represented by the chemical formula(4):

H₂N—Ar—NH₂  (4)

wherein Ar represents a divalent aromatic group selected from the groupconsisting of:

wherein J represents a divalent linking group selected from the groupconsisting of a carbonyl group, an ether group, an isopropylidene groupand a hexafluoroisopropylidene group, K represents a divalent linkinggroup selected from the group consisting of a direct bond, a carbonylgroup, a sulfone group, a sulfide group, an ether group, anisopropylidene group and a hexafluoroisopropylidene group, p and q eachindependently stand for 0 or 1, and a position of each bond, saidposition being unspecified, is a para-position or meta-position;

(24) A process as described above under (23), wherein of the diaminecomponent represented by the chemical formula (4), 50 to 100 mole % arerepresented by the chemical formula (4c):

wherein X represents a divalent linking group selected from the groupconsisting of a direct bond, a carbonyl group, a sulfone group, asulfide group, an ether group, an isopropylidene group and ahexafluoroisopropylidene group, and a position of each bond, saidposition being unspecified, is a para-position or meta-position.

(25) A process as described above under (24), wherein in the chemicalformula (4c), X is an oxygen atom.

(26) A process as described above under (24), wherein in the chemicalformula (4c),

X is an oxygen;

positions of a benzene ring, at which two Xs are directly bonded,respectively, are m-positions relative to each other; and

bonded positions of each of two benzenes to each of which X and an aminogroup are directly bonded are p-positions relative to each other.

27. A process as described above under (24), wherein of the diaminecomponent represented by the chemical formula (4): 50 to 100 mole % arerepresented by the chemical formula (4d):

wherein X represents a divalent linking group selected from the groupconsisting of a direct bond, a carbonyl group, a sulfone group, asulfide group, an ether group, an isopropylidene group and ahexafluoroisopropylidene group.

(28) A process as described above under (27), wherein in the chemicalformula (4d), X is a direct bond.

(29) A process as described above under (22), wherein thetetracarboxylic acid dihydride component is represented by the chemicalformula (5):

wherein R represents a tetravalent linking group selected from the groupconsisting of:

wherein G represents a divalent aromatic group selected from the groupconsisting of a direct bond, a carbonyl group, a sulfone group, asulfide group, an ether group, an isopropylidene group, ahexafluoroisopropylidene group, a 3-oxyphenoxy group, a 4-oxyphenoxygroup, a 4′-oxy-4-biphenoxy group and a4-[l-(4-oxyphenyl)-1-methylethyl]phenoxy group.

(30) A crosslinkable-group-containing polyimide as described above underany one of (1)-(18), there is a temperature T [° C.] whichsimultaneously satisfy the following numerical formulas [2] and [3]:

1≦MV30(T)/MV5(T)≦10  [2]

10≦MV5(T)≦10,000  [3]

where

MV5(T): melt viscosity [Pa·sec] of the polyimide as measured under adesired constant shearing stress in a range of from 0.1 to 1 [MPa] aftercausing the polyimide to melt by holding the polyimide at a temperatureT [° C.] for 5 minutes; and

MV30(T): melt viscosity [Pa·sec] of the polyimide as measured under thedesired constant shearing stress in the range of from 0.1 to 1 [MPa]after causing the polyimide to melt by holding the polyimide at thetemperature T [° C.] for 30 minutes.

(31) A crosslinkable-group-containing polyimide as described above underany one of (1)-(18), wherein there is a temperature T [° C.] whichsimultaneously satisfy the following numerical formulas [2], [3] and[4]:

1≦MV30(T)/MV5(T)≦10  [2]

10≦MV5(T)≦10,000  [3]

MV30(T+20)/MV5(T+20)≦20  [4]

where

MV5(T): melt viscosity [Pa·sec] of the polyimide as measured under adesired constant shearing stress in a range of from 0.1 to 1 [MPa] aftercausing the polyimide to melt by holding the polyimide at a temperatureT [° C.] for 5 minutes;

MV5(T+20): melt viscosity [Pa·sec] of the polyimide as measured underthe desired constant shearing stress in the range of from 0.1 to 1 [MPa]after causing the polyimide to melt by holding the polyimide at atemperature T+20 [° C.] for 5 minutes;

MV30(T): melt viscosity [Pa·sec] of the polyimide as measured under thedesired constant shearing stress in the range of from 0.1 to 1 [MPa]after causing the polyimide to melt by holding the polyimide at thetemperature T [° C.] for 30 minutes.

MV30(T+20): melt viscosity [Pa·sec] of the polyimide as measured underthe desired constant shearing stress in the range of from 0.1 to 1 [MPa]after causing the polyimide to melt by holding the polyimide at atemperature T+20 [] for 30 minutes.

(32) A crosslinkable-group-containing polyimide as described above underany one of (1)-(18), which simultaneously satisfies the followingnumerical formulas [5] and [6]:

 1≦MV30(360)/MV5(360)≦10  [5]

10≦MV5(360)≦10,000  [6]

where

MV5(360): melt viscosity [Pa·sec] of the polyimide as measured under adesired constant shearing stress in a range of from 0.1 to 1 [MPa] aftercausing the polyimide to melt by holding the polyimide at 360 [° C.] for5 minutes; and

MV30(360): melt viscosity [Pa·sec] of the polyimide as measured underthe desired constant shearing stress in the range of from 0.1 to 1 [MPa]after causing the polyimide to melt by holding the polyimide at 360 [°C.] for 30 minutes.

(33) A crosslinkable-group-containing polyimide as described above underany one of (1)-(18), wherein a time t (min) which satisfies thenumerical formula [7] lasts 10 minutes or longer:

G′(t)=G″(t)  [7]

where

G′ (t): storage modulus of the polyimide as measured at 360° C. and 1 Hzafter an elapse of the time t (min) and

G″ (t): loss modulus of the polyimide as measured at 360° C. and 1 Hzafter an elapse of the time t (min).

(34) A crosslinked polyimide obtained by heat-treating acrosslinkable-group-containing polyimide as described above under anyone of (1)-(18) and (30)-(33).

(35) A solution or suspension comprising acrosslinkable-group-containing polyimide as described above under anyone of (1)-(18) and (30)-(33).

The polyimide according to the present invention is acrosslinkable-group-containing polyimide which contains crosslinkinggroups at 1 to 80 mole % of molecule ends thereof.

[Molecule Ends]

The term “molecule ends” as used herein means molecule ends, which arenot contained in recurring structural units of a polyimide moleculechain and schematically correspond to “-End”s in the chemical formula(6a).

Where, as will be indicated by the chemical formula (6b), two kinds ofunits A and B exist in a recurring structural unit and the number ofunits of one kind (“A” in this case) is greater by one than that of theunit(s) of the other kind, molecule ends schematically corresponds to“-End”s in the chemical formula (6b).

It is to be noted that the structural unit A or B is not supposed to becontained in the structure of each “-End”.

[Crosslinkable Groups]

The term “crosslinkable groups” means groups capable of forming acertain bond between molecule chains as a result of a reaction betweencrosslinkable groups or a crosslinkable group and a group on a polyimidebackbone under specific crosslinking conditions. In the presentinvention, crosslinkable groups exist in molecule ends of polyimidechains.

No limitation is imposed on the crosslinking conditions, and a knowncrosslinking reaction such as heat-setting or photo-setting can beapplied. From the standpoint of use, preferred are crosslinkable groupsto which conditions not decomposing a polyimide backbone undercrosslinking conditions are applicable.

If crosslinkable groups react with groups on a polyimide backbone,groups usable as the crosslinkable groups obviously differ depending onthe polyimide backbone to be used.

As crosslinkable groups, those known to the public can be chosen andused as desired. No limitation is imposed on the kind of crosslinkablegroups, but representative examples can include ethynyl groups,benzocyclobuten-4′-yl groups, vinyl groups, allyl groups, cyano groups,isocyanate groups, nitrilo groups, amino groups, isopropenyl groups,vinylene groups, vinylidene groups, ethynylidene groups, andbiphenylenyl groups.

[Molecule Ends Having Preferred Crosslinkable Groups]

Molecule ends, each of which is usable in the present invention and hasa crosslinkable group, are preferably those represented by the chemicalformula (2a). The polyimide according to the present invention ischaracterized in that 1 to 80 mole % of the total number of end groupsof the polymer chain are such crosslinkable-group-containing end groupsand 99 to 20 mole % are crosslinkable-group-free end groups, preferably,those represented by the chemical formula (2b).

Specific examples of end structures represented by the chemical formula(2a) can include:

Incidentally, the crosslinkable-group-containing end groups are notlimited to those exemplified above, but knowncrosslinkable-group-containing end groups can be used either singly orin combination as desired.

As the most preferred crosslinkable-group-containing end group, one ofthe chemical formula (2a) in which Y is the chemical formula (2e) isused. Specifically, it is:

[Crosslinkable-group-free Molecule Ends]

As the crosslinkable-group-containing polyimide according to the presentinvention is characterized in that it has crosslinkable groups at 1 to80 mole % of its molecule ends, 99 to 20 mole % of its molecule ends arecrosslinkable-group-free molecule ends. The term“crosslinkable-group-free molecule ends” means molecule end groups whichcannot for many bond between molecule chains because no reaction takesplace between the molecule ends themselves or the molecule ends andgroups on polyimide backbones under any conditions during a molding orforming step, a post treatment step or the like.

[Crosslinkable-group-containing Molecule Ends Which may Function asCrosslinkable-group-free Molecule Ends]

As the term “crosslinkable-group-free molecule ends” as used hereinmeans molecule end groups incapable of crosslinking under any conditionsduring a molding or forming step, a post treatment step or the like asdescribed above, a structure which becomes a crosslinkable group undercertain conditions can function as a crosslinkable-group-free group whenemployed under conditions milder than the first-mentioned conditions.

[Preferred Crosslinkable-group-free Molecule Ends]

As crosslinkable-group-free molecule ends, those of known structures canbe used either singly or in combination, and no limitation is imposed.Nonetheless, use of those represented by the chemical formula (2) ispreferred. Most preferably, those of the chemical formula (2) in which Trepresents the chemical formula (2d) are used. Specifically, it is:

[Molar Ratio of Crosslinkable-group-containing Molecule Ends toCrosslinkable-group-free Molecule Ends]

The present invention relates to the crosslinkable-group-containingpolyimide characterized in that it contains crosslinkable groups at 1 to80 mole % of its molecule ends. It is therefore essential that the molarratio of crosslinkable-group-containing molecule ends tocrosslinkable-group-free molecule ends falls within the following range:

1/99≦[E′1]/[E′2]≦80/20

where

[E′1]: the molar quantity of the crosslinkable-group-containing moleculeends; and

[E′2]: the molar quantity of the crosslinkable-f-group-free moleculeends.

If the value of [E′1]/[E′2] falls short of this range and is smallerthan 1/99, no sufficient crosslinking density can be achieved, leadingto insufficient improvements in chemical resistance, heat resistance andmechanical properties. If the value of [E′1]/[E′2] is greater than80/20, on the other hand, a sufficient crosslinking density isavailable, but upon melt molding or forming, a substantial viscosityincrease takes place so that the melt molding or forming becomesinfeasible.

The range of the [E′1]/[E′2] value has to be chosen appropriatelydepending on molding or forming conditions. In general, however, thepreferred range is:

5/95≦[E′1]/[E′2]≦70/30,

and the more preferred range is:

10/90≦[E′1]/[E′2]≦70/30.

The still more preferred range varies depending on the molding orforming process. For example, in a batchwise molding or forming process,such as compression molding, that involves residence in a molten state,the still more preferred range is:

30/70≦[E′1]/[E′2]≦70/30,

and the most preferred range is:

40/60≦[E′1]/[E′2]≦60/40.

For example, in a molding or forming process, such as injection moldingor extrusion, that involves residence in a molten state and requires acontinuous operation, the preferred range is:

10/90≦[E′1]/[E′2]≦50/50,

and the most preferred range is:

20/80≦[E′1]/[E′2]≦40/60.

For example, in a molding or forming process that does not involve muchresidence in a molten state, the preferred range is:

20/80≦[E′1]/[E′2]≦60/40,

and the most preferred range is:

30/70≦[E′1]/[E′2]≦50/50.

[Structure of the Crosslinkable-group-containing Polyimide]

To form the backbone structure of the crosslinkable-group-containingpolyimide according to the present invention, known polyimides are usedsingly, as a blend of a desired ratio, or as a copolymer of a desiredratio.

[Structure of Preferred Crosslinkable-group-containing Polyimide—(1)]

Although no limitation is imposed on the backbone structure of thecrosslinkable-group-containing polyimide according to the presentinvention, preferred is a crosslinkable-group-containing polyimidecharacterized in that the backbone structure, which makes up thecrosslinkable-group-containing polyimide, is substantially provided withthermoplasticity.

[What Does “Substantially Provided With Thermoplasticity” Mean?]

The expression “a backbone structure is substantially provided withthermoplasticity” as used herein means that plasticity is shown as acharacteristic property of the backbone structure, specifically that apolyimide, which has been obtained by polymerizing a polyimide of thebackbone structure under diamine-excess conditions and then blockingmolecular chains of the polyimide at ends thereof with phthalicanhydride in a stoichiometric or greater amount, shows thermoplasticity.

[Structure of Preferred Crosslinkable-group-containing Polyimide—(2)]

Preferably, the polyimide is a crosslinkable-group-containing polyimidewhich permits melt molding or forming.

[Melt Molding or Forming]

The term “melt molding or forming” as used herein means a molding orforming process of the polyimide, in at least one step of which theresin is caused to flow in a molten state. The molten state of thepolyimide can be achieved only at a temperature higher than its crystalmelting temperature or glass transition temperature. To allow a resin toflow, the resin is required to have an adequate melt viscosity whichvaries depending on shearing stress which in turn differs depending onthe molding or forming process. Incidentally, the temperature, shearingstress and melt viscosity differ depending on the molding or formingprocess.

Illustrative of the molding or forming process are extrusion, injectionmolding, compression molding, blow molding, vacuum forming, rotationalmolding, reaction injection molding, laminated molding, and casting.

[Variations in Melt Viscosity]

To continuously perform processing under steady state, variations inmelt viscosity are required to be small. The term “variations in meltviscosity” means variations in viscosity when a resin is held at aprocessing temperature under processing shearing stress.

[Melt Viscosity]

From the foregoing, the polyimide according to the present invention isa crosslinkable-group-containing polyimide which, although no limitationis imposed on its viscosity, preferably satisfies the followingnumerical formulas [2] and [3] simultaneously:

1≦MV30(T)/MV5(T)≦10  [2]

10≦MV5(T)≦10,000  [3]

where

MV5(T): melt viscosity [Pa·sec] of the polyimide as measured under adesired constant shearing stress in a range of from 0.1 to 1 [MPa] aftercausing the polyimide to melt by holding the polyimide at a temperatureT [° C.] for 5 minutes, and

MV30(T): melt viscosity [Pa·sec] of the polyimide as measured under thedesired constant shearing stress in the range of from 0.1 to 1 [MPa]after causing the polyimide to melt by holding the polyimide at thetemperature T [° C.] for 30 minutes;

more preferably, satisfies the following numerical formulas [2], [3] and[4] simultaneously:

1≦MV30(T)/MV5(T)≦10  [2]

10≦MV5(T)≦10,000  [3]

MV30(T+20)/MV5(T+20)≦20  [4]

where

MV5(T): melt viscosity [Pa·sec] of the polyimide as measured under adesired constant shearing stress in a range of from 0.1 to 1 [MPa] aftercausing the polyimide to melt by holding the polyimide at a temperatureT [° C.] for 5 minutes,

MV5(T+20): melt viscosity [Pa·sec] of the polyimide as measured underthe desired constant shearing stress in the range of from 0.1 to 1 [MPa]after causing the polyimide to melt by holding the polyimide at atemperature T+20 [° C.] for 5 minutes,

MV30(T): melt viscosity [Pa·sec] of the polyimide as measured under thedesired constant shearing stress in the range of from 0.1 to 1 [MPa]after causing the polyimide to melt by holding the polyimide at thetemperature T [° C.] for 30 minutes, and

MV30(T+20): melt viscosity [Pa·sec] of the polyimide as measured underthe desired constant shearing stress in the range of from 0.1 to 1 [MPa]after causing the polyimide to melt by holding the polyimide at atemperature T+20 [° C.] for 30 minutes; and

most preferably, satisfies the following numerical formulas [2], [3] and[4b] simultaneously:

1≦MV30(T)/MV5(T)≦10  [2]

10≦MV5(T)≦10,000  [3]

MV30(T+20)/MV5(T+20)≦10  [4b]

 where

MV5(T): melt viscosity [Pa·sec] of the polyimide as measured under adesired constant shearing stress in a range of from 0.1 to 1 [MPa] aftercausing the polyimide to melt by holding the polyimide at a temperatureT [° C.] for 5 minutes,

MV5(T+20): melt viscosity [Pa·sec] of the polyimide as measured underthe desired constant shearing stress in the range of from 0.1 to 1 [MPa]after causing the polyimide to melt by holding the polyimide at atemperature T+20 [° C.] for 5 minutes,

MV30(T): melt viscosity [Pa·sec] of the polyimide as measured under thedesired constant shearing stress in the range of from 0.1 to 1 [MPa]after causing the polyimide to melt by holding the polyimide at thetemperature T [° C.] for 30 minutes, and

MV30(T+20): melt viscosity [Pa·sec] of the polyimide as measured underthe desired constant shearing stress in the range of from 0.1 to 1 [MPa]after causing the polyimide to melt by holding the polyimide at atemperature T+20 [° C.] for 30 minutes.

When as crosslinkable-group-containing end groups, those of thestructure represented by the chemical formula (2) are used, inclusion of360° C. within a range of the temperature T [° C.] which satisfies theabove numerical formulas [2], [3], [4] and [4b] is preferred from theadditional consideration of the fact that the crosslinking temperaturecondition for the crosslinkable groups is about 360° C. or higher.

In other words, the polyimide according to the present invention is acrosslinkable-group-containing polyimide which preferably satisfies thefollowing numerical formulas [5] and [6] simultaneously:

1≦MV30(360)/MV5(360)≦10  [5]

10≦MV5(360)≦10,000  [6]

where

MV5(360): melt viscosity [Pa·sec] of the polyimide as measured under adesired constant shearing stress in a range of from 0.1 to 1 [MPa] aftercausing the polyimide to melt by holding the polyimide at 360 [° C.] for5 minutes, and

MV30(360): melt viscosity [Pa·sec] of the polyimide as measured underthe desired constant shearing stress in the range of from 0.1 to 1 [MPa]after causing the polyimide to melt by holding the polyimide at 360 [°C.] for 30 minutes;

more preferably, satisfies the following numerical formulas [5], [6] and[8] simultaneously:

1≦MV30(360)/MV5(360)≦10  [5]

10≦MV5(360)≦10,000  [6]

MV30(380)/MV5(380)≦20  [8]

 where

MV5(360): melt viscosity [Pa·sec] of the polyimide as measured under adesired constant shearing stress in a range of from 0.1 to 1 [MPa] aftercausing the polyimide to melt by holding the polyimide at 360 [° C.] for5 minutes,

MV5(380): melt viscosity [Pa·sec] of the polyimide as measured under thedesired constant shearing stress in the range of from 0.1 to 1 [MPa]after causing the polyimide to melt by holding the polyimide at 380 [°C.] for 5 minutes,

MV30(360): melt viscosity [Pa·sec] of the polyimide as measured underthe desired constant shearing stress in the range of from 0.1 to 1 [MPa]after causing the polyimide to melt by holding the polyimide at 360 [°C.] for 30 minutes,

MV30(380): melt viscosity [Pa·sec] of the polyimide as measured underthe desired constant shearing stress in the range of from 0.1 to 1 [MPa]after causing the polyimide to melt by holding the polyimide at 380 [°C.] for 30 minutes; and

most preferably, satisfies the following numerical formulas [5], [6] and[8b] simultaneously:

1≦MV30(360)/MV5(360)≦10  [5]

10≦MV5(360)≦10,000  [6]

MV30(380)/MV5(380)≦10  [8b]

 where

MV5(360): melt viscosity [Pa·sec] of the polyimide as measured under adesired constant shearing stress in a range of from 0.1 to 1 [MPa] aftercausing the polyimide to melt by holding the polyimide at 360 [° C.] for5 minutes,

MV5(380): melt viscosity [Pa·sec] of the polyimide as measured under thedesired constant shearing stress in the range of from 0.1 to 1 [MPa]after causing the polyimide to melt by holding the polyimide at 380 [°C.] for 5 minutes,

MV30(360): melt viscosity [Pa·sec] of the polyimide as measured underthe desired constant shearing stress in the range of from 0.1 to 1 [MPa]after causing the polyimide to melt by holding the polyimide at 360 [°C.] for 30 minutes,

MV30(380): melt viscosity [Pa·sec] of the polyimide as measured underthe desired constant shearing stress in the range of from 0.1 to 1 [MPa]after causing the polyimide to melt by holding the polyimide at 380 [°C.] for 30 minutes.

[Measuring Method of Melt Viscosity]

Although no particular limitation is imposed on the measuring method ofa melt viscosity, the melt viscosity can be measured, for example, by aKoka-type flow tester (e.g., “CFT500A” manufactured by ShimadzuCorporation) under conditions of an orifice of 1.0 mm (diameter)×10 mm(length) and a load of 100 kgf.

It is known (from “Rheology Measuring Methods” compiled by the RheologyCommittee of the Society of Polymer Science, Japanese) that in thiscase, shearing stress (Tw) [Pa] is determined by calculating apparentshear stress against a nozzle wall and the value so calculated isexpressed by:

Tw=P×R/2Lc

where

P: extrusion pressure [Pa];

R: nozzle diameter/2 [cm]; and

Lc: nozzle length [cm].

The shear stress measured by this measuring method is, therefore, 0.245[MPa].

[Gel Time]

As another parameter which also indicates whether or not a melt flow isfeasible, gel time can be mentioned. The gel time of a resin at a giventemperature is represented by t which satisfies the following numericalformula [7]:

G′(t)=G″(t)  [7]

where

G′ (t): storage modulus of the resin as measured at the giventemperature and a constant frequency after an elapse of the time t[min]; and

G″ (t): loss modulus of the resin as measured at the given temperatureand the constant frequency after an elapse of the time t (min).

No limitation is imposed on the gel time, because upon measuring the geltime, the sample temperature and the measuring frequency must be changeddepending on the processing method and the properties of the resin. Inthe case of each polyimide in this application, however, the gel timemeasured at a constant sample temperature of 360° C. and 1 Hz maypreferably be 10 [min] or longer, with 20 [min] or longer being morepreferred.

No particular limitation is imposed on the measuring methods of thestorage modulus and loss modulus. As an example, however, they can bemeasured by a melt viscoelasticity meter (e.g., “RDS-II” manufactured byRheometrix Scientific F.E.) equipped with parallel plates (e.g., 25 mmdisposable).

[Preferred Structure of Crosslinkable-group-containing Polyimide—(3)]

More preferably, the crosslinkable-group-containing polyimide accordingto the present invention is a crosslinkable-group-containing polyimidecontaining molecule chains each of which has acrosslinkable-group-containing end at an end thereof and acrosslinkable-group-free end at an opposite end thereof. Although nolimitation is imposed on the content of the molecule-chains, theircontent may be preferably 0.2 mole % or higher, more preferably 1 mole %or higher, most preferably 5 mole % or higher.

The crosslinkable-group-containing polyimide—which is characterized inthat it contains molecule chains, each of which has acrosslinkable-group-containing end at an end thereof and acrosslinkable-group-free end at an opposite end thereof—may morepreferably be a crosslinkable-group-containing polyimide having thestructure represented by the chemical formula (2c). Although nolimitation is imposed on the content of the molecule chains in thepolyimide either, their content may be preferably 0.2 mole % or higher,more preferably 1 mole % or higher, most preferably 5 mole % or higher.

[Preferred Structure of Crosslinkable-group-containing Polyimide—(4)]

The crosslinkable-group-containing polyimide according to the presentinvention may preferably contain recurring structural units representedby the chemical formula (1) in the polyimide backbone.

[More Preferred Structure of Crosslinkable-group-containingPolyimide—(1)]

One of more preferred examples of the crosslinkable-group-containingpolyimide according to the present invention which has recurringstructural units represented by the chemical formula (1) ischaracterized in that 50 to 100 mole % of the recurring structural unitsare recurring structural units represented by the chemical formula (1a).

Among these, most preferred are crosslinkable-group-containingpolyimides 50 to 100 mole % of the recurring structural units of each ofwhich have one of the following structures:

[More Preferred Structure of Crosslinkable-group-containingPolyimide—(2)]

Another one of the more preferred examples of thecrosslinkable-group-containing polyimide according to the presentinvention which has recurring structural units represented by thechemical formula (1) is characterized in that 50 to 100 mole % of therecurring structural units are recurring structural units represented bythe chemical formula (1b).

Among these, most preferred are crosslinkable-group-containingpolyimides 50 to 100 mole % of the recurring structural units of each ofwhich have the following structure:

[More Preferred Structure of Crosslinkable-group-containingPolyimide—(3)]

A further one of the more preferred examples of thecrosslinkable-group-containing polyimide according to the presentinvention which has recurring structural units represented by thechemical formula (1) is characterized in that 50 to 100 mole % of therecurring structural units are recurring structural units represented bythe chemical formula (1c).

Among these, preferred are crosslinkable-group-containing polyimides 50to 100 mole % of the recurring structural units of each of which has thechemical formula (1c) in which X is an oxygen atom, and most preferredare crosslinkable-group-containing polyimides 50 to 100 mole % of therecurring structural units of each of which has a structure representedby:

[More Preferred Structure of Crosslinkable-group-containingPolyimide—(4)]

A still further one of the more preferred examples of thecrosslinkable-group-containing polyimide according to the presentinvention which has recurring structural units represented by thechemical formula (1) is characterized in that 50 to 100 mole % of therecurring structural units are recurring structural units represented bythe chemical formula (1e).

Among these, preferred are crosslinkable-group-containing polyimides 50to 100 mole % of the recurring structural units of each of which arerecurring structural units represented by the following formula (1d):

wherein X and R are groups to be indicated next, respectively, that is,

X represents a divalent linking group selected from the group consistingof a direct bond, a carbonyl group, a sulfone group, a sulfide group, anether group, an isopropylidene group and a hexafluoroisopropylidenegroup; and

R represents a tetravalent aromatic group selected from the groupconsisting of:

 wherein G represents a divalent aromatic group selected from the groupconsisting of a direct bond, a carbonyl group, a sulfone group, asulfide group, an ether group, an isopropylidene group, ahexafluoroisopropylidene group, a 3-oxyphenoxy group, a 4-oxyphenoxygroup, a 4′-oxy-4-biphenoxy group and a4-[1-(4-oxyphenyl)-1-methylethyl]phenoxy group, and a position of eachbond, said position being unspecified, is a para-position ormeta-position.

Among these, preferred are crosslinkable-group-containing polyimides 50to 100 mole % of the recurring structural units of each of which has thechemical formula (1d) in which Z2 is an oxygen atom, and most preferredare crosslinkable-group-containing polyimides 50 to 100 mole % of therecurring structural units of each of which has a recurring unitstructure represented by:

[Molecular Weight of Crosslinkable-group-containing Polyimide]

As a measure of the molecular weight of a crosslinkable-group-containingpolyimide, a logarithmic viscosity number is used.

[Logarismic Viscosity Number of Crosslinkable-group-containingPolyimide]

The logarithmic viscosity number of a crosslinkable-group-containingpolyimide is in a range of from 0.1 to 1.5 dL/g. A logarithmic viscositynumber smaller than 0.1 leads to a decrease in the molecular weightbetween crosslinking points and hence to substantial reductions inmechanical properties, while a logarithmic viscosity number higher than1.5 leads to an increase in melt viscosity and thus to a considerablereduction in melt moldability or formability. The preferred logarithmicviscosity number is in a range of from 0.2 to 1.2, with a range of from0.3 to 0.8 being more preferred, and a range of from 0.4 to 0.6 beingmost preferred.

[Measuring Method of Logarithmic Viscosity Number]

The above-described logarithmic viscosity number can be measuring in a9:1 by weight mixed solvent of p-chlorophenol and phenol, at a solutionviscosity of 0.5 g/100 mL and 35° C., by using, for example, aUbbellohde viscometer.

[Regularity When the Crosslinkable-group-containing Polyimide is aCopolymer]

When the crosslinkable-group-containing polyimide according to thepresent invention is a copolymer, a limitation may be imposed or may notbe imposed on the specific order or regularity of recurring units of twoor more kinds which make up the copolymer. Concerning the kind of thecopolymer, the copolymer can be of any one of random, alternating andblock structures.

[Production Process of Crosslinkable-group-containing Polyimide]

A detailed description will hereinafter be made of the process for theproduction of the crosslinkable-group-containing polyimide according tothe present invention. However, it should be borne in mind that nolimitation is imposed on the production process in the presentinvention.

[Raw Materials to be Used]

The crosslinkable-group-containing polyimide according to the presentinvention is generally obtained from the following raw materials:

(A) a diamine component;

(B) a tetracarboxylic acid dianhydride component;

(C) an end blocking agent having a crosslinkable group; and

(D) an end blocking agent having no crosslinkable group.

[Diamine Component]

The diamine component usable to obtain thecrosslinkable-group-containing polyimide according to the presentinvention can preferably be, but is not limited to, an aromatic diamine.

Examples of the diamine component can include:

a) Diamines containing one benzene ring:

p-phenylenediamine, and

m-phenylenediamine;

b) Diamines containing two benzene rings:

3,3′-diaminodiphenyl ether,

3,4′-diaminodiphenyl ether,

4,4′-diaminodiphenyl ether,

3,3′-diaminodiphenyl sulfide,

3,4′-diaminodiphenyl sulfide,

4,4′-diaminodiphenyl sulfide,

3,3′-diaminodiphenyl sulfone,

3,4′-diaminodiphenyl sulfone,

4,4′-diaminodiphenyl sulfone,

3,3′-diaminobenzophenone,

4,4′-diaminobenzophenone,

3,4′-diaminobenzophenone,

3,3′-diaminodiphenylmethane,

4,4′-diaminodiphenylmethane,

3,4′-diaminodiphenylmethane,

2,2-di(3-aminophenyl)propane,

2,2-di(4-aminophenyl)propane,

2-(3-aminophenyl)-2-(4-aminophenyl)propane,

2,2-di(3-aminophenyl)-1,1,1,3,3,3,-hexafluoropropane,

2,2-di(4-aminophenyl)-1,1,1,3,3,3,-hexafluoropropane,

2-(3-aminophenyl)-2-(4-aminophenyl)-1,1,1,3,3,3,-hexafluoropropane,

1,1-di(3-aminophenyl)-1-phenylethane,

1,1-di(4-aminophenyl)-1-phenylethane, and

1-(3-aminophenyl)-1-(4-aminophenyl)-1-phenylethane;

c) Diamines containing three benzene rings:

1,3-bis(3-aminophenoxy)benzene,

1,3-bis(4-aminophenoxy)benzene,

1,4-bis(3-aminophenoxy)benzene,

1,4-bis(4-aminophenoxy)benzene,

1,3-bis(3-aminobenzoyl)benzene,

1,3-bis(4-aminobenzoyl)benzene,

1,4-bis(3-aminobenzoyl)benzene,

1,4-bis(4-aminobenzoyl)benzene,

1,3-bis(3-amino-α,α-dimethylbenzyl)benzene,

1,3-bis(4-amino-α,α-dimethylbenzyl)benzene,

1,4-bis(3-amino-α,α-dimethylbenzyl)benzene,

1,4-bis(4-amino-α,α-dimethylbenzyl)benzene,

1,3-bis(3-amino-α,α-ditrifluoromethylbenzyl)-benzene,

1,3-bis(4-amino-α,α-ditrifluoromethylbenzyl)-benzene,

1,4-bis(3-amino-α,α-ditrifluoromethylbenzyl)-benzene,

1,4-bis(4-amino-α,α-ditrifluoromethylbenzyl)-benzene,

2,6-bis(3-aminophenoxy)benzonitrile, and

2,6-bis(3-aminophenoxy)pyridine;

d) Diamines containing four benzene rings:

4,4′-bis(3-aminophenoxy)biphenyl,

4,4′-bis(4-aminophenoxy)biphenyl,

bis[4-(3-aminophenoxy)phenyl]ketone,

bis[4-(4-aminophenoxy)phenyl]ketone,

bis[4-(3-aminophenoxy)phenyl]sulfide,

bis[4-(4-aminophenoxy)phenyl]sulfide,

bis[4-(3-aminophenoxy)phenyl]sulfone,

bis[4-(4-aminophenoxy)phenyl]sulfone,

bis[4-(3-aminophenoxy)phenyl]ether,

bis[4-(4-aminophenoxy)phenyl]ether,

2,2-bis[4-(3-aminophenoxy)phenyl]propane,

2,2-bis[4-(4-aminophenoxy)phenyl]propane,

2,2-bis[3-(3-aminophenoxy)phenyl]-1,1,1,3,3,3-hexafluoropropane, and

2,2-bis[4-(4-aminophenoxy)phenyl]-1,1,1,3,3,3-hexafluoropropane;

e) Diamines containing five benzene rings:

1,3-bis[4-(3-aminophenoxy)benzoyl]benzene,

1,3-bis[4-(4-aminophenoxy)benzoyl]benzene,

1,4-bis[4-(3-aminophenoxy)benzoyl]benzene,

1,4-bis[4-(4-aminophenoxy)benzoyl]benzene,

1,3-bis[4-(3-aminophenoxy)-α,α-dimethylbenzyl]benzene,

1,3-bis [4-(4-aminophenoxy)-α,α-dimethylbenzyl]benzene,

1,4-bis[4-(3-aminophenoxy)-α,α-dimethylbenzyl]benzene, and

1,4-bis[4-(4-aminophenoxy)-α,α-dimethylbenzyl]benzene;

f) Diamines containing six benzene rings:

4,4′-bis[4-(4-aminophenoxy)benzoyl]diphenyl ether,

4,4′-bis[4-(4-amino-α,α-dimethylbenzyl)phenoxy]benzophenone,

4,4′-bis[4-(4-amino-α,α-dimethylbenzyl)phenoxy]diphenyl sulfone, and

4,4′-bis[4-(4-aminophenoxy)phenoxy]diphenyl sulfone;

g) Diamines containing aromatic substituent group(s):

3,3′-diamino-4,4′-diphenoxybenzophenone,

3,3′-diamino-4,4′-dibiphenoxybenzophenone,

3,3′-diamino-4-phenoxybenzophenone, and

3,3′-diamino-4-biphenoxybenzophenone; and

h) Diamines containing a spirobiindane ring:

6,6′-bis(3-aminophenoxy)3,3,3′,3′-tetramethyl-1,1′-spirobiindane, and

6,6′-bis(4-aminophenoxy)3,3,3′,3′-tetramethyl-1,1-spirobiindane.

Also usable are diamines each of which is obtained by substituting someor all of the hydrogen atoms on one or more of the aromatic ring(s) ofthe corresponding one of the above-described diamines by a like numberof substituent group(s) selected from fluoro, methyl, methoxy,trifluoromethyl or trifluoromethoxy groups.

Further, these diamines are also usable after in place of some or all ofthe hydrogen atoms on one or more of the aromatic ring(s) of each of thediamines, a like number of ethynyl group(s), benzocyclobuten-4′-ylgroup(s), vinyl group(s), allyl group(s), cyano group(s), isocyanategroup(s), nitrilo group(s) and/or isopropenyl group(s), which can act ascrosslinking points, are introduced as substituent group (s), preferablyto an extent not impairing the moldability or formability. Moreover, oneor more of vinylene groups, vinylidene groups and ethynylidene groups,which can act as crosslinking points, can be incorporated into eachbackbone skeleton, rather than as substituent group(s), preferably to anextent not impairing the moldability or formability.

In addition, for the purpose of achieving improvements in ormodifications to performance, copolymerization can be conducted usingone or more aliphatic diamines, to an extent not impairing various goodphysical properties, together with the above-described diamine. Examplesof such aliphatic diamines can include:

i) Siloxanediamines:

1,3-bis(3-aminopropyl)tetramethyldisiloxane,

1,3-bis(4-aminobutyl)tetramethyldisiloxane,

α,ω-bis(3-aminopropyl)polydimethylsiloxane, and

α,ω-bis(3-aminobutyl)polydimethylsiloxane;

j) Ethyleneglycoldiamines:

bis(aminomethyl) ether,

bis(2-aminoethyl) ether,

bis(3-aminopropyl) ether,

bis(2-aminomethoxy)ethyl]ether,

bis[2-(2-aminoethoxy)ethyl]ether,

bis[2-(3-aminoprotoxy)ethyl]ether,

1,2-bis(aminomethoxy)ethane,

1,2-bis(aminoethoxy)ethane,

1,2-bis[2-(aminomethoxy)ethoxy]ethane,

1,2-bis[-2-(2-aminomethoxy)ethoxy]ethane,

ethylene glycol bis(3-aminopropyl) ether,

diethylene glycol bis(3-aminopropyl) ether, and

triethylene glycol bis(3-aminopropyl) ether;

k) Methylenediamines:

1,3-diaminopropane,

1,4-diaminobutane,

1,5-diaminopentane,

1,6-diaminohexane,

1,7-diaminoheptane,

1,8-diaminooctane,

1,9-diaminononane,

1,10-diaminodecane,

1,11-diaminoundecane, and

1,12-diaminododecane; and

l) Alicyclic diamines:

1,2-diaminocyclohexane,

1,3-diaminocyclohexane,

1,4-diaminocyclohexane,

1,2-di(2-aminoethyl)cyclohexane,

1,3-di(2-aminoethyl)cyclohexane,

1,4-di(2-aminoethyl)cyclohexane,

bis(4-aminocyclohexyl)methane,

2,6-bis(aminomethyl)bicyclo[2.2.1]heptane, and

2,5-bis(aminomethyl)bicyclo[2.2.1]heptane.

These diamines can be used either singly or in combination as needed.

[Preferred Diamine Components]

Among the above-exemplified diamine components, preferred diamines arethose represented by the chemical formula (4).

[More Preferred Diamine Components (1)]

Among the diamines represented by the chemical formula (4), diamines ofa more preferred type are those represented by the chemical formula(4c). When these more preferred diamine components are used, it isparticularly preferred to use them in a proportion of 50 to 100 mole %.

Usable examples of the diamines represented by the chemical formula (4c)can include:

1,3-bis(3-aminophenoxy)benzene,

1,3-bis(4-aminophenoxy)benzene,

1,4-bis(3-aminophenoxy)benzene,

1,4-bis(4-aminophenoxy)benzene,

1,3-bis(3-aminobenzoyl)benzene,

1,3-bis(4-aminobenzoyl)benzene,

1,4-bis(3-aminobenzoyl)benzene,

1,4-bis(4-aminobenzoyl)benzene,

1,3-bis(3-amino-α,α-dimethylbenzyl)benzene,

1,3-bis(4-amino-α,α-dimethylbenzyl)benzene,

1,4-bis(3-amino-α,α-dimethylbenzyl)benzene,

1,4-bis(4-amino-α,α-dimethylbenzyl)benzene,

1,3-bis(3-amino-α,α-ditrifluoromethylbenzyl)-benzene,

1,3-bis(4-amino-α,α-ditrifluoromethylbenzyl)-benzene,

1,4-bis(3-amino-α,α-ditrifluoromethylbenzyl)-benzene,

1,4-bis(4-amino-α,α-ditrifluoromethylbenzyl)-benzene,

2,6-bis(3-aminophenoxy)benzonitrile, and

2,6-bis(3-aminophenoxy)pyridine.

Among these, particularly preferred diamines are:

1,3-bis(3-aminophenoxy)benzene,

1,3-bis(4-aminophenoxy)benzene,

1,4-bis(3-aminophenoxy)benzene,

1,4-bis(4-aminophenoxy)benzene,

1,3-bis(3-aminobenzoyl)benzene,

1,3-bis(4-aminobenzoyl)benzene,

1,4-bis(3-aminobenzoyl)benzene, and

1,4-bis(4-aminobenzoyl)benzene; and

the most preferred diamine is:

1,3-bis(4-aminophenoxy)benzene.

[More Preferred Diamine Components (2)]

Among the diamines represented by the chemical formula (4), diamines ofanother more preferred type are those represented by the chemicalformula (4d). When these more preferred diamine components are used, itis particularly preferred to use them in a proportion of 50 to 100 mole%.

Examples of the diamines represented by the chemical formula (4d) caninclude:

4,4′-bis(3-aminophenoxy)biphenyl,

bis[4-(3-aminophenoxy)phenyl]ketone,

bis[4-(3-aminophenoxy)phenyl]sulfide,

bis[4-(3-aminophenoxy)phenyl]sulfone,

bis[4-(3-aminophenoxy)phenyl]ether,

2,2-bis[4-(3-aminophenoxy)phenyl]propane, and

2,2-bis[3-(3-aminophenoxy)phenyl]-1,1,1,3,3,3-hexafluoropropane.

Among these, the particularly preferred diamine component is:

4,4′-bis(3-aminophenoxy)biphenyl.

[Tetracarboxylic Acid Dianhydride Component]

No limitation is imposed on the tetracarboxylic acid dianhydridecomponent employed to obtain the polyimide according to the presentinvention, and the following illustrative tetracarboxylic aciddianhydrides can be used either singly or in combination as desired:

pyromellitic dianhydride,

3,3′4,4′-biphenyltetracarboxylic acid dianhydride,

3,3′4,4′-benzophenonetetracarboxylic acid dianhydride,

bis(3,4-dicarboxyphenyl)ether dianhydride,

bis(3,4-dicarboxyphenyl)sulfide dianhydride,

bis(3,4-dicarboxyphenyl)sulfone dianhydride,

2,2-bis(3,4-dicarboxyphenyl)propane dianhydride,

2,2-bis(3,4-dicarboxyphenyl)-1,1,1,3,3,3-hexafluoropropane dianhydride,

1,3-bis(3,4-dicarboxyphenoxy)benzene dianhydride,

1,4-bis(3,4-dicarboxyphenoxy)benzene dianhydride,

4,4′-bis(3,4-dicarboxyphenoxy)biphenyl dianhydride,

2,2-bis[(3,4-dicarboxyphenoxy)phenyl]propane dianhydride,

2,3,6,7-naphthalenetetracarboxylic acid dianhydride,

1,4,5,8-naphthalenetetracarboxylic acid dianhydride,

ethylenetetracarboxylic acid dianhydride,

butanetetracarboxylic acid dianhydride,

cyclopentanecarboxylic acid dianhydride,

2,2′,3,3′-bezophenonetetracarboxylic acid dianhydride,

2,2′,3,3′-biphenyltetracarboxylic acid dianhydride,

2,2-bis(2,3-dicarboxyphenyl)propane dianhydride,

2,2-bis(2,3-dicarboxyphenyl)-1,1,1,3,3,3-hexafluoropropane dianhydride,

bis(2,3-dicarboxyphenyl)ether dianhydride,

bis(2,3-dicarboxyphenyl)sulfide dianhydride,

bis(2,3-dicarboxyphenyl)sulfone dianhydride,

1,3-bis(2,3-dicarboxyphenoxy)benzene dianhydride,

1,4-bis(2,3-dicarboxyphenoxy)benzene dianhydride, and

1,2,5,6-naphthalenetettacarboxylic acid dianhydride.

In combination with all the kinds of the above-described tetracarboxylicacid dianhydride components, diamines in each of which some or all ofthe hydrogen atoms on one or more of the aromatic ring(s) have beenreplaced by a like number of substituent groups selected from fluorogroups, methyl groups, methoxy groups, trifluoromethyl groups and/ortrifluoromethoxy groups can be used.

Further, the above-described diamines are also usable after in place ofsome or all of the hydrogen atoms on one or more of the aromatic ring(s)of each of the diamines, a like number of ethynyl group(s),benzocyclobuten-4′-yl group(s), vinyl group(s), allyl group(s), cyanogroup(s), isocyanate group(s), nitrilo group(s) and/or isopropenylgroup(s), which can act as crosslinking points, are introduced assubstituent group(s), preferably to an extent not impairing themoldability or formability. Moreover, one or more of vinylene groups,vinylidene groups and ethynylidene groups, which can act as crosslinkingpoints, can be incorporated into each backbone skeleton, rather than assubstituent group(s), preferably to an extent not impairing themoldability or formability.

These tetracarboxylic acid dianhydride components can be used eithersingly or in combination as needed.

Depending on the production process, tetracarboxylic acidmonoanhydrides, tetracarboxylic compounds other than anhydrides, ortheir derivatives such as salts can also be used as desired instead ofsuch dianhydrides.

[Preferred Tetracarboxylic Acid Dianhydride Components]

Among the above-exemplified tetracarboxylic acid dianhydride components,preferred tetracarboxylic acid dianhydrides are tetracarboxylic aciddianhydrides represented by the chemical formula (5). Specific examplescan include:

pyromellitic dianhydride,

3,3′4,4′-biphenyltetracarboxylic acid dianhydride,

3,3′4,4′-benzophenonetetracarboxylic acid dianhydride,

bis(3,4-dicarboxyphenyl)ether dianhydride,

bis(3,4-dicarboxyphenyl)sulfide dianhydride,

bis(3,4-dicarboxyphenyl)sulfone dianhydride,

2,2-bis(3,4-dicarboxyphenyl)propane dianhydride,

2,2-bis(3,4-dicarboxyphenyl)-1,1,1,3,3,3-hexafluoropropane dianhydride,

1,3-bis(3,4-dicarboxyphenoxy)benzene dianhydride,

1,4-bis(3,4-dicarboxyphenoxy)benzene dianhydride,

4,4′-bis(3,4-dicarboxyphenoxy)biphenyl dianhydride,

2,2-bis[(3,4-dicarboxyphenoxy)phenyl]propane dianhydride,

2,3,6,7-naphthalenetetracarboxylic acid dianhydride, and

1,4,5,8-naphthalenetetracarboxylic acid dianhydride,

[More Preferred Tetracarboxylic Acid Dianhydride Components]

Among the diamines represented by the chemical formula (5), morepreferred tetracarboxylic acid dianhydrides can be:

pyromellitic dianhydride,

3,3′4,4′-biphenyltetracarboxylic acid dianhydride,

3,3′4,4′-benzophenonetetracarboxylic acid dianhydride,

bis(3,4-dicarboxyphenyl)ether dianhydride,

bis(3,4-dicarboxyphenyl)sulfide dianhydride,

bis(3,4-dicarboxyphenyl)sulfone dianhydride,

2,2-bis(3,4-dicarboxyphenyl)-1,1,1,3,3,3-hexafluoropropane dianhydride,and

1,4-bis(3,4-dicarboxyphenoxy)benzene dianhydride.

One or more tetracarboxylic acid dianhydride components selected fromthe group consisting of these more preferred tetracarboxylic aciddianhydrides can be used.

[Amount of the Tetracarboxylic Acid Dianhydride Component to be Used]

The total amount of the tetracarboxylic acid dianhydride is from 0.8 to1.25 moles per mole of the total amount of the diamine component to beused. By changing this molar ratio, the molecular weight of theresulting crosslinkable-group-containing polyimide can be controlled. Amolar ratio lower than 0.8 cannot provide a molecular weight high enoughto bring about sufficient properties, while a molar ratio higher than1.25 leads to a reduction in the molecular weight.

When a dicarboxylic acid or its anhydride or derivative is used as anend blocking agent, the total amount of the tetracarboxylic aciddianhydride component may be preferably from 0.8 to 0.99, morepreferably from 0.85 to 0.97 per mole of the total amount of the diaminecomponent to be used, with a range of from 0.90 to 0.95 being mostpreferred.

In this case, use of a tetracarboxylic acid dianhydride component beyondthe above range results in insufficient end blocking, thereby causingadverse effects on the thermal stability and moldability or formability.

When a monoamine is used as an end blocking agent, the total amount ofthe tetracarboxylic acid dianhydride component to be used may bepreferably from 1.01 to 1.25 moles, more preferably from 1.05 to 1.20moles per mole of the total amount of the diamine component to be used,with a range of from 1.07 to 1.15 being most preferred.

In this case, use of a tetracarboxylic acid dianhydride component belowthe above range results in insufficient end blocking, thereby causingadverse effects on the thermal stability and moldability or formability.

The control of the molecular weight of thecrosslink-able-group-containing polyimide can be achieved by adjustingthe molar ratio of the total amount of the tetracarboxylic aciddianhydride component to the total amount of the diamine component to beused. Depending on the polymerization process, the kind of the solvent,the polymerization time, the polymerization time and the like, however,their optimum charging ratio may differ in some instances.

[Crosslinkable-group-containing End Blocking Agent]

No limitation is imposed on the crosslinkable-group-containing endblocking agent to be used in the present invention.Crosslinkable-group-containing end blocking agents of various kinds areusable depending on the synthesis process of the polyimide, includingmonoamines and dicarboxylic acid anhydrides as representative examples.As crosslinkable group(s) to be introduced, a variety of knowncrosslinkable groups can be selected in accordance with molding orforming conditions.

Although no limitation is imposed on the kind of the crosslinkablegroup(s), representative examples can include ethynyl group,benzocyclobuten-4′-yl group, vinyl group, allyl group, cyano group,isocyanate group, nitrilo group, amino group, isopropenyl group,vinylene group, vinylidene group, and ethynylidene group.

[Preferred Crosslinkable-group-containing End Blocking Agents]

The crosslinkable-group-containing end blocking agent usable in thepresent invention may preferably be a crosslinkable-group-containingdicarboxylic acid anhydride. Depending on the synthesis process, itsring-opened product or its derivative such as its salt can be used.

Examples can include:

unsaturated aliphatic dicarboxylic acid anhydrides represented by maleicanhydride and nadic anhydride,

ethynyl-containing dicarboxylic acid anhydrides, represented by1-phenyl-2-(3,4-dicarboxyphenyl)acetylene anhydride, ethynylphthalicanhydride and 6-ethynyl-2,3-dicarboxynaphthalene anhydride, and

phthalic acid anhydrides or 2,3-dicarboxynaphthalene anhydridederivatives containing a benzocyclo-buten-4′-yl group, vinyl group,allyl group or isopropenyl group.

[End Blocking Agents Containing More Preferred Crosslinking Group]

The crosslinkable group contained in the structure may preferably be anethynyl group, with one containing a phenylethynylbenzene structurebeing more preferred.

[End Blocking Agents Containing Still More Preferred Crosslinking Group]

The crosslinkable-group-containing end blocking agent usable in thepresent invention may more preferably be a dicarboxylic acid anhydriderepresented by the chemical formula (3a).

Specific examples are:

1-phenyl-2-(3,4-dicarboxyphenyl)acetylene anhydride,

1-phenyl-2-(3-(3,4-dicarboxyphenoxy)phenyl)acetylene anhydride,

1-phenyl-2-(3-(3,4-dicarboxyphenylcarbonyl)phenyl)acetylene anhydride,

1-phenyl-2-(3-(3,4-dicarboxyphenylsulfonyl)phenyl)acetylene anhydride,

1-phenyl-2-(3-(3,4-dicarboxyphenylsulfinyl)phenyl)acetylene anhydride,

1-phenyl-2-(3-(2-(3,4-dicarboxyphenyl)isopropanyl)phenyl)acetyleneanhydride,

1-phenyl-2-(3-(1,1,1,3,3,3-hexafluoro-2-(3,4-dicarboxyphenyl)isopropanyl)phenyl)acetyleneanhydride,

1-phenyl-2-(3-(3,4-dicarboxyphenyl)phenyl)acetylene anhydride,

1-phenyl-2-(4-(3,4-dicarboxyphenyl)phenyl)acetylene anhydride,

1-phenyl-2-(4-(3,4-dicarboxyphenylcarbonyl)phenyl)acetylene anhydride,

1-phenyl-2-(4-(3,4-dicarboxyphenylsulfonyl)phenyl)acetylene anhydride,

1-phenyl-2-(4-(3,4-dicarboxyphenylsulfinyl)phenyl)acetylene anhydride,

1-phenyl-2-(4-(2-(3,4-dicarboxyphenyl)isopropanyl)phenyl)acetyleneanhydride,

1-phenyl-2-(4-(1,1,1,3,3,3-hexafluoro-2-(3,4-dicarboxyphenyl)isopropanyl)-phenyl)acetyleneanhydride,

1-phenyl-2-(4-(3,4-dicarboxyphenyl)phenyl)acetylene anhydride, and

2 3-dicarboxy-6-phenylethynyl)naphthalene anhydride.

The above-described, crosslinkable-group-containing end blocking agentscan be used either singly or in combination. End blocking agents in eachof which some or all of the hydrogen atoms on one or more of thearomatic ring(s) have been replaced by a like number of substituentgroups selected from fluoro groups, methyl groups, methoxy groups,trifluoromethyl groups and/or trifluoromethoxy groups can also be used.

Further, the above-described, crosslinkable-group-containingdicarboxylic acid anhydrides are also usable after in place of some orall of the hydrogen atoms on one or more of the aromatic ring(s) of eachof the anhydrides, a like number of ethynyl group(s),benzocyclobuten-4′-yl group(s), vinyl group(s), allyl group(s), cyanogroup(s), isocyanate group(s), nitrilo group(s) and/or isopropenylgroup(s), which can act as crosslinking points, are introduced assubstituent group(s), preferably to an extent not impairing themoldability or formability.

[Most Preferred, Crosslinkable-group-containing End Blocking Agent]

Among the above-described, crosslinkable-group-containing end blockingagents, 1-phenyl-2-(3,4-dicarboxyphenyl) acetylene anhydride is mostpreferred from the standpoint of the properties and practicalapplication of the crosslinkable-group-containing polyimide according tothe present invention.

[Crosslinkable-group-free End Blocking Agent]

No limitation is imposed on the crosslinkable-group-free end blockingagent usable in the present invention. Depending on the synthesisprocess of the polyimide, a variety of crosslinkable-group-free endblocking agents can be used. Representative examples are monoamines ordicarboxylic acid anhydrides. It is essential that a group, which mayfunction as a crosslinking group under conditions of a molding orforming step or post-treatment step, is not contained in the structure.Examples of the crosslinking group can include ethynyl group,benzocyclobuten-4′-yl group, vinyl group, allyl group, cyano group,isocyanate group, nitrilo group, amino group, isopropenyl group,vinylene group, vinylidene group, and ethynylidene group.

[Preferred, Crosslinkable-group-free End Blocking Agents]

The crosslinkable-group-free end blocking agent usable in the presentinvention may preferably be a dicarboxylic acid anhydride. Depending onthe synthesis process, its ring-opened product or its derivative such asits salt can be used.

Specific examples are:

phthalic anhydride,

4-phenylphthalic anhydride,

4-phenoxyphthalic anhydride,

4-phenylsulfinylphthallic acid,

4-phenylcarbonylphthalic acid,

4-(2-phenylisopropyl)phthalic anhydride,

4-(1,1,1,3,3,3-hexafluoro-2-phenylisopropyl)phthalic anhydride,

2,3-naphthalenedicarboxylic anhydride, and

1,8-naphthalenedicarboxylic anhydride.

The above-described dicarboxylic acid anhydrides can be used eithersingly or in combination. Diamines in each of which some or all of thehydrogen atoms on one or more of the aromatic ring(s) have been replacedby a like number of substituent groups selected from fluoro groups,methyl groups, methoxy groups, trifluoromethyl groups and/ortrifluoromethoxy groups can also be used.

[Most Preferred, Crosslinkable-group-free End Blocking Agent]

Among the above-described dicarboxylic acid anhydrides, phthalic acid ismost preferred from the standpoint of the properties and practicalapplication of the crosslinkable-group-containing polyimide according tothe present invention.

[Molar ratio of the Crosslinkable-group-containing End Blocking Agent tothe Crosslinkable-group-free End Blocking Agent]

No limitation is imposed on the molar ratio of thecrosslinkable-group-containing blocking agent to thecrosslinkable-group-free blocking agent insofar as the ends of thesynthesized crosslinkable-group-containing polyimide satisfy theconditions that “the molecule ends have crosslinking groups at 1 to 80mole % thereof”. Preferably, however, their molar ratio falls within thefollowing range:

1/99≦[E1]/[E2]≦80/20

where

[E1]: the molar quantity of the used crosslinkable-group-containingblocking agent; and

[E2]: the molar quantity of the used crosslinkable-group-free blockingagent ends.

If the value of [E1]/[E2] falls short of this range and is smaller than1/99, no sufficient crosslinking density can be achieved, leading toinsufficient improvements in chemical resistance, heat resistance andmechanical properties. If the value of [E1]/[E2] is greater than 80/20,on the other hand, a sufficient crosslinking density is available, butupon melt molding or forming, a substantial viscosity increase takesplace so that the melt molding or forming becomes infeasible.

The range of the [E1]/[E2] value has to be chosen appropriatelydepending on molding or forming conditions. In general, however, thepreferred range is:

5/95≦[E1]/[E2]≦70/30,

and the more preferred range is:

10/90≦[E1]/[E2]≦70/30.

The still more preferred range varies depending on the molding orforming process. For example, in a batchwise molding or forming process,such as compression molding, that involves residence in a molten state,the still more preferred range is:

30/70≦[E1]/[E2]≦70/30,

and the most preferred range is:

 40/60≦[E1]/[E2]≦60/40.

For example, in a molding or forming process, such as injection moldingor extrusion, that involves residence in a molten state and requires acontinuous operation, the preferred range is:

10/90≦[E1]/[E2]≦50/50,

and the most preferred range is:

20/80≦[E1]/[E2]≦40/60.

For example, in a molding or forming process that does not involve muchresidence in a molten states the preferred range is:

20/80≦[E1]/[E2]≦60/40,

and the most preferred range is:

30/70≦[E1]/[E2]≦50/50.

[Amount of the End Blocking Agent to be Used]

No limitation is imposed on the amount of the end blocking agent to beused, insofar as the conditions that the ends of the synthesizedcrosslinkable-group-containing polyimide satisfy the conditions that“the molecule ends have crosslinking groups at 1 to 80 mole % thereof”.

However, the end blocking agent may be used in an amount that satisfiespreferably the following range:

([Dc]−[Ma])/([Da]−[Tc])>2,

more preferably the following range:

20>([Dc]−[Ma])/([Da]−[Tc])>3

where

[Da]: total amount of the diamine component (mol),

[Tc]: total amount of the tetracarboxylic acid dianhydride component (orits ring-opened product or derivative) (mol),

[Ma]: total amount of the monoamine component to be used as an endblocking agent (mol), and

[Dc]: total amount of the dicarboxylic acid anhydride component (or itsring-opened product or derivative) to be used as an end blocking agent(mol).

If the value of ([Dc]−[Ma])/([Da]−[Tc]) falls short of this range and issmaller than it, no sufficient blocking of molecule ends is feasible,resulting in deteriorations in thermal stability, thermal oxidationstability, and moldability or formability. If the value exceeds theabove range, on the other hand, it becomes difficult to control themolecular weight and also to wash off any extra portion of the endblocking agent.

[Production Process of the Crosslinkable-group-containing Polyimide]

The polyimide can be obtained by providing the above-described rawmaterials and conducting polymerization and imidation by known methods.Although no limitation is imposed on the production process, thepolymerization is generally conducted in a solvent.

Examples of the process can generally include:

A) a process which comprises stirring a diamine component and atetracarboxylic acid dianhydride component in a solvent to obtain acrosslinkable-group-containing polyamic acid and then thermally orchemically conducting its dehydrating imidation, and

B) a direct polymerization process which comprises directly heating adiamine component and a tetracarboxylic acid dianhydride component in aform dissolved or suspended in a solvent such that dehydrating imidationis thermally effected.

[Polymerization Solvent]

Examples of the solvent can include:

m) Phenol solvents:

Phenol, o-chlorophenol, m-chlorophenol, p-chlorophenol, o-cresol,m-cresol, p-cresol, 2,3-xylenol, 2,4-xylenol, 2,5-xylenol, 2,6-xylenol,3,4-xylenol, and 3,5-xylenol;

n) Aprotonic amide solvents:

N,N-Dimethylformamide, N,N-dimethylacetamide, N,N-diethylacetamide,N-methyl-2-pyrrolidone, 1,3-dimethyl-2-imidazolidine,N-methylcaprolactam, and hexamethylphosphorotriamide;

o) Ether solvents:

1,2-Dimethoxyethane, bis(2-methoxyethyl)ether,1,2-bis(2-methoxyethoxy)ethane, tetrahydrofuran,bis[2-(2-methoxyethoxy)ethyl]ether, and 1,4-dioxane;

p) Amine solvents:

Pyridine, quinoline, isoquinoline, α-picoline, β-picoline, γ-picoline,isophorone, piperidine, 2,4-lutidine, 2,6-lutidine, trimethylamine,triethylamine, tripropylamine, and tributylamine; and

q) Other solvents:

Dimethyl sulfoxide, dimethyl sulfone, diphenyl ether, sulphorane,diphenyl sulfone, tetramethylurea, anisole, and water.

These solvents can be used either singly or in combination. Each ofthese solvents can also be used by mixing it with one or more ofsolvents to be described subsequently herein under r), s), t) and u).When used as a mixture, it is not absolutely necessary to choosesolvents in such a combination that allows the solvents to be mutuallydissolved at a desired ratio, and no problem or inconvenience ariseseven if they cannot be mixed or their mixture is not homogeneous.

[Polymerization Concentration]

Absolutely no limitation is imposed on the concentration at whichpolymerization is to be conducted in such a solvent. Expressing theproportion of the total weight of the whole diamine component and thewhole tetracarboxylic acid dianhydride component in terms of percentageon the basis of the total weight of the whole solvent, the whole diaminecomponent and the whole tetracarboxylic acid dianhydride component, thepreferred polymerization concentration is from 5 to 50%, with 10 to 30%being more preferred.

[Charging Order]

No limitation is imposed on the order in which the diamine component,the tetracarboxylic acid dianhydride component and the end blockingagent are charged when the diamine component, the tetracarboxylic aciddianhydride component or the end blocking agent consists of two or morekinds of diamines, dianhydrides or blocking agents, they can be added inan arbitrary order. It is also discretionary to add each component oragent at once or in portions.

[Polymerization Conditions]

No particular limitation is imposed on the polymerization temperature,polymerization time or polymerization pressure. Known conditions can beapplied.

The polymerization temperature may generally be in a range of from −10°C. to 10° C. in the case of the polymerization of thecrosslinkable-group-containing polyamic acid, and is a range of from 50°C. to 250° C. in the case of the imidation. The reaction time maygenerally be from 1 to 48 hours, although it differs depending on thekinds of the monomers to be used, the kind of the solvent to be employedor the kind of the reaction temperature to be employed. Further, as thereaction pressure, atmospheric pressure is sufficient.

[Logarithmic Viscosity Number of Crosslinkable-group-containing PolyamicAcid]

When polymerization is conducted through acrosslink-able-group-containing polyamic acid, the logarithmic viscositynumber of the crosslinkable-group-containing polyamic acid maypreferably be in a range of from 0.1 to 2.0 dL/g (as measured at aconcentration of 0.5 g/dL and 35° C. in N,N-dimethylacetamide). Alogarithmic viscosity number smaller than 0.1 leads to a decrease in themolecular weight between crosslinking points so that mechanicalproperties are lowered significantly, whereas a logarithmic viscositynumber greater than 2.0 leads to an increase in melt viscosity so thatmelt moldability or formability is reduced substantially. The preferredlogarithmic viscosity number is in a range of from 0.3 to 1.2, with arange of from 0.4to 0.7 being more preferred.

[Chemical Imidation]

Chemical imidation is a process to chemically effect dehydration byreacting the crosslinkable-group-containing polyamic acid with adehydrating agent having hydrolytic ability.

Usable examples of the dehydrating agent can include aliphaticcarboxylic acid anhydrides represented by acetic anhydride andtrifluoroacetic anhydride; phosphoric acid anhydrides represented bypolyphosphoric acid and phosphorus pentoxide; mixed acid anhydrides ofthese acids; and acid chlorides led by chloromethanesulfonic acid,phosphorus pentoxide and thionyl chloride. These dehydrating agents canbe used either singly or in combination. These dehydrating agents can beused in an amount of 2 to 10 moles, preferably 2.1 to 4 moles, per moleof the whole amount of the diamine component to be used.

Further, chemical imidation can also be conducted in the presence of abase catalyst. As the base catalyst so used, the amine solventsmentioned above under p) can be mentioned. In addition, organic basessuch as imidazole, N,N-dimethylaniline and N,N-diethylaniline as well asinorganic bases such as potassium hydroxide, sodium hydroxide, potassiumcarbonate, sodium carbonate, potassium hydrogencarbonate and sodiumhydrogencarbonate can be mentioned. These catalysts can be used in anamount of from 0.001 to 0.50 mole, preferably from 0.05 to 0.2 mole, permole of the whole amount of the diamine component to be used.

No particular limitation is imposed on the reaction temperature,reaction time and reaction pressure for the chemical imidation process,and known conditions can be applied. Described specifically, thereaction temperature may preferably be from −10° C. to around 120° C.,with a range of from around room, temperature to 70° C. being morepreferred. It is room temperature that is most preferable and practicalfrom the standpoint of practice. On the other hand, the reaction timemay preferably be from about 1 to 24 hours although it differs dependingon the kind of the solvent to be used and other reaction conditions.More preferably, the reaction time may be from 2 to around 10 hours. Asthe reaction pressure, atmospheric pressure is sufficient. As theatmosphere, air, nitrogen, helium, neon or argon is usable, and noparticular limitation is imposed thereon. Preferably, however, nitrogenor argon which is an inert gas is chosen.

[Thermal Imidation]

Thermal imidation can be achieved by heating polyamic acid or itssolution generally to 100° C. to 300° C.

The thermal imidation can also conducted in the concurrent presence of asimilar base catalyst as that employed in the chemical imidationprocess.

No particular limitation is imposed on the reaction temperature,reaction time and reaction pressure for the thermal imidation process,and known conditions can be applied. Described specifically, as thereaction temperature, 80° C. to around 400° C. can be used, with a rangeof from 100° C. to around 300° C. being preferred. On the other hand,the reaction time may preferably be from 0.5 to 24 hours although itdiffers depending on the kind of the solvent to be used and otherreaction conditions. As the reaction pressure, atmospheric pressure issufficient. As the atmosphere, air, nitrogen, helium, neon or argon isusable, and no particular limitation is imposed thereon. Preferably,however, nitrogen or argon which is an inert gas is chosen.

[Combined Use of Chemical Imidation and Thermal Imidation]

Chemical imidation and thermal imidation can be used in combination.

Illustrative are:

A) a process in which heating is also conducted at the same time uponpractice of the above-described chemical imidation process, and

B) a process in which upon conducting the above-described thermalimidation process, a dehydrating agent useful in chemical imidation iscaused to exist concurrently.

[Direct Polymerization Process]

The term “direct polymerization process” as used herein means a processwhich comprises directly heating a diamine component and atetracarboxylic acid dianhydride component in a form dissolved orsuspended in a solvent such that dehydrating imidation is thermallyeffected. This direct polymerization is achieved by conductingpolymerization and imidation in a solvent in a similar manner as inthermal imidation.

Like the chemical imidation process, the direct polymerization processcan also be conducted in the concurrent presence of a base catalyst.Usable base catalysts and their amount to be used are the same as thosedescribed above in connection with the chemical imidation process.

Further, to take out of the system water which is to be formed by thedehydrating imidation reaction, it is also possible to make anothersolvent exist at the same time. Solvents which are usable here caninclude:

r) benzene, toluene, o-xylene, m-xylene, p-xylene, chlorobenzene,o-dichlorobenzene, m-dichlorobenzene, p-dichlorobenzene, bromobenzene,o-dibromobenzene, m-dibromobenzene, p-dibromobenzene, o-chlorotoluene,m-chlorotoluene, p-chlorotoluene, o-bromotoluene, m-bromotoluene, andp-bromotoluene.

These solvents can be used either singly or in combination. Each ofthese solvents can also be used by further mixing it with one or more ofthe solvents described above under m) to q) and the solvents to bedescribed subsequently under s) to u). When used as a mixture, it is notabsolutely necessary to choose solvents in such a combination thatallows the solvents to be mutually dissolved at a desired ratio, and noproblem or inconvenience arises even if they cannot be mixed or theirmixture is not homogeneous. Absolutely no limitation is imposed on theamount of the dehydrating agent to be used.

No particular limitation is imposed on the reaction temperature,reaction time and reaction pressure, and known conditions can beapplied. Described specifically, as the reaction temperature, 100° C. toaround 300° C. can be applied, with a range of from 120° C. to around250° C. being preferred. On the other hand, the reaction time maygenerally be from 0.5 hour to 24 hours although it differs depending onthe kind of the solvent to be used and other reaction conditions. As thereaction pressure, atmospheric pressure is sufficient. As theatmosphere, air, nitrogen, helium, neon or argon is usable, and noparticular limitation is imposed thereon. Preferably, however, nitrogenor argon which is an inert gas is chosen.

[Treatment of the Crosslinkable-group-containing Polyimide]

The crosslinkable-group-containing polyimide can be improved in chemicalresistance, heat resistance, mechanical properties and the like bysubjecting it to intermolecular crosslinking through its treatmentduring or after its molding or forming.

Conditions for such a crosslinking reaction are not limited and can beset as desired. Further, these conditions significantly vary dependingon the kind and quantity of crosslinkable groups to be used.

When crosslinkable-group-containing molecule ends are represented by thechemical formula (2a), for example, the preferred crosslinking method isheat treatment, and by the heat treatment, carbon-carbon triple bondsare thermally caused to react so that crosslinks are formed betweenmolecular chains.

[Conditions for the Heat Treatment]

When crosslinkable-group-containing molecule ends are represented by thechemical formula (2a), the temperature, time and pressure of the heattreatment are not particularly limited, and are determined depending onproperties required for a crosslinked thermoplastic polyimide to beobtained. As the temperature of the heat treatment, 250° C. to around450° C., preferably 300° C. to around 400° C. can be applied, with 330°C. to around 380° C. being most preferred from the standpoint ofpractice. At a temperature lower than 250° C. the crosslinking reactionhardly takes, while at a temperature higher than 450° C., polyimidebackbones undergo modifications so that their properties cannot beobtained sufficiently.

Although the time of the heat treatment differs depending on the otherconditions for the heat treatment, it may be preferably 0.1 hour orlonger, more preferably 0.2 hour or longer, and the most preferred timeis 1 hour or longer.

A heat treatment time shorter than this time results in an insufficientcrosslinking density, thereby practically failing to observeimprovements in physical properties.

On the other hand, an excessively long crosslinking time isdisadvantageous from the standpoint of the process efficiency, anddepending on the backbone structure, there is a potential problem ofmodifications. The upper limit of a preferred heat treatment time is 100hours.

As the pressure for the heat treatment, atmospheric temperature issufficient. If necessary, however, it is also possible to adopt such aprocess that heat treatment is effected while conducting degasficationor the like under elevated pressure.

As the atmosphere, air, nitrogen, helium, neon or argon is usable, andno particular limitation is imposed thereon. Preferably, however,nitrogen or argon which is an inert gas is chosen.

[Heat Treatment Method]

The heat treatment method differs depending on the form of acrosslinkable-group-containing polyimide, and no limitation is imposedthereon. When a crosslinkable-group-containing polyimide obtained, forexample, in the form of powder or granules is used, examples of its heattreatment method can include:

A) to subject it, as is, to heat treatment;

B) to apply melt molding or forming to obtain a molded or formed productshaped as desired, and then to subject the molded or formed product toheat treatment;

C) to simultaneously conduct heat treatment while applying melt moldingor forming; and

D) to conduct its heat treatment, as is, to an intermediate extent, thento apply melt molding or forming to obtain a molded or formed productshaped as desired, and thereafter to subject the molded or formedproduct to heat treatment again.

As their applications, the followings are possible, respectively:

A) as a crosslinked thermoplastic polyimide is obtained in the form ofpowder or granules, it can be added, as is, as a filler to other resinsor can be formed, as is, into a molded product by sinter molding;

B) all general melt molding or forming;

C) Forming of films or sheets especially by pressing, and their use asadhesives; and

D) All general melt molding or forming, especially forming of films orsheets by pressing and their use as adhesives.

[Treatment Methods Other Than Heat Treatment]

Instead of heat treatment, various energy sources which inducecrosslinking can be used. Illustrative are irradiations of visiblelight, ultraviolet rays, ultraviolet rays, radiations such as α-, β- andγ-rays, electron beams, and X-rays, and further, plasma treatment anddoping treatment.

[Crosslinking Promoter and Crosslinking Retarder]

A crosslinking promoter or crosslinking retarder can be used to controlthe crosslinking reaction velocity. No limitation is imposed on thecrosslinking promoter or crosslinking retarder. A compound which, whenused together with a crosslinkable-group-containing polyimide, cansub-stantially promote or retard the crosslinking reaction, can be usedin combination as desired.

It is possible to add, for example, a metal catalyst containing gallium,germanium, indium or lead, a transition metal catalyst containingmolybdenum, manganese, nickel, cadmium, cobalt, chromium, iron, copper,tin, platinum or the like, a phosphorus compound, a silicon compound, anitrogen compound, or a sulfur compound.

[Solution or Suspension Containing a Crosslinkable-group-containingPolyimide]

A solution or suspension which contains acrosslink-able-group-containing polyimide according to the presentinvention can be used in a pre-treatment step of shaping or melt moldingor forming of the crosslinkable-group-containing polyimide.

The solution or suspension can be prepared using a solvent which doesnot cause a chemical reaction with the crosslinkable-group-containingpolyimide according to the present invention.

Usable examples of the solvent can include, in addition to the solventdescribed above under m) to q) and r), the followings:

s) Acetone, methyl ethyl ketone, methyl isobutyl ketone, methanol,ethanol, propanol, isopropanol, butanol, isobutanol, pentane, hexane,heptane, cyclohexane, dichloromethane, chloroform, carbon tetrachloride,fluorobenzene, methyl acetate, ethyl acetate, butyl acetate, methylformate, and ethyl formate;

t) Water, the amine solvents described above under p), imidazole,N,N-dimethylaniline, N,N-diethylaniline, and aqueous solutionscontaining potassium hydroxide, sodium hydroxide, potassium carbonate,sodium carbonate, potassium hydrogencarbonate, and sodiumhydrogencarbonate, respectively; and

u) Silicone oil, machine oil, working oil, kerosine, gasoline, and jetfuel.

These solvents can be used either singly or in combination. They canalso be used by further mixing them with one or more of the solventsdescribed above under m) to r). When used as a mixture, it is notabsolutely necessary to choose solvents in such a combination thatallows the solvents to be mutually dissolved at a desired ratio, and noproblem or inconvenience arises even if they cannot be mixed or theirmixture is not homogeneous. The concentrations of the aqueous solutionsdescribed above under t) are not limited and can be determined asdesired. In general, their concentrations are in a range of from 1 to60%.

No limitation is imposed on the preparation method of the solution orsuspension which contains the polyimide according to the presentinvention, and all known methods are applicable.

Illustrative preparation methods can include:

A) to use, as is, a solution or suspension after completion ofpolymerization; and

B) to obtain the crosslinkable-group-containing polyimide in the form ofpowder, granules or a block, and then to dissolve or disperse it in theabove-described solvent.

No limitations are imposed on the preparation conditions, such astemperature, time and stirring method, upon preparation of the solutionor suspension. In the case of the suspension, no limitation is imposedon the particle size or particle size distribution of powder, granulesor the like to be dispersed, and upon preparation, a dispersion promoteror an emulsifier can also be added.

[Alloys and Blends With Other Resins]

In accordance with the application purpose of thecrosslinkable-group-containing polyimide according to the presentinvention, it can be blended or alloyed, to an extent not impairing theobject of the present invention, with suitable amount or amounts of oneor more of resins such as thermoplastic resins, for example,polyethylene, polypropylene, polyvinyl chloride, polyvinylidenechloride, polybutadiene, polystyrene, polyvinyl acetate ABS resin,polybutylene terephthalate, polyethylene terephthalate, polyphenyleneoxide, polycarbonates, PTFE, celluloid, polyarylates, polyethernitrites, polyamides, polysulfones, polyether sulfones, polyetherketones, polyphenyl sulfide, polyamide-imides, polyether imides,modified polyphenylene oxide and polyimides, and thermosetting resins,for example, thermosetting polybutadiene, formaldehyde resins, aminoresins, polyurethane, silicone resins, SBR, NBR, unsaturated polyesters,epoxy resins, polycyanates, phenol resins and polybismaleimide. Noparticular limitation is imposed on their blending or alloying method,and a known method can be applied.

[Fillers and Additives]

With the crosslinkable-group-containing polyimide according to thepresent invention, various fillers or additives can be mixed to extentsnot impairing the object of the present invention. Their examples caninclude abrasion resistance improvers such as graphite, carborundum,silica powder, molybdenum disulfide and fluorinated resins; electricalcharacteristics improvers such as clay and mica; anti-track propertyimprovers such as asbestos, silica and graphite; acid resistanceimprovers such as barium sulfate, silica and calcium metasilicate;thermal conductivity improvers such as iron powder, zinc powder,aluminum powder and copper powder; and further, glass beads, glassballs, talc, diatomaceous earth, alumina, Shirasu (white volcanic ash)balloons, alumina hydrate, metal oxides, colorants, and pigments. Noparticular limitation is imposed on the mixing method, and a knownmethod can be applied.

EXAMPLES

The present invention will hereinafter be described in further detail byExamples. It should however be bone in mind that the present inventionis by no means limited by the Examples.

Testing methods of various tests, which are common to the Examples andComparative Examples, are as described next:

1) Logarithmic Viscosity Number of Polyimide Powder

A sample (0.50 g) was dissolved under heat in 100 mL of a mixed solventof p-chlorophenol and phenol (90:10 by weight ratio), and after coolingthe solution to 35° C., the logarithmic viscosity number was measured.

2) Melt Viscosity

A melt viscosity was measured by a Shimadzu Koka-type flow tester(“CFT500A”) through an orifice of 1.0 mm (diameter)×10 mm (length),under a load of 100 kgf and, unless otherwise specifically indicated,under 360° C.×5 min.

3) 5% Weight Loss Temperature

Using DTA-TG (“Shimadzu DT-40 series, 40M”), a 5% weight losstemperature was measured at a heating rate of 10° C./min. in air.

4) Glass Transition Temperature and Crystal Melting Temperature

Glass transition temperature and crystal melting temperature weremeasured at a heating rate of 10° C./min by DSC (“Shimadzu DT-40 series,DSC-41M”).

5) Tensile Strength of Molded Product

ASTM-D-638 was followed.

6) Logarithmic Viscosity Number of Polyamic Acid Varnish

After a varnish the solid content of which was 0.50 g was dissolved inN-methyl-2-pyrrolidone to give a total volume of 100 mL, its logarithmicviscosity number was measured at 35° C.

7) Mechanical Properties of Film

Mechanical properties were measured following ASTM D-822.

8) Heat Distortion Temperature

ASTM D-648 was followed.

Experiment A Series

In Example A1 to Example A91, a description will be made about certainexamples out of the present invention, in each of which 50 to 100 mole %of recurring structural units in a backbone structure are of a recurringunit structure represented by:

wherein X represents a divalent linking group selected from the groupconsisting of a direct bond, a carbonyl group, a sulfone group, asulfide group, an ether group, an isopropylidene group and ahexafluoroisopropylidene group; and

R represents a tetravalent aromatic group selected from the groupconsisting of:

wherein G represents a divalent aromatic group selected from the groupconsisting of a direct bond, a carbonyl group, a sulfone group, asulfide group, an ether group, an isopropylidene group, ahexafluoroisopropylidene group, a 3-oxyphenoxy group, a 4-oxyphenoxygroup, a 4′-oxy-4-biphenoxy group and a4-[1-(4-oxyphenyl)-1-methylethyl]phenoxy group.

Examples A1-A7, Comparative Examples A1-A3

In each of these examples and comparative examples,4,4′-bis(3-aminophenoxy)biphenyl (368.43 g, 1.000 mol), pyromelliticdianhydride (102.52 g, 0.470 mol), and 3,3′4,4′-biphenyltetracarboxylicacid dianhydride (138.28 g, 0.470mol) were charged as monomers togetherwith the corresponding end blocking agent(s), the kind(s) and amount(s)of which are shown in Table A1, and m-cresol (1,830 g) as a solvent intoa vessel equipped with a stirrer, a reflux condenser, a water trap and anitrogen gas inlet tube. The contents were heated with stirring to 200°C. over 2 hours and 30 minutes under a nitrogen atmosphere, andreactions were conducted under 200° C. reflux conditions for 4 hours.

TABLE A1 Charged amount Charged amount Ex./Comp.Ex. of PA of PCE PA/PCENo. [g] [mmol] [g] [mmol] molar ratio Example A1 17.60 118.8 0.29791.200 99/1  Example A2 16.89 114.0 1.489 6.000 95/5  Example A3 16.00108.8 2.979 12.00 90/10 Example A4 14.22 96.00 5.958 24.00 80/20 ExampleA5 10.66 72.00 11.92 48.00 60/40 Example A6 7.110 48.00 17.87 72.0040/60 Example A7 3.555 24.00 23.83 96.00 20/80 Comp.Ex. A1 2.666 18.0025.32 102.0 15/85 Comp.Ex. A2 0 0 29.79 120.0  0/100 Comp.Ex. A3 17.77120.0 0 0 100/0  [Note] In Table A1, “PA” stands for phthalic anhydride,and “PCE” stands for 1-phenyl-2-(3,4-dicarboxyphenyl) acetyleneanhydride.

The temperature was then lowered to 190° C., at which the correspondingend blocking agent(s) shown in Table A1, were charged again. Theresulting contents were heated again, and the reactions were thenconducted under 200° C. reflux conditions for further 4 hours.

The reaction mixture was thereafter cooled to 100° C., the resultingviscous polymer solution was discharged into toluene (10 liters) whichwas under vigorous agitation, and a precipitate was then collected byfiltration. The precipitate was again suspended and allowed toreprecipitate in toluene (4 liters). After the reprecipitate wascollected by filtration and then provisionally dried at 50° C. for 24hours, the reprecipitate was dried at 220° C. for 12 hours under anitrogen gas stream. The yield of the thus-obtained powder and thelogarithmic viscosity number, glass transition temperature, 5% weightloss temperature and melt viscosity (360° C./5 min.) are shown in TableA2.

The present invention is characterized in that concerning the moleculeends, the ratio of the chemical formula (2a) to the chemical formula(2b) ranges from 1/99 to 80/20 as recited in certain claims. From theabove-described results, it is also evident that those having ratios ofthe chemical formula (2a) to the chemical formula (2b) greater than80/20 are considerably inferior in moldability or formability to thosehaving ratios of the chemical formula (2a) to the chemical formula (2b)equal to or smaller than 80/20.

TABLE A2 5% Melt Logarithmic Glass Weight viscosity viscosity transitionloss 360 [° C.] Ex./comp.Ex. Yield number temp. temp. 5 min. No. [g][dL/g] [° C.] [° C.] Pa · S] Example A1 538.5 0.462 237 561 980 ExampleA2 541.0 0.466 237 560 1000 Example A3 540.2 0.465 236 561 960 ExampleA4 542.9 0.466 235 559 950 Example A5 543.5 0.461 236 560 1010 ExampleA6 541.7 0.470 237 561 1150 Example A7 542.8 0.467 236 560 1890 Comp.Ex.A1 544.0 0.470 237 561 No flow Comp.Ex. A2 544.2 0.478 235 559 No flowComp.Ex. A3 540.2 0.466 236 560 960

Examples A8-A12, Comparative Examples A4-5

Using the powders obtained in Examples A2-A6 and Comparative Example 3,compression molding was conducted. The powders used in the respectiveexamples and comparative examples are shown next in Table A3.

TABLE A3 Ex./Comp.Ex. No. Ex./Comp.Ex. No. of used powder Example A8Example A2 Example A9 Example A3 Example A10 Example A4 Example A11Example A5 Example A12 Example A6 Comp.Ex. A4, A5 Comp.Ex. A3

Described specifically, in each of these examples and comparativeexamples, the powder was extruded into pellets at 355° C. by a 25-mmsingle-screw extruder. After the pellets were filled in a compressionmold of configurations specified in ASTM-D-638, compression molding wasconducted at 360° C. for 12 hours (Examples A8-A12, Comparative ExampleA4) or under conditions of 360° C. and 5 minutes (Comparative ExampleA5). In all the examples and comparative examples, good molded productswere obtained. Using those molded products, a tensile test was performedat room temperature (23° C.). The results are shown in Table A4.

The present invention is characterized in that concerning the moleculeends, the ratio of the chemical formula (2a) to the chemical formula(2b) ranges from 1/99 to 80/20 as recited in certain claims. From theabove-described results, it is also evident that those having ratios ofthe chemical formula (2a) to the chemical formula (2b) not reaching 1/99are inferior in mechanical properties to those having ratios of thechemical formula (2a) to the chemical formula (2b) equal to or greaterthan 1/99.

TABLE A4 PA/PCE Break Yield Modulus of Ex./Comp.Ex. molar strengthstrength elasticity Elongation No. ratio [MPa] [MPa] [MPa] [%] ExampleA8 95/5  96.80 101.00 2200 76.2 Example A9 90/10 98.00 102.00 2280 80.1Example A10 80/20 97.80 102.00 2310 76.5 Example A11 60/40 99.20 105.002430 78.1 Example A12 40/60 98.30 108.00 2690 55.1 Comp.Ex. A4 100/0 92.10 98.50 2110 81.1 Comp.Ex. A5 100/0  91.90 97.80 2150 80.9 [Note] InTable A4, “PA/PCE molar ratio” means the molar ratio of phthalicanhydride to 1-phenyl-2-(3,4-dicarboxy-phenyl) acetylene anhydride.

Examples A13-A17, Comparative Examples A6-A8

In each of these examples and comparative examples,4,4′-bis(3-aminophenoxy)biphenyl (368.43 g, 1.000 mol), pyromelliticdianhydride (102.52 g, 0.470 mol), and 3,3′,4,4′-biphenyltetracarboxylicacid dianhydride (138.28 g, 0.470 mol) were charged as monomers togetherwith m-cresol (1,630 g) as a solvent into a vessel equipped with astirrer, a reflux condenser, a water trap and a nitrogen gas inlet tube.The contents were heated with stirring to 200° C. over 2 hours and 30minutes under a nitrogen atmosphere, and a reaction was conducted under200° C. reflux conditions for 2 hours, whereby a solution of anend-unblocked polymer was obtained. During the reaction, thecorresponding end blocking agent(s) described in Table A5 and m-cresol(200.0 mL) were charged into another vessel and were then heatedbeforehand at 100° C. for 1 hour under a nitrogen atmosphere to providea solution. The solution of the end blocking agent(s) was charged in itsentirety into the solution of the end-unblocked polymer, and reaction(s)was(were) then conducted under 200° C. reflux conditions for 2 hours.

TABLE A5 Charged amount Charged amount Ex./Comp.Ex. of PA of PCE PA/PCENo. [g] [mmol] [g] [mmol molar ratio Example A13 33.77 228.0 2.979 12.095/5  Example A14 31.99 216.0 5.958 24.0 90/10 Example A15 28.44 192.011.96 48.0 80/20 Example A16 21.33 144.0 23.83 96.0 60/40 Example A1714.21 96.00 35.75 144.0 40/60 Comp.Ex. A6 5.332 36.00 50.64 204.0 15/85Comp.Ex. A7 0 0 59.58 240.0  0/100 Comp.Ex. A8 35.55 240.0 0 0 100/0 [Note] In Table A5, “PA” stands for phthalic anhydride, and “PCE” standsfor 1-phenyl-2-(3,4-dicarboxyphenyl) acetylene anhydride.

The reaction mixture was thereafter cooled to 100° C. While maintainingthe resultant viscous polymer solution at 100° C., toluene (4 liters)was charged dropwise into the polymer solution over 4 hours. Aftertoluene (3 liters) which had been heated at 80° C. was additionallycharged, the resulting mixture was allowed to cool down to roomtemperature. Toluene (3 liters) was added further, followed by stirringfor 1 hour. A precipitate was then collected by filtration. Theprecipitate was again suspended and allowed to reprecipitate in toluene(4 liters). After the reprecipitate was collected by filtration and thenprovisionally dried at 50° C. for 24 hours, the reprecipitate was driedat 200° C. under reduced pressure for 12 hours under a gentle nitrogengas stream. The yield of the thus-obtained powder and the logarithmicviscosity number, glass transition temperature, 5% weight losstemperature and melt viscosity (360° C./5 min.) are shown in Table A6.

The present invention is characterized in that concerning the moleculeends, the ratio of the chemical formula (2a) to the chemical formula(2b) ranges from 1/99 to 80/20 as recited in certain claims. From theabove-described results, it is also evident that those having ratios ofthe chemical formula (2a) to the chemical formula (2b) greater than80/20 are considerably inferior in moldability or formability to thosehaving ratios of the chemical formula (2a) to the chemical formula (2b)equal to or smaller than 80/20.

TABLE A6 5% Melt Logarithmic Glass Weight viscosity viscosity transitionloss 360 [° C.] Ex./Comp.Ex. Yield number temp. temp. 5 min. No. [g][dL/g] [° C.] [° C.] [Pa · S] Example A13 540.2 0.461 238 561 1020Example A14 541.7 0.470 237 563 1050 Example A15 540.3 0.467 235 5601040 Example A16 542.4 0.465 236 561 990 Example A17 542.0 0.468 238 5611200 Comp.Ex. A6 543.9 0.465 238 562 No flow Comp.Ex. A7 542.5 0.471 236559 No flow Comp.Ex. A8 541.3 0.469 237 561 970

Examples A18-A22, Comparative Examples A9,A10

Using the powders obtained in Examples A13-A17 and Comparative ExampleA8, compression molding was conducted. The powders used in therespective examples and comparative examples are shown next in Table A7.

TABLE A7 Ex./Comp.Ex. No. Ex./Comp.Ex. No. of used powder Example A18Example A13 Example A19 Example A14 Example A20 Example A15 Example A21Example A16 Example A22 Example A17 Comp.Ex. A9, A10 Comp.Ex. A8

Described specifically, in each of these examples and comparativeexamples, the powder was extruded into pellets at 355° C. by a 25-mmsingle-screw extruder. After the pellets were filled in a compressionmold having a size of 10.0 mm in width and 80.0 mm in length,compression molding was conducted at 360° C. for 12 hours (ExamplesA18-A22, Comparative Example A9) or under conditions of 360° C. and 5minutes (Comparative Example A10). In all the examples and comparativeexamples, good molded products were obtained. Those specimens were allof 10.0 mm±0.010 mm in width, 80.0 mm±0.010 mm in length and 1.500mm±0.010 mm in thickness. Using those molded products, a chemicalresistance test was performed by the below-described method.

Described specifically, each specimen was held in place at portions 5.00mm apart from opposite ends thereof, and was then adjusted and fixedsuch that a displacement of 3.50 mm in the direction of the thicknesswould be given when the specimen was bent by a jig maintained in contactwith the specimen at a center thereof (a portion 40.0 mm apart from therespective ends). Under those conditions, the specimen was immersed intoluene or methyl ethyl ketone. One hour, 24 hours and 168 hours later,the specimen was taken out of the solvent and visually observed forcracks. The results of the chemical resistance test are shown in TableA8.

The present invention is characterized in that concerning the moleculeends, the ratio of the chemical formula (2a) to the chemical formula(2b) ranges from 1/99 to 80/20 as recited in certain claims. From theabove-described results, it is evident that those having ratios of thechemical formula (2a) to the chemical formula (2b) not reaching 1/99 areinferior in chemical resistance to those having ratios of the chemicalformula (2a) to the chemical formula (2b) equal to or greater than 1/99.

TABLE A8 Ex./ Toluene MEK PA/PCE Comp. immersion time immersion timemolar Ex. No. 1 hr. 24 hr. 168 hr. 1 hr. 24 hr. 168 hr. ratio Example AA A B B C 95/5  A18 Example A A A A B B 90/10 A19 Example A A A A A B80/20 A20 Example A A A A A A 60/40 A21 Example A A A A A A 40/60 A22Comp.Ex. A B B C C C  0/100 A9 Comp.Ex. A B B C C C  0/100 A10 [Note] InTable A8, “A”, “B” and “C” indicate “completely free of cracks”, “cracksobserved in a very small number” and “cracks observed in a largenumber”, respectively, in this order. Further, “PA/PCE molar ratio”means the molar ratio of phthalic anhydride to1-phenyl-2-(3,4-dicarboxy-phenyl)acetylene anhydride, and “MEK” standsfor methyl ethyl ketone.

Examples A23-A32, Comparative Examples A11-A16

In each of these examples and comparative examples, the following tworeactions (A), (B) were conducted.

(A) 4,4′-Bis(3-aminophenoxy) biphenyl (368.43 g, 1.000 mol ),pyromellitic dianhydride (102.52 g, 0.470 mol), and3,3′,4,4′-biphenyltetracarboxylic acid dianhydride (138.28 g, 0.470 mol)were charged as monomers together with phthalic anhydride (10.66 g,72.00 mmol) and 1-phenyl-2-(3,4-dicarboxyphenyl)acetylene anhydride(11.92 g, 48.00 mmol) as end blocking agents, m-cresol (1,830 g) as asolvent, and γ-picoline (13.970 g, 0.1500 mol) as a catalyst into avessel equipped with a stirrer, a reflux condenser, a water trap and anitrogen gas inlet tube. The contents were heated with stirring to 150°C. over 2 hours under a nitrogen atmosphere, and reactions wereconducted at 150° C. for 2 hours.

As end blocking agents, phthalic anhydride (5.33g, 36.00 mmol) and1-phenyl-2-(3,4-dicarboxyphenyl)acetylene anhydride (5.96 g, 24.00 mmol)were then charged, followed by the reactions at 150° C. for further 8hours.

The reaction mixture was thereafter cooled to 60° C., the resultingviscous polymer solution was discharged into methyl ethyl ketone (10liters) which was under vigorous agitation, and a precipitate was thencollected by filtration. The precipitate was again suspended and allowedto reprecipitate in methyl ethyl ketone (4 liters). After thereprecipitate was collected by filtration and then provisionally driedat 50° C. for 24 hours, the reprecipitate was dried at 220° C. for 12hours under a nitrogen gas stream, whereby polyimide powder wasobtained.

(B) In each of these examples and comparative examples, polyimide powderwas obtained in exactly the same manner as in the reaction (A) exceptthat upon preparation of the make-up, the amount(s) of the end blockingagent(s) of the kind(s) was(were) changed to only phthalic anhydride(17.77 g, 120.00 mmol) and that during the reactions, the amount(s) ofthe end blocking agent(s) of the kind(s) was(were) changed to onlyphthalic anhydride (8.89 g, 60.00 mmol).

The yields of the powders obtained in the two reactions (A),(B) andtheir logarithmic viscosity numbers, glass transition temperatures, 5%weight loss temperatures and melt viscosities (360° C./5 min.) are shownin Table A9.

Further, each powder was extruded into pellets at 355° C. by a 25-mmsingle-screw extruder. After the pellets were filled in a compressionmold of the shape specified in ASTM-D-638, compression molding wasconducted under the conditions described in Table A10.

TABLE A9 5% Melt Logarithmic Glass Weight viscosity viscosity transitionloss 360 [° C.] Yield number temp. temp. 5 min. [g] [dL/g] [° C.] [° C.][Pa · S] (A) 543.0 0.466 236 560 1050 (B) 541.6 0.465 236 561 1000

TABLE A10 Compression molding Ex./Comp.Ex. No. Used powder conditionsExamples A23, A28 (A) 360° C., 2 hr. Examples A24, A29 (A) 360° C., 6hr. Examples A25, A30 (A) 360° C., 12 hr. Examples A26, A31 (A) 360° C.,24 hr. Examples A27, A32 (A) 360° C., 72 hr. Comp.Ex. A11, A14 (B) 360°C., 2 hr. Comp.Ex. A12, A15 (B) 360° C., 12 hr. Comp.Ex. A13, A16 (B)360° C., 72 hr.

Using the specimens so obtained, a tensile test at room temperature (23°C.) and a high-temperature tensile test at 177° C. were performed. Theresults are shown in Table A11.

From the foregoing, it is evident that thecrosslinkable-group-containing polyimide according to the presentinvention can be significantly improved in room-temperature andhigh-temperature mechanical properties by annealing, and it is alsoappreciated that this effect cannot be expected from the conventionalpolyimides of the comparative examples.

TABLE A11 Modulus PA/PCE Testing Break Yield of Ex./Comp. molar temp.strength strength elasticity Elongation Ex. No. ratio [° C.] [MPa] [MPa][MPa] [%] Example 60/40 23 96.30 99.00 2320 76.9 A23 Example 60/40 2398.00 102.00 2390 81.0 A24 Example 60/40 23 99.20 105.00 2430 78.1 A25Example 60/40 23 102.00 111.00 2500 80.2 A26 Example 60/40 23 103.00115.00 2510 74.7 A27 Comp.Ex. 100/0  23 93.10 97.80 2100 77.1 A11Comp.Ex. 100/0  23 92.80 98.00 2090 78.5 A12 Comp.Ex. 100/0  23 92.5098.80 2140 76.6 A13 Example 60/40 177 78.20 65.10 1880 144 A28 Example60/40 177 84.20 68.20 1950 151 A29 Example 60/40 177 91.00 72.10 2150140 A30 Example 60/40 177 86.50 82.00 2320 128 A31 Example 60/40 17774.40 84.00 2540 105 A32 Comp.Ex. 100/0  177 65.10 47.50 1680 150 A14Comp.Ex. 100/0  177 66.00 47.80 1700 151 A15 Comp.Ex. 100/0  177 63.1047.40 1660 144 A16

Examples A28-A32, Comparative Examples A14-A16

In each of these examples and comparative examples, pyromelliticdianhydride and 3,3′,4,4′-biphenyl-tetracarboxylic acid dianhydride werecharged in their corresponding amounts shown in Table A12 together with4,4′-bis(3-aminophenoxy)biphenyl (368.43 g, 1.000 mol), all as monomers,into a vessel equipped with a stirrer, a reflux condenser, a water trapand a nitrogen gas inlet tube. As a solvent, m-cresol was also chargedin its corresponding amount shown in Table A12. The contents were heatedwith stirring to 200° C. over 2 hours and 30 minutes under a nitrogenatmosphere, and a reaction was conducted under 200° C. reflux conditionsfor 2 hours, whereby a solution of an end-unblocked polymer wasobtained.

During the reaction, the corresponding end blocking agents described inTable A13 and m-cresol (200.0 mL) were charged into another vessel andwere then heated beforehand at 100° C. for 1 hour under a nitrogenatmosphere to provide a solution. The solution of the end blockingagents was charged in its entirety into the solution of theend-unblocked polymer, and reactions were then conducted under 200° C.reflux conditions for 2 hours.

TABLE A12 Charged Charged Charged Ex./Comp.Ex. amount of PMDA amount ofBPDA amount of No. [g] [mol] [g] [mol] m-cresol [g] Example A28 146.580.6720 84.74 0.2880 1600 Example A29, 142.00 0.6510 82.09 0.2790 1580 31Example A30, 137.42 0.6300 79.44 0.2700 1560 32 Comp.Ex. A14 146.580.6720 84.74 0.2880 1600 Comp.Ex. A15 142.00 0.6510 82.09 0.2790 1580Comp.Ex. A16 137.42 0.6300 79.44 0.2700 1560 [Note] In Table A12, “PMDA”stands for pyromellitic dianhydride, and “BPDA” stands for3,3′,4,4′-biphenyl-tetracarboxylic acid dianhydride.

TABLE A13 Charged Charged Ex./Comp.Ex. amount of PA amount of PCE PA/PCENo. [g] [mmol] [g] [mmol] molar ratio Example A28 16.59 112.0 11.9248.00 70/30 Example A29 29.03 196.0 20.85 84.00 70/30 Example A30 41.47280.0 29.79 120.0 70/30 Example A31 20.74 140.0 34.75 140.0 50/50Example A32 29.62 200.0 49.45 200.0 50/50 Comp.Ex. A14 3.555 24.00 33.76136.0 15/85 Comp.Ex. A15 6.221 42.00 59.08 238.0 15/85 Comp.Ex. A168.887 60.00 84.40 340.0 15/85 [Note] In Table A13, “PA” stands forphthalic anhydride, and “PCE” stands for1-phenyl-2-(3,4-dicarboxyphenyl) acetylene anhydride.

The reaction mixture was thereafter cooled to 60° C., the resultingviscous polymer solution was discharged into methyl ethyl ketone (10liters) which was under vigorous agitation, and a precipitate was thencollected by filtration. The precipitate was again suspended and allowedto reprecipitate in methyl ethyl ketone (4 liters) After thereprecipitate was collected by filtration and then provisionally driedat 50° C. for 24 hours, the reprecipitate was dried at 220° C. for 12hours under a nitrogen gas stream, whereby polyimide powder wasobtained.

The logarithmic viscosity number, glass transition temperature, 5%weight loss temperature and melt viscosity (360° C./5 min., 15 min., 30min.) of the thus-obtained polyimide powder are shown in Table A14.

It is appreciated from the results that thecrosslinkable-group-containing polyimide according to the presentinvention, even at various molecular weights, has good melt fluidity andis better in moldability or formability than the polyimides of thecomparative examples.

TABLE A14 Logarithmic Glass viscosity transition 360° C. Melt ViscosityEx./Comp.Ex. number temp. [Pa · S] No. [dL/g] [° C.] 5 min. 15 min. 30min. Example A28 0.772 238 3280 3410 4120 Example A29 0.430 236 890 9201130 Example A30 0.319 230 360 360 390 Example A31 0.422 235 940 12504860 Example A32 0.324 231 390 630 1310 Comp.Ex. A14 0.758 239 No flow ←← Comp.Ex. A15 0.426 236 No flow ← ← Comp.Ex. A16 0.317 230 7830 No flow←

Examples A33-A37, Comparative Examples A17-A19

In each of these examples and comparative examples, pyromelliticdianhydride and N-methyl-2-pyrrolidone were charged in theircorresponding amounts shown in Table A15 together with4,4′-bis(3-aminophenoxy)biphenyl(368.43 g, 1.000 mol) into a vesselequipped with a stirrer and a nitrogen gas inlet tube. While stirringthe contents under a nitrogen atmosphere, a reaction was conducted atroom temperature for 12 hours, whereby a polyamic acid varnish wasobtained. The corresponding end blocking agents, the kind(s) andamount(s) of which are shown in Table A15, were charged into thethus-obtained varnish, followed by reactions at room temperature for 12hours.

TABLE A15 Amount Charged Charged Charged amount of amount amountEx./Comp.Ex. of PMDA NMP of PA of PCE No. [g] [mol] [g] [g] [mol] [g][mol] Example A33 215.94 0.990 4285 1.481 10.00 2.482 10.00 Example A34209.40 0.960 3274 5.925 40.00 9.930 40.00 Example A35 202.85 0.930 323810.37 70.00 17.38 70.00 Example A36 196.31 0.900 2573 14.81 100.0 24.82100.0 Example A37 174.50 0.800 1629 29.62 200.0 49.45 200.0 Comp.Ex. A17215.94 0.990 4285 2.962 20.00 0 0 Comp.Ex. A18 202.85 0.930 3238 20.74140.0 0 0 Comp.Ex. A19 174.50 0.800 1629 59.25 400.0 0 0 [Note] In TableA15, “PMDA”, “NMP”, “PA” and “PCE” stand for pyromellitic dianhydride,N-methyl-2-pyrrolidone, phthalic anhydride, and1-phenyl-2-(3,4-dicarboxyphenyl)acetylene anhydride, respectively.

The logarithmic viscosity number of the thus-obtained polyamic acidvarnish is shown in Table A16. Using that varnish, a film was prepared.Described specifically, the varnish was evenly cast on a soft glassplate. Within an oven through which a nitrogen gas stream was flowing,the film was heated from 500° C. to 200° C. at a heating rate of 1° C.per minute, and was then cured at 200° C. for 2 hours. Further, the filmwas heated from 200° C. to 370° C. at a heating rate of 15° C. perminute, and was then annealed at 370° C. for 4 hours. After theresulting film was quenched, hot water was poured over the film suchthat the film was peeled off from the glass plate. Incidentally, thefilm of Comparative Example A19 was so brittle that upon quenching, itshattered into small pieces, thereby failing to obtain a film. From thefilms of the remaining examples, good films were obtained. A tensiletest of each film, which had been obtained by the above-describedprocedures, was performed at room temperature (23° C.) The results areshown in Table A16.

From these results, it is evident that thecrosslinkable-group-containing polyimide according to the presentinvention, at various molecular weights, exhibits better physicalproperties than the polyimides of the comparative examples.

TABLE A16 Logarithmic Modulus viscosity Break Yield of Ex./Comp.Ex.number strength strength elasticity Elongation No. [dL/g] [Mpa] [MPa][MPa] [%] Example A33 1.45 102.00 108.00 2640 82.1 Example A34 0.76797.00 107.00 2560 80.3 Example A35 0.430 97.20 105.00 2590 79.8 ExampleA36 0.341 96.90 103.00 2680 78.6 Example A37 0.288 97.10 104.00 267080.0 Comp.Ex. A17 1.58 92.60 98.10 2060 88.1 Comp.Ex. A18 0.422 90.1098.30 2050 80.2 Comp.Ex. A19 0.291 — — — —

Examples A38-A42, Comparative Examples A20-A22

In each of these examples and comparative examples, 500 mL of thecorresponding one of the varnishes—which had been obtained in ExamplesA33-A37 and Comparative Examples A17-A19, respectively—were dischargedinto methanol (10 liters) which was under vigorous agitation, and aprecipitate was collected by filtration. The precipitate was washedfurther with methanol (800mL). After provisional drying under reducedpressure at 50° C. for 24 hours, the precipitate was dehydrated andimidated under reduced pressure at 250° C. for 12 hours under a gentlenitrogen gas stream, whereby polyimide powder was obtained. The usedvarnish and the glass transition temperature and 5% weight losstemperature of the thus-obtained polyimide powder are shown in TableA17.

Further, the powder was placed on a heat-resistant dish, annealed undernitrogen gas at 380° C. for 2 hours, and then quenched. Thereafter, itsglass transition temperature and 5% weight loss temperature weremeasured. The results are shown in Table A17.

From these results, it is appreciated that, when annealed, thecrosslinkable-group-containing polyimide according to the presentinvention is significantly improved in glass transition temperature butthe polyimides of the comparative examples are not improved.

TABLE A17 Ex./Comp. Used Before annealing After annealing Ex. No.varnish Tg [° C.], Td5 [° C.] Tg [° C.], Td5 [° C.] Example Example 245560 268 552 A38 A33 Example Example 245 560 266 553 A39 A34 ExampleExample 244 559 265 554 A40 A35 Example Example 242 552 264 550 A41 A36Example Example 237 544 265 543 A42 A37 Comp.Ex. Comp.Ex. 245 561 244555 A20 A17 Comp.Ex. Comp.Ex. 244 560 243 554 A21 A18 Comp.Ex. Comp.Ex.235 542 235 521 A22 A19 [Note] In Table A17, “Tg” indicates a glasstransition temperature, and “Td5” designates a 5% weight losstemperature.

Examples A43-A45, Comparative Example A23

In each of these examples and comparative example,4,4′-bis(3-aminophenoxy)biphenyl (368.43 g, 1.000 mol) and pyromelliticdianhydride (205.03 g, 0.940 mol) were charged as monomers together withm-cresol (1,520 g) as a solvent into a vessel equipped with a stirrer, areflux condenser, a water trap and a nitrogen gas inlet tube. Thecontents were heated with stirring to 200° C. over 2 hours and 30minutes under a nitrogen atmosphere, and a reaction was conducted under200° C. reflux conditions for 2 hours, whereby a solution of anend-unblocked polymer was obtained. During the reaction, thecorresponding end blocking agent (s) described in Table A18 and m-cresol(200.0 mL) were charged into another vessel and were then heatedbeforehand at 100° C. for 1 hour under a nitrogen atmosphere to providea solution. The solution of the end blocking agent(s) was charged in itsentirety into the solution of the end-unblocked polymer, and reaction(s)was (were) then conducted under 200° C. reflux conditions for 2 hours.

TABLE A18 Charged amount Charged amount PA/PCE Ex./Comp. of PA of PCEmolar Ex. No. [g] [mmol] [g] [mmol] ratio Example A43 33.77 228.0 2.97912.0 95/5  Example A44 31.99 216.0 5.958 24.0 90/10 Example A45 28.44192.0 11.92 48.0 80/20 Comp.Ex. A23 17.77 120.0 0 0 100/0  [Note] InTable A18, “PA” stands for phthalic anhydride, and “PCE” stands for1-phenyl-2-(3,4-dicarboxyphenyl) acetylene anhydride.

The reaction mixture was thereafter cooled to 100° C. While maintainingthe resultant viscous polymer solution at 100° C., toluene (4 liters)was charged dropwise into the polymer solution over 4 hours. Aftertoluene (3 liters) which had been heated at 80° C. was additionallycharged, the resulting mixture was allowed to cool down to roomtemperature. Toluene (3 liters) was added further, followed by stirringfor 1 hour. A precipitate was then collected by filtration. Theprecipitate was again suspended and allowed to reprecipitate in toluene(4 liters). After the reprecipitate was collected by filtration and thenprovisionally dried at 50° C. for 24 hours, the reprecipitate was driedat 200° C. under reduced pressure for 12 hours under a gentle nitrogengas stream. The logarithmic viscosity number, glass transitiontemperature, crystal melting temperature, 5% weight loss temperature andmelt viscosity (410° C./5 min.) of the thus-obtained polyimide powderare shown in Table A19.

Using the polyimide powder so obtained, pelletization was conducted at400° C. by extrusion. Injection molding was then conducted at a resintemperature of from 380 to 410° C., an injection pressure of from 1,400to 1,600 kg/cm² and a mold temperature of 170° C., whereby an amorphousspecimen of the shape specified in ASTM-D-638 was obtained.

To the thus-obtained amorphous specimen, annealing treatment was appliedfurther under a nitrogen gas stream, whereby the specimen wascrystallized and, where the specimen was that of one of the examples,the specimen was subjected to crosslinking. The annealing treatmentconsisted of the following nine steps: {circle around (1)} heating fromroom temperature to 220° C. at a heating rate of 5° C./min., {circlearound (2)} annealing at 220° C. for 5 hours, {circle around (3)}heating from 220° C. to 280° C. at a heating rate of 5° C./min., {circlearound (4)} annealing at 280° C. for 5 hours, {circle around (5)}heating from 280° C. to 320° C. at a heating rate of 5° C./min., {circlearound (6)} annealing at 320° C. for 5 hours, {circle around (7)}heating from 320° C. to 350° C. at a heating rate of 5° C./min., {circlearound (8)} annealing at 350° C. for 24 hours, and {circle around (9)}cooling to room temperature at a cooling rate of 5° C./min.

Using the specimen, a tensile test was performed. The results are shownin Table A20.

TABLE A19 Melt Ex./ Logarithmic Glass Crystal 5% viscosity Comp.viscosity transition melting Weight loss 410 [° C.] Ex. number temp.temp. temp. 5 min. No. [dL/g] [° C.] [° C.] [° C.] [Pa · S] Example0.463 245 388 560 620 A43 Example 0.466 246 389 561 640 A44 Example0.468 245 388 560 720 A45 Comp.Ex. 0.465 246 388 560 610 A23

TABLE A20 Break Yield Modulus of Ex./Comp. strength strength elasticityElongation Ex. No. [MPa] [MPa] [MPa] [%] Example A43 101.00 102.00 251012.2 Example A44 98.30 100.00 2570 16.1 Example A45 97.80 102.00 266021.6 Comp.Ex. A23 95.00 99.70 2410 10.4

From the above results, it is evident that thecrosslinkable-group-containing polyimide according to the presentinvention, even when crystallized, has good mechanical properties.

Examples A46-A49, Comparative Examples A24-A27

In each of these examples and comparative examples, the following tworeactions (A),(B) were conducted.

(A) 4,4′-Bis(3-aminophenoxy)biphenyl (368.43 g, 1.000 mol), pyromelliticdianhydride (101.43 g, 0.465 mol) and 3,3′,4,4′-biphenyltetracarboxylicacid anhydride (136.81 g, 0.465 mol) were charged as monomers togetherwith m-cresol (1,820 g) as a solvent into a vessel equipped with astirrer, a reflux condenser, a water trap and a nitrogen gas inlet tube.The contents were heated with stirring to 200° C. over 3 hours under anitrogen atmosphere, and a reaction was conducted under 200° C. refluxconditions for 2 hours, whereby a solution of an end-unblocked polymerwas obtained. During the reaction, phthalic anhydride (20.74 g, 140.0mmol) and 1-phenyl-2-(3,4-dicarboxyphenyl)acetylene anhydride (34.75 g,140.0 mmol) were charged as end blocking agents together with m-cresol(200.0 mL) into another vessel, and were then heated beforehand at 100°C. for 1 hour under a nitrogen atmosphere to provide a solution. Thesolution of the end blocking agents was charged in its entirety into thesolution of the end-unblocked polymer, and reactions were then conductedunder 200° C. reflux conditions for 2 hours.

The reaction mixture was thereafter cooled to 60° C., the resultingviscous polymer solution was discharged into methanol (10 liters) whichwas under vigorous agitation, and a precipitate was then collected byfiltration. The precipitate was again suspended and allowed toreprecipitate in methanol (4 liters). After the reprecipitate wascollected by filtration and then provisionally dried at 50° C. for 24hours, the reprecipitate was dried at 220° C. for 12 hours under anitrogen gas stream, whereby polyimide powder was obtained.

(B) In each of these examples and comparative examples, polyimide powderwas obtained in exactly the same manner as in the reaction (A) exceptthat the amounts of the end blocking agents of the kinds were changed toonly phthalic anhydride (41.47 g, 280.00 mmol).

The logarithmic viscosity numbers, glass transition temperatures, 5%weight loss temperatures and melt viscosities (360° C./5 min.) of thepowders obtained in the two reactions (A),(B) are shown in Table A21.

Further, each powder was extruded into pellets at 355° C. by a 25-mmsingle-screw extruder. After the pellets were filled in a compressionmold of the shape specified in ASTM-D-638, compression molding wasconducted under the conditions described in Table A22.

Using the thus-obtained specimen, a chemical resistance test wasperformed. Described specifically, the specimen was fixed on a jig in astate stretched by 0.5%, and was then immersed in toluene or methylethyl ketone at room temperature (23° C.) for 24 hours. Using theimmersed specimen, a tensile test was performed at room temperature (23°C.). The results of the tensile test were compared with those of atensile test of a corresponding non-immersed specimen, and a breakstrength retention (%) was calculated. The term “break strengthretention (%)” as used herein means a value expressed in terms ofpercentage by comparing the break strength of an immersed specimen withthe break strength of a corresponding non-immersed specimen.

The results are shown in Table A22.

TABLE A21 Logarithmic Glass 5% Melt viscosity viscosity transitionWeight loss 360 [° C.] 5 min. number [dL/g] temp. [° C.] temp. [° C.][Pa · S] (A) 0.426 232 560 850 (B) 0.421 233 561 830

TABLE A22 Compression Retention of break Ex./Comp. Used molding strength[%] Ex. No. powder conditions Toluene MEK Example A46 (A) 390° C., 6 hr.95.8 82.5 Example A47 (A) 370° C., 6 hr. 97.2 88.3 Example A48 (A) 350°C., 6 hr. 92.6 82.0 Example A49 (A) 330° C., 6 hr. 89.8 72.9 Comp.Ex.A24 (B) 390° C., 6 hr. 82.2 45.1 Comp.Ex. A25 (B) 370° C., 6 hr. 87.442.0 Comp.Ex. A26 (B) 350° C., 6 hr. 86.6 49.2 Comp.Ex. A27 (B) 330° C.,6 hr. 85.0  6.4 [Note] In Table A22, “MEK” stands for methyl ethylketone.

From the above results, it is evident that thecrosslinkable-group-containing polyimide according to the presentinvention is significantly improved in chemical resistance by annealingunder various conditions irrespective of the annealing temperature. Itis appreciated that this effect cannot be expected from the conventionalpolyimides of the comparative examples.

Examples A50-A54, Comparative Examples A28-A32

In each of these examples and comparative examples, polyimide powder wassynthesized in exactly the same manner as in Examples A13-A17 exceptthat the corresponding one of various diamines and pyromelliticdianhydride (202.85 g, 0.930 mol) were used as monomers and thatphthalic anhydride (20.74 g, 140.0 mmol) and1-phenyl-2-(3,4-dicarboxy-phenyl)acetylene anhydride (34.75 g, 140.0mmol) were used as end blocking agents in each of the examples but onlyphthalic anhydride (41.47 g, 280.00 mmol) was used as an end blockingagent in each of the comparative examples.

Further, the thus-obtained polyimide powder was extruded into pellets at325° C. to 365° C. by a 25-mm single-screw extruder. After the pelletswere filled in a compression mold of the shape specified in ASTM-D-648,Compression molding was conducted under the conditions of 360° C. and 6hours.

Using the specimen so obtained, its heat distortion temperature wasmeasured.

The kinds and amounts of the diamines, which were used in the respectiveexamples and comparative examples, and the heat distortion temperaturesare shown in Table A23.

TABLE A23 Diamine Heat distortion Ex. Comp. Charged Charged temp. [° C.]No. Ex. No. Kind/ amount [g]/ amount [mol] Ex. Comp.Ex. A50 A28 b)396.44 1.000 265 235 A51 A29 c) 432.49 1.000 285 260 A52 A30 d) 400.491.000 250 215 A53 A31 e) 384.43 1.000 255 225 A54 A32 f) 518.46 1.000260 220 [Note] In Table A23, the diamines are indicated by the followingsigns: b) bis[4-(3-aminophenoxy)phenyl] ketone, c)bis[4-(3-aminophenoxy)phenyl] sulfone, d) bis(4-(3-aminophenoxy)phenyl]sulfide, e) bis(4-(3-aminophenoxy)phenyl] ether, and f)2,2-bis[3-(3-aminophenoxy)phenyl]-1,1,1,3,3,3-hexafluoropropane.

Examples A55-A59, Comparative Examples A33-A37

In each of these examples and comparative examples, polyimide powder wassynthesized in exactly the same manner as in Examples A13-A17 exceptthat the corresponding one of various diamines, 4,4′-bis(3-aminophenoxy)biphenyl (331.59g, 0.900 mol) and pyromelliticdianhydride (202.85 g, 0.930 mol) were used as monomers and thatphthalic anhydride (20.74 g, 140.0 mmol) and1-phenyl-2-(3,4-dicarboxyphenyl)-acetylene anhydride (34.75 g, 140.0mmol) were used as end blocking agents in each of the examples but onlyphthalic anhydride (41.47 g, 280.00 mmol) was used as an end blockingagent in each of the comparative examples.

In a similar manner as in Examples A50-A54, specimens were then obtainedfrom the respective polyimide powders, and their heat distortiontemperatures were measured. The kinds and amounts of the diamines, whichwere used in the respective examples, and the heat distortiontemperatures are shown in Table A24.

TABLE A24 Diamine Heat distortion Ex. Comp. Charged Charged temp. [° C.]No. Ex. No. Kind/ amount [g]/ amount [mol] Ex. Comp.Ex. A55 A33 g) 20.020.100 295 255 A56 A34 h) 20.02 0.100 300 260 A57 A35 i) 24.83 0.100 290260 A58 A36 j) 26.03 0.100 290 250 A59 A37 k) 32.83 0.100 285 240 [Note]In Table A24, the diamines are indicated by the following sign: a)4,4′-bis(3-aminophenoxy)biphenyl, g) 3,4′-diaminodiphenyl ether, h)4,4′-diaminodiphenyl ether, i) 3,3′-diaminodiphenyl sulfone, j)1,3-bis(3-aminophenoxy) benzene, and k) 1,3-bis(3-aminophenoxy)4-trifluoromethyl-benzene.

Examples A60-A64, Comparative Examples A38-A42

In each of these examples and comparative examples, polyimide powder wassynthesized in exactly the same manner as in Examples A13-A17 exceptthat the corresponding ones of various diamines,4,4′-bis(3-aminophenoxy)biphenyl (221.058 g, 0.600 mol) and pyromelliticdianhydride (202.85 g, 0.930 mol) were used as monomers and thatphthalic anhydride (20.74 g, 140.0 mmol) and1-phenyl-2-(3,4-dicarboxyphenyl)acetylene anhydride (34.75 g, 140.0mmol) were used as end blocking agents in each of the examples but onlyphthalic anhydride (41.47 g, 280.00 mmol) was used as an end blockingagent in each of the comparative examples.

In a similar manner as in Examples A50-A54, specimens were thenobtained, and their heat distortion temperatures were measured.

The kinds and amounts of the diamines, which were used in the respectiveexamples and comparative examples, and the heat distortion temperaturesare shown in Table A25.

TABLE A25 Diamine Heat distortion Ex. Comp. Charged Charged temp. [° C.]No. Ex. No. Kind/ amount [g]/ amount [mol] Ex. Comp.Ex. A60 A38 m)211.48 0.400 265 230 A61 A39 n) 261.10 0.400 255 220 A62 A40 o) 158.580.400 275 240 A63 A41 p) 121.74 0.400 280 245 A64 A42 q) 196.26 0.400265 230 [Note] In Table A25, the diamines are indicated by the followingsigns: a) 4,4′-bis(3-aminophenoxy)biphenyl, m)1,3-bis[4-(4-aminophenoxy)-α,α-dimethyl]benzene, n)4,4′-bis[4-(4-aminophenoxy)benzoyl]diphenyl ether, o)3,3′-diamino-4,4′-diphenoxybenzophenone, p)3,3′-diamino-4-phenoxybenzophenone, and q)6,6′-bis(3-aminophenoxy)3,3,3′,3′,-tetramethyl-1,1′-spiroindane.

Examples A65-A69, Comparative Examples A43-A47

In each of these examples and comparative examples, polyimide powder wassynthesized in exactly the same manner as in Examples A13-A17 exceptthat 4,4′-bis(3-amino-phenoxy)biphenyl (368.43 g, 1.000 mol) and thecorresponding one of various acid anhydrides were used as monomers andthat phthalic anhydride (20.74 g, 140.0 mmol) and1-phenyl-2-(3,4-dicarboxyphenyl)acetylene anhydride (34.75 g, 140.0mmol) were used as end blocking agents in each of the examples but onlyphthalic anhydride (41.47 g, 280.00 mmol) was used as an end blockingagent in each of the comparative examples. In a similar manner as inExamples A50-A54, specimens were then obtained, and their heatdistortion temperatures were measured.

The kinds and amounts of the acid anhydrides, which were used in therespective examples and comparative examples, and the heat distortiontemperatures are shown in Table A26.

TABLE A26 Acid anhydride Distortion Ex. Comp. Charged Charged temp. [°C.] No. Ex. No. Kind/ amount [g]/ amount [mol] Ex. Comp.Ex. A65 A43 s)273.62 0.930 260 225 A66 A44 t) 299.67 0.930 255 225 A67 A45 u) 288.500.930 255 220 A68 A46 v) 413.14 0.930 245 220 A69 A47 w) 374.16 0.930255 225 [Note] In Table A26, the acid anhydrides are indicated by thefollowing signs: s) 3,3′,4,4′-biphenyltetracarboxylic acid dianhydride,t) 3,3′,4,4′-benzophenonetetracarboxylic acid dianhydride, u)bis(3,4-dicarboxyphenyl) ether dianhydride, v)2,2-bis(3,4-dicarboxyphenyl)-1,1,1,3,3,3-hexafluoropropane dianhydride,and w) 1,4-bis(3,4-dicarboxyphenyl)benzene dianhydride.

From the above test, it is evident that crosslinkable-group-containingpolyimides according to the present invention, which have variousstructures, are far superior in heat resistance to similar polymershaving no crosslinkable groups.

Examples A70-A75, Comparative Examples A43-A48

In each of these examples and comparative examples, a 15% (W/W) polyamicacid varnish was obtained in a similar manner as in Examples A33-A37 byusing dimethyl acetamide as a solvent, the corresponding diamine(s) andacid anhydride (s), the amounts and kinds of which are shown in TableA27, as monomers, and phthalic anhydride (10.66 g, 72.00 mmol) and1-phenyl-2-(3,4-dicarboxyphenyl)acetylene anhydride (11.92 g, 48.00mmol) as end blocking agents in each of the examples or only phthalicanhydride (17.77 g, 120.00 mmol) as an end blocking agent in each of thecomparative examples.

TABLE A27 Diamine Acid anhydride (one to three kinds) (one or two kinds)Comp. Charged Charged Charged Charged Ex. Ex. amount amount amountamount No. No. Kind/ [g]/ [mol] Kind/ [g]/ [mol] A70 A48 a) 331.59 0.900r) 143.52 0.658 h) 20.24 0.100 s) 82.97 0.282 A71 A49 a) 331.59 0.900 r)143.52 0.658 i) 24.83 0.100 s) 82.97 0.282 A72 A50 a) 221.06 0.600 r)205.03 0.940 i) 49.66 0.200 j) 52.07 0.200 A73 A51 a) 221.06 0.600 r)184.53 0. 846 i) 49.66 0.200 s) 27.66 0.094 j) 52.07 0.200 A74 A52 b)396.44 1.000 r) 102.52 0.470 s) 136.28 0.470 A75 A53 c) 302.74 0.700 t)302.90 0.940 o) 118.93 0.300 [Note] In Table A27, the diamines and acidanhydrides are indicated by the following signs: a)4,4′-bis(3-aminophenoxy)biphenyl, b) bis[4-(3-aminophenoxy)phenyl]ketone, c) bis[4-(3-aminophenoxy)phenyl] sulfone, h)4,4′-diaminodiphenyl ether, i) 3,3′-diaminodiphenyl sulfone, j)1,3-bis(3-aminophenoxy) benzene, o)3,3′-diamino-4,4′-diphenoxybenzophenone, r) pyromellitic dianhydride, s)3,3′,4,4′-biphenyltetracarboxylic acid anhydride, and t)3,3′,4,4′-benzophenonetetracarboxylic acid anhydride.

Using the thus-obtained varnishes, films were prepared under similarconditions as in Examples 33-37. Those films were punched by a die,whereby elongated rectangular specimens of 5.00 mm in width and 260 mmin length were obtained. Using those specimens, a chemical resistancetest was performed.

Described specifically, each film was held in place at portions 5.00 mmapart from opposite ends thereof. Using a device capable of finelyadjusting the distance between those portions, the distance betweenthose portions was set at 251.75 mm. Under those conditions, thespecimen was immersed together with the device in toluene or methylethyl ketone. One hour, 24 hours and 168 hours later, the specimen wastaken out of the solvent and visually observed for cracks. The resultsare shown together with the logarithmic viscosity numbers of thevarnishes in Table A28.

Incidentally, “A”, “B” and “C” in Table A28 indicate “completely free ofcracks”, “cracks observed in a very small number” and “cracks observedin a large number”, respectively, in this order. Further, “MEK” standsfor methyl ethyl ketone.

TABLE A28 Loga- rithmic Ex./ viscosity Toluene MEK Comp. numberimmersion time immersion time Ex. No. [dL/g] 1 hr. 24 hr. 168 hr. 1 hr.24 hr. 168 hr. Example 0.455 A A A A A A A70 Example 0.461 A A A A A AA71 Example 0.449 A A A A A B A72 Example 0.466 A A A A A B A73 Example0.480 A A A A A A A74 Example 0.452 A A A A A A A75 Comp.Ex. 0.449 A B BB C C A48 Comp.Ex. 0.466 A B B B C C A49 Comp.Ex. 0.453 A B B C C C A50Comp.Ex. 0.470 A B B C C C A51 Comp.Ex. 0.478 A B B B C C A52 Comp.Ex.0.451 A A B B B C A53

Examples A76-A79, Comparative Example A54

In each of these examples and comparative example, a 15% (W/W) polyamicacid varnish was obtained in a similar manner as in Examples A33-A37 byusing dimethylformamide as a solvent and4,4′-bis(3-aminophenoxy)biphenyl (368.43 g, 1.000 mol) and pyromelliticdianhydride (142.00 g, 0.651 mol) and3,3′,4,4′-benzophenonetetracarboxylic acid dianhydride (89.90 g, 0.279mol) as monomers together with the corresponding end blocking agent(s)the amount(s) and kind(s) of which are shown in Table A29.

Using the thus-obtained varnishes, films were prepared under similarconditions as in Examples 33-37. Employing those films, a chemicalresistance test was performed in toluene in a similar manner as inExamples A70-A75. The results are shown together with the logarithmicviscosity numbers of the varnishes in Table A29.

Incidentally, “A”, “B” and “C” in Table A28 indicate “completely free ofcracks”, “cracks observed in a very small number” and “cracks observedin a large number”, respectively, in this order.

TABLE A29 Loga- End blocking agent rithmic (one to three kinds) visco-Ex./ Charged Charged sity Toluene Comp. amount amount number immersiontime Ex. No. Kind/ [g]/ [mol] [dL/g] 1 hr. 24 hr. 168 hr. Example A)14.52 0.0980 0.421 A A A A76 C) 14.29 0.0420 Example A) 14.52 0.09800.410 A A A A77 D) 14.80 0.0420 Example A) 11.41 0.0770 0.415 A A A A78E) 18.79 0.0630 Example A) 14.52 0.0980 0.411 A A A A79 B) 8.238 0.0280C) 9.529 0.0280 Comp. A) 17.94 0.140 0.418 A B B Ex. A54 [Note] In TableA29, the end blocking agents are indicated by the following signs: A)phthalic anhydride B) 1-phenyl-2-(3,4-dicarboxyphenyl)acetyleneanhydride, C) 1-phenyl-2-(4-(3,4-dicarboxyphenoxy)phenyl)acetyleneanhydride, D) 1-phenyl-2-(4-(3,4-dicarboxybenzoyl)phenyl)acetyleneanhydride, and E) 2,3-dicarboxy-6-(phenylethynyl)naphthalene anhydride.

From the above results, it is evident thatcrosslinkable-group-containing polyimides according to the presentinvention, which have various structures, are far superior in heatresistance to similar polymers having no crosslinkable groups.

Examples A80-A82

Using the polyimide powders employed above in Examples A28-A30, theirmelt viscosities were measured by varying the measuring temperature andthe residence time in various ways within a range of from 300° C. to400° C. The results are shown in Table A30.

Incidentally, the shearing stress under those measuring conditions wasconstant at 0.245 MPa.

TABLE A30 Ex. No. of Measuring Melt viscosity Ex. used temp. [Pa · S]No. powder [° C.] 5 min. 30 min. Example Example 300 No flow ← A80 A28320 58000 59200 340 10800 11500 360  3280  4120 380  1650  7820 400 1770 18000 Example Example 300 No flow ← A81 A29 320 11500 11600 340 2110  2300 360  890  1130 380  510  3810 400  550  6930 Example Example300 38400 35500 A82 A30 320  3100  3110 340  750  770 360  360  390 380 190  860 400  230  2990

Comparative Examples A55-A57

Using the polyimide powders employed above in Comparative ExamplesA14-A16, their melt viscosities and the temperature dependency of theirmelt viscosity stability were ascertained in a similar manner as inExample A80-A82.

The results are shown in Table A31.

TABLE A31 Comp. Comp. Ex. No. Measuring Melt viscosity Ex. of used temp.[Pa · S] No. powder [° C.] 5 min. 30 min. Comp.Ex. Comp.Ex. 300 No flow← A55 A14 320 62000 101000 340 13900 No flow 360 No flow ← 380 No flow ←400 No flow ← Comp.Ex. Comp.Ex. 300 No flow ← A55 A15 320 16600  33100340  3450 No flow 360 No flow ← 380 No flow ← 400 No flow ← Comp.Ex.Comp.Ex. 300 37700  36400 A57 A16 320  4020  10440 340  1330 No flow 360 7830 No flow 380 No flow ← 400 No flow ←

From the results of Examples A80-A82 and Comparative Examples A55-A57,it is evident that over a wide temperature range, thecrosslinkable-group-containing polyimide according to the presentinvention has high stability in melt viscosity and hence, excellentmoldability or formability.

Examples A83-A87

Using a melt viscoelasticity meter (“RDS-II” manufactured by RheometrixScientific F.E.) equipped with parallel plates (e.g., 25 mm disposable),the gel times of the powders polymerized in Examples A13-A17 weremeasured at various temperatures. Incidentally, the term “gel time”means a time which is required until a gel point is reached at aconstant frequency and a given temperature. The term “gel point”, inturn, means an intersecting point between lines G′ and G″ when storagemodulus G′ and loss modulus G″ are each plotted as a function of time t(min.).

The measurement was performed up to 2 hours at each temperature. Theresults are shown in Table A32. Incidentally, “>120” which appears inTable A32 indicates that no gel point was reached within the measuringtime.

TABLE A32 Ex. No. of Measuring Ex. No. used powder temp. [° C.] Gel time[min.] Example A83 Example A13 330 >120 360 >120 390 >120 Example A84Example A14 330 >120 360 >120 390 52 Example A85 Example A15 330 >120360 112 390 31 Example A86 Example A16 330 >120 360 45 390 17 ExampleA87 Example A17 330 >120 360 22 390 8

Comparative Examples A58-A59

The gel times of the powders, which were polymerized in ComparativeExamples A6-A7, at various temperatures were measured in a similarmanner as in Example A83-A87. The resulted are shown in Table A33.

TABLE A33 Comp. Ex. No. Measuring Gel time Comp. Ex. No. of used powdertemp. [° C.] [min.] Comp. Ex. A58 Comp. Ex. A6 330 55 360 6 390 3 Comp.Ex. A59 Comp. Ex. A7 330 15 360 3 390 2

From the results of Examples A83-A87 and Comparative Examples A58-A59,it is evident that over a wide temperature range thecrosslinkable-group-containing polyimide according to the presentinvention is slow in gelation and hence, is excellent in moldability orformability.

Examples A88-A91, Comparative Examples A60-A63

Polyimide powder was obtained in exactly the same manner as in thereaction (A) described in Examples A46-A49 except that the amounts ofthe end blocking agents of the kinds were changed to only1-phenyl-2-(3,4-dicarboxyphenyl)acetylene anhydride (69.50 g, 280.00mmol). This polyimide powder will be identified by (C).

Further, the polyimide powder obtained in the reaction (B) described inExamples A46-A49 and the above-described polyimide (C) were blended atthe ratios described in Table A34, respectively, whereby homogeneousmixed powders were obtained. These mixed powders will be identified by(D) and (E).

Physical properties of the mixed powders (C)-(E) are shown in Table A34.

TABLE A34 Blending ratio Logarithmic Glass 5% Weight (B)/(C) viscositytransition loss temp. [wt/wt] [dL/g] temp. [° C.] [° C.] (C) — 0.427 234560 (D) 50/50 0.426 234 560 (E) 10/90 0.426 234 560

The polyimide powders (D) and (E) obtained above were separatelyextruded into pellets in a similar manner as in Examples A46-A49, andtheir compression molding and chemical resistance test were performed.

The results are shown in Table A35.

TABLE A35 Compression Retention of break Ex./Comp. Ex. Used moldingstrength [%] No. powder conditions Toluene MEK Example A88 (D) 390° C.,6 hr. 91.8 68.5 Example A89 (D) 370° C., 6 hr. 92.1 73.0 Example A90 (D)350° C., 6 hr. 90.7 70.2 Example A91 (D) 330° C., 6 hr. 88.0 64.4 Comp.Ex. A60 (E) 390° C., 6 hr. 78.3 42.2 Comp. Ex. A61 (E) 370° C., 6 hr.82.0 42.6 Comp. Ex. A62 (E) 350° C., 6 hr. 81.4 43.3 Comp. Ex. A63 (E)330° C., 6 hr. 80.3 45.9 [Note] In Table A35, “MEK” stands for methylethyl ketone.

From the above results, it is evident thatcrosslinkable-group-containing polyimides according to the presentinvention, which are available from blending, can also be significantlyimproved in chemical resistance by annealing under various conditionsirrespective of the annealing temperature. It is appreciated that thiseffect cannot be expected from the polyimides of the. comparativeexamples.

Experiment B Series

In Example B1 to Example B62, a description will be made about certainexamples out of the present invention, in each of which 50 to 100 mole %of recurring structural units in a backbone structure are of a recurringunit structure represented by:

wherein X represents a divalent linking group selected from the groupconsisting of a direct bond, a carbonyl group, a sulfone group, asulfide group, an ether group, an isopropylidene group and ahexafluoroisopropylidene group; and

R represents a tetravalent aromatic group selected from the groupconsisting of:

 wherein G represents a divalent aromatic group selected from the groupconsisting of a direct bond, a carbonyl group, a sulfone group, asulfide group, an ether group, an isopropylidene group, ahexafluoroisopropylidene group, and at least one divalent linking groupselected from the group of substituent groups represented by thefollowing formulas:

Examples B1-B7, Comparative Examples B1-B3

In each of these examples and comparative examples, 3,4′-diaminodiphenylether (200.24 g, 1.000 mol), 3,3′,4,4′-biphenyltetracarboxylic aciddianhydride (138.28 g, 0.470 mol) and bis(3,4-dicarboxyphenyl)etherdianhydride (145.80 g, 0.470 mol) were charged as monomers together withthe corresponding end blocking agent(s), the kind(s) and amount(s) ofwhich are shown in Table B1, and m-cresol (1,937 g) as a solvent into avessel equipped with a stirrer, a reflux condenser, a water trap and anitrogen gas inlet tube. The contents were heated with stirring to 200°C. over 2 hours and 30 minutes under a nitrogen atmosphere, andreactions were conducted under 200° C. reflux conditions for 4 hours. InTable B1, “PA” stands for phthalic anhydride, and “PCE” stands for1-phenyl-2-(3,4-dicarboxyphenyl)-acetylene anhydride.

TABLE B1 Charged amount Charged amount Ex./Comp. Ex. of PA of PCE PA/PCENo. [g] [‘nmol] [g] [mmol] molar ratio Example B1 17.60 118.8 0.29791.200 99/1  Example B2 16.89 114.0 1.489 6.000 95/5  Example B3 16.00108.0 2.979 12.00 90/10 Example B4 14.22 96.00 5.958 24.00 80/20 ExampleB5 10.66 72.00 11.92 48.00 60/40 Example B6 7.110 48.00 17.87 72.0040/60 Example B7 3.555 24.00 23.83 96.00 20/80 Comp. Ex. B1 2.666 18.0025.32 102.0 15/85 Comp. Ex. B2 0 0 29.79 120.0  0/100 Comp. Ex. B3 17.77120.0 0 0 100/0 

The temperature was then lowered to 190° C., at which the correspondingend blocking agent(s) shown in Table B1 was (were) charged again. Theresulting contents were heated again, and the reactions were thenconducted under 200° C. reflux conditions for further 4 hours.

The reaction mixture was thereafter cooled to 100° C., the resultingviscous polymer solution was discharged into toluene (10 liters) whichwas under vigorous agitation, and a precipitate was then collected byfiltration. The precipitate was again suspended and allowed toreprecipitate in toluene (4 liters). After the reprecipitate wascollected by filtration and then provisionally dried at 50° C. for 24hours, the reprecipitate was dried at 210° C. for 12 hours under anitrogen gas stream. The yield of the thus-obtained powder and thelogarithmic viscosity number, glass transition temperature, 5% weightloss temperature and melt viscosity (360° C./5 min.) are shown in TableB2.

TABLE B2 Logarith- Melt mic Glass viscosity viscosity transition 5%Weight 360 [° C.] Ex./Comp. Ex. Yield number temp. loss 5 min. No. [g][dL/g] [° C.] temp. [° C.] [Pa · S] Example B1 430.4 0.465 231 560 1020Example B2 429.9 0.463 232 561 1150 Example B3 431.0 0.465 231 560 1160Example B4 432.9 0.469 231 558 1110 Example B5 433.5 0.464 232 559 1250Example B6 434.0 0.470 232 561 1410 Example B7 433.9 0.477 231 560 1830Comp. Ex. B1 434.0 0.470 232 561 No flow Comp. Ex. B2 435.2 0.471 231560 No flow Comp. Ex. B3 429.6 0.459 233 561  990

The present invention is characterized in that concerning the moleculeends; the molar ratio of the chemical formula (2a) to the chemicalformula (2b) ranges from 1/99 to 80/20 as recited in certain claims.From the above-described results, it is also evident that those havingmolar ratios of the chemical formula (2a) to the chemical formula (2b)greater than 80/20 are considerably inferior in moldability orformability to those having molar ratios of the chemical formula (2a) tothe chemical formula (2b) equal to or smaller than 80/20.

Examples B8-B12, Comparative Examples B4,B5

Using the powders obtained in Examples B2-B6 and Comparative Example B3,compression molding was conducted. The powders used in the respectiveexamples and comparative examples are shown next in Table B3.

TABLE B3 Ex./Comp. Ex. No. Ex./Comp. Ex. No. of used powder Example B8Example B2 Example B9 Example B3 Example B10 Example B4 Example B11Example B5 Example B12 Example B6 Comp. Ex. B4, B5 Comp. Ex. B3

Described specifically, in each of these examples and comparativeexamples, the powder was extruded into pellets at 355° C. by asingle-screw extruder of 25 mm in barrel diameter. After the pelletswere filled in a compression mold of configurations specified inASTM-D-638, Compression molding was conducted at 360° C. for 12 hours(Examples B8-B12, Comparative Example B4) or under conditions of 360° C.and 5 minutes (Comparative Example 5). In all the examples andcomparative examples, good molded products were obtained. Using thosemolded products, a tensile test was performed at room temperature (23°C). The results are shown in Table B4. In Table B4, “PA/PCE molar ratio”means the molar ratio of phthalic anhydride to1-phenyl-2-(3,4-dicarboxyphenyl)-acetylene anhydride.

TABLE B4 PA/PCE Break Yield Modulus of Ex./Comp. Ex. molar strengthstrength elasticity Elongation No. ratio [Mpa] [Mpa] [MPa] [%] ExampleB8 95/5  92.90 103.00 2290 76.6 Example B9 90/10 94.50 99.00 2330 70.9Example B10 80/20 94.30 100.00 2370 66.6 Example B11 60/40 94.80 105.002550 69.2 Example B12 40/60 95.00 108.00 2760 59.3 Comp. Ex. B4 100/0 90.10 96.90 2170 69.0 Comp. Ex. B5 100/0  90.50 97.00 2180 72.5

The present invention is characterized in that concerning the moleculeends, the molar ratio of the chemical formula (2a) to the chemicalformula (2b) ranges from 1/99 to 80/20 as recited in certain claims.From the above-described results, it is also evident that those havingmolar ratios of the chemical formula (2a) to the chemical formula (2b)not reaching 1/99 are inferior in mechanical properties to those havingmolar ratios of the chemical formula (2a) to the chemical formula (2b)equal to or greater than 1/99.

Examples B13-B17, Comparative Examples B6-B8

In each of these examples and comparative examples, 3,4′-diaminidiphenylether (200.24 g, 1.000 mol), 3,3′,4,4′-biphenyltetracarboxylic aciddianhydride (138.28 g, 0.470 mol) and bis(3,4-dicarboxyphenyl)etherdianhydride (145.80 g, 0.470 mol) were charged as monomers together withm-cresol (1,737 g) as a solvent into a vessel equipped with a stirrer, areflux condenser, a water trap and a nitrogen gas inlet tube. Thecontents were heated with stirring to 200° C. over 2 hours and 30minutes under a nitrogen atmosphere, and a reaction was conducted under200° C. reflux conditions for 2 hours, whereby a solution of anend-unblocked polymer was obtained. During the reaction, thecorresponding end blocking agent(s) described in Table B5 and m-cresol(200.0 mL) were charged into another vessel and were then heatedbeforehand at 100° C. for 1 hour under a nitrogen atmosphere to providea solution. The solution of the end blocking agent(s) was charged in itsentirety into the solution of the end-unblocked polymer, and reaction(s)was (were) then conducted under 200° C. reflux conditions for 2 hours.In Table B5, “PA” stands for phthalic anhydride, and “PCE” stands for1-phenyl-2-(3,4-dicarboxyphenyl)acetylene anhydride.

TABLE B5 Charged amount Charged amount Ex./Comp. Ex. of PA of PCE PA/PCENo. [g] [mmol] [g] [mmol] molar ratio Example B13 33.77 228.0 2.979 12.095/5  Example B14 31.99 216.0 5.958 24.0 90/10 Example B15 28.44 192.011.96 48.0 80/20 Example B16 21.33 144.0 23.83 96.0 60/40 Example B1714.21 96.00 35.75 144.0 40/60 Comp. Ex. B6 5.332 36.00 50.64 204.0 15/85Comp. Ex. B7 0 0 59.58 240.0  0/100 Comp. Ex. B8 35.55 240.0 0 0 100/0 

The reaction mixture was thereafter cooled to 100° C. While maintainingthe resultant viscous polymer solution at 100° C., toluene (2 liters)which had been heated at 100° C. was charged into the polymer solutionand further, toluene (6 liters) was charged dropwise over 4 hours. Aftertoluene (4 liters) was charged, the resulting mixture was allowed tocool down to room temperature. A precipitate was then collected byfiltration. The precipitate was again suspended and allowed toreprecipitate in toluene (4 liters). After the reprecipitate wascollected by filtration and then provisionally dried at 50° C. for 24hours, the reprecipitate was dried at 200° C. under reduced pressure for12 hours under a gentle nitrogen gas stream. The yield of thethus-obtained powder and the logarithmic viscosity number, glasstransition temperature, 5% weight loss temperature and melt viscosity(360° C./5 min.) are shown in Table B6.

TABLE B6 Logarith- Melt mic Glass viscosity viscosity transition 5%Weight 360 [° C.] Ex./Comp. Ex. Yield number temp. loss 5 min. No. [g][dL/g] [° C.] temp. [° C.] [Pa · S] Example B13 430.8 0.466 232 561 1100Example B14 431.7 0.468 233 560 1080 Example B15 430.2 0.467 233 5601140 Example B16 432.8 0.466 232 558 1180 Example B17 433.7 0.470 233556 1310 Comp. Ex. B6 434.3 0.474 233 560 No flow Comp. Ex. B7 435.00.470 233 557 No flow Comp. Ex. B8 428.9 0.470 231 560 1150

The present invention is characterized in that concerning the moleculeends, the molar ratio of the chemical formula (2a) to the chemicalformula (2b) ranges from 1/99 to 80/20 as recited in certain claims.From the above-described results, it is also evident that those havingmolar ratios of the chemical formula (2a) to the chemical formula (2b)greater than 80/20 are considerably inferior in moldability orformability to those having molar ratios of the chemical formula (2a) tothe chemical formula (2b) equal to or smaller than 80/20.

Examples B18-B22, Comparative Examples B9,B10

Using the powders obtained in Examples B13-B17 and Comparative ExampleB8, compression molding was conducted. The powders used in therespective examples and comparative examples are shown next in Table B7.

TABLE B7 Ex./Comp. Ex. No. Ex./Comp. Ex. No. of used powder Example B18Example B13 Example B19 Example B14 Example B20 Example B15 Example B21Example B16 Example B22 Example B17 Comp. Ex. B9, B10 Comp. Ex. B8

Described specifically, in each of these examples and comparativeexamples, the powder was extruded into pellets at 355° C. by asingle-screw extruder of 25 mm in barrel diameter. After the pelletswere filled in a compression mold having a size of 10.0 mm in width and80.0 mm in length, compression molding was conducted at 360° C. for 12hours (Examples B18-B22, Comparative Example B9) or under conditions of360° C. and 5 minutes (Comparative Example 10). In all the examples andcomparative examples, good molded products were obtained. Thosespecimens were all of 10.0 mm±0.010 mm in width, 80.0 mm±0.010 mm inlength and 1.500 mm±0.010 mm in thickness. Using those molded products,a chemical resistance test was performed. Described specifically, eachspecimen was held in place at portions 5.00 mm apart from opposite endsthereof, and was then adjusted and fixed such that a displacement of3.50 mm in the direction of the thickness would be given when thespecimen was bent by a jig maintained in contact with the specimen at acenter thereof (a portion 40.0 mm apart from the respective ends). Underthose conditions, the specimen was immersed in toluene or methyl ethylketone. One hour, 24 hours and 168 hours later, the specimen was takenout of the solvent and visually observed for cracks.

The results of the chemical resistance test are shown in Table B8. InTable B8, “A”, “B” and “C” indicate “completely free of cracks”, “cracksobserved in a very small number” and “cracks observed in a largenumber”, respectively, in this order. Further, “PA/PCE molar ratio”means the molar ratio of phthalic anhydride to1-phenyl-2-(3,4-dicarboxy-phenyl)acetylene anhydride, and “MEK” standsfor methyl ethyl ketone.

TABLE B8 Toluene MEK immersion PA/PCE Ex./Comp. Ex. immersion time timemolar No. 1 hr. 24 hr. 168 hr. 1 hr. 24 hr. 168 hr. ratio Example B18 AA A A B B 95/5  Example B19 A A A A A B 90/10 Example B20 A A A A A A80/20 Example B21 A A A A A A 60/40 Example B22 A A A A A A 40/60 Comp.Ex. B9 A A B B C C  0/100 Comp. Ex. B10 A A B B C C  0/100

The present invention is characterized in that concerning the moleculeends, the molar ratio of the chemical formula (2a) to the chemicalformula (2b) ranges from 1/99 to 80/20 as recited in certain claims.From the above-described results, it is evident that those having molarratios of the chemical formula (2a) to the chemical formula (2b) notreaching 1/99 are inferior in chemical resistance to those having molarratios of the chemical formula (2a) to the chemical formula (2b) equalto or greater than 1/99.

Examples B23-B32, Comparative Examples B11-B16

In each of these examples and comparative examples, the following tworeactions (A),(B) were conducted.

(A) 3,4-Diaminodiphenyl ether (200.24 g, 1.000 mol),3,3′,4,4′-biphenyltetracarboxylic acid dianhydride (138.28 g, 0.470 mol)and 3,3′,4,4′-benzophenonetetracarboxylic acid dianhydride (151.45 g,0.470 mol) were charged as monomers together with phthalic anhydride(10.66 g, 72.00 mmol) and 1-phenyl-2-(3,4-dicarboxyphenyl)acetyleneanhydride (11.92 g, 48.00 mmol) as end blocking agents, m-cresol (1,960g) as a solvent, and γ-picoline (13.970 g, 0.1500 mol) as a catalystinto a vessel equipped with a stirrer, a reflux condenser, a water trapand a nitrogen gas inlet tube. The contents were heated with stirring to150° C. over 2 hours under a nitrogen atmosphere, and reactions wereconducted at 150° C. for 2 hours.

As end blocking agents, phthalic anhydride (5.33.g, 36.00 mmol) and1-phenyl-2-(3,4-dicarboxyphenyl)acetylene anhydride (5.96 g, 24.00 mmol)were then charged, followed by the reactions at 150° C. for further 8hours.

The reaction mixture was thereafter cooled to 60° C., the resultingviscous polymer solution was discharged into methyl ethyl ketone (10liters) which was under vigorous agitation, and a precipitate was thencollected by filtration. The precipitate was again suspended and allowedto reprecipitate in methyl ethyl ketone (4 liters). After thereprecipitate was collected by filtration and then provisionally driedat 50° C. for 24 hours, the reprecipitate was dried at 220° C. for 12hours under a nitrogen gas stream, whereby polyimide powder wasobtained.

(B) In each of these examples and comparative examples, polyimide powderwas obtained in exactly the same manner as in the reaction (A) exceptthat upon preparation of the make-up, the amount(s) of the end blockingagent(s) of the kind(s) was (were) changed to only phthalic anhydride(17.77 g, 120.00 mmol) and that during the reactions, the amount(s) ofthe end blocking agent(s) of the kind(s) was(were) changed to onlyphthalic anhydride (8.89 g, 60.00 mmol).

The yields of the powders obtained in the two reactions (A), (B) andtheir logarithmic viscosity numbers, glass transition temperatures, 5%weight loss temperatures and melt viscosities (360° C./5 min.) are shownin Table B9.

Further, each powder was extruded into pellets at 355° C. by asingle-screw extruder of 25 mm in barrel diameter. After the pelletswere filled in a compression mold of the shape specified in ASTM-D-638,compression molding was conducted under the conditions described inTable B10.

TABLE B9 Logarithmic Melt viscosity viscosity Glass 5% 360 [° C.] Yieldnumber transition Weight loss 5 min. [g] [dL/g] temp. [° C.] temp. [°C.] [Pa · S] (A) 465.4 0.462 240 554 1450 (B) 462.4 0.461 239 553 1430

TABLE B10 Compression molding Ex. Comp. Ex. No. Used Powder conditionsExamples B23, B28 (A) 350° C., 2 hr. Examples B24, B29 (A) 350° C., 6hr. Examples B25, B30 (A) 350° C., 12 hr. Examples B26, B31 (A) 350° C.,24 hr. Examples B27, B32 (A) 350° C., 72 hr. Comp. Ex. B11, B14 (B) 350°C., 2 hr. Comp. Ex. B12, B15 (B) 350° C., 12 hr. Comp. Ex. B13, B16 (B)350° C., 72 hr.

Using the specimens so obtained, a tensile test at room temperature (23°C.) and a high-temperature tensile test at 177° C. were performed. Theresults are shown in Table B11.

TABLE B11 Test- Modulus PA/PCE ing Break Yield of Elonga- Ex./comp. Ex.molar temp. strength strength elasticity tion No. ratio [° C.] [MPa][MPa] [MPa] [%] Example B23 60/40 23 85.90 95.00 2720 45.2 Example B2460/40 23 83.30 97.00 2770 42.0 Example B25 60/40 23 95.00 100.00 289045.5 Example B26 60/40 23 101.00 103.00 2950 46.3 Example B27 60/40 23104.00 105.00 3010 50.1 Comp. Ex. B11 100/0  23 85.50 90.20 2490 46.1Comp. Ex. B12 100/0  23 85.40 89.90 2510 40.9 Comp. Ex. B13 100/0  2380.80 91.10 2600 12.5 Example B28 60/40 177 68.80 67.40 1950 101 ExampleB29 60/40 177 71.00 68.80 2010 121 Example B30 60/40 177 73.50 70.902020 115 Example B31 60/40 177 77.70 73.10 2200 126 Example B32 60/40177 79.50 78.10 2410 116 Comp. Ex. B14 100/0  177 57.10 49.90 1780 99.2Comp. Ex. B15 100/0  177 58.80 50.40 1820 76.0 Comp. Ex. B16 100/0  17760.10 55.60 1880 60.7

From the foregoing, it is evident that thecrosslinkable-group-containing polyimide according to the presentinvention can be significantly improved in room-temperature andhigh-temperature mechanical properties by annealing, and it is alsoappreciated that this effect cannot be expected from the conventionalpolyimides of the comparative examples.

Examples B28-B32, Comparative Examples B14-B16

In each of these examples and comparative examples,bis(3,4-dicarboxyphenyl)ether dianhydride and1,4-bis(3,4-dicarboxyphenoxy)benzene dianhydride were charged in theircorresponding amounts shown in Table B12 together with4,4′-diaminodiphenyl ether (200.24 g, 1.000 mol), all as monomers, intoa vessel equipped with a stirrer, a reflux condenser, a water trap and anitrogen gas inlet tube. As a solvent, m-cresol was also charged in itscorresponding amount shown in Table B12. The contents were heated withstirring to 200° C. over 2 hours and 30 minutes under a nitrogenatmosphere, and a reaction was conducted under 200° C. reflux conditionsfor 2 hours, whereby a solution of an end-unblocked polymer wasobtained. In Table B12, “ODPA” stands for bis(3,4-dicarboxyphenyl)etherdianhydride, and “HQDA” stands for 1,4-bis(3,4-dicarboxyphenoxy)benzenedianhydride.

TABLE B12 Charged Ex./ Charged Charged amount of Comp.Ex. amount of ODPAamount of HQDA m-cresol No. [g] [mol] [g] [mol] [g] Example B28 208.470.6720 115.87 0.2880 1097 Examples B29, 31 201.95 0.6510 112.25 0.27901057 Examples B30, 32 195.44 0.6300 108.63 0.2700 1016 Comp.Ex. B14208.47 0.6720 115.87 0.2880 1097 Comp.Ex. B15 201.95 0.6510 112.250.2790 1057 Comp.Ex. B16 195.44 0.6300 108.63 0.2700 1016

During the reaction, the corresponding end blocking agents described inTable B13 and m-cresol (200.0 mL) were charged into another vessel andwere then heated beforehand at 100° C. for 1 hour under a nitrogenatmosphere to provide a solution. The solution of the end blockingagents was charged in its entirety into the solution of theend-unblocked polymer, and reactions were then conducted under 200° C.reflux conditions for 2 hours. In Table B13, “PA” stands for phthalicanhydride, and “PCE” stands for1-phenyl-2-(3,4-dicarboxyphenyl)-acetylene anhydride.

TABLE B13 Ex./ Charged amount Charged amount PA/PCE Comp.Ex. of PA ofPCE molar No. [g] [mmol] [g] [mmol] ratio Example B28 16.59 112.0 11.9248.00 70/30 Example B29 29.03 196.0 20.85 84.00 70/30 Example B30 41.47280.0 29.79 120.0 70/30 Example B31 20.74 140.0 34.75 140.0 50/50Example B32 29.62 200.0 49.45 200.0 50/50 Comp.Ex. B14 3.555 24.00 33.76136.0 15/85 Comp.Ex. B15 6.221 42.00 59.08 238.0 15/85 Comp.Ex. B168.887 60.00 84.40 340.0 15/85

The reaction mixture was thereafter cooled to 60° C., the resultingviscous polymer solution was discharged into methyl ethyl ketone (10liters) which was under vigorous agitation, and a precipitate was thencollected by filtration. The precipitate was again suspended and allowedto reprecipitate in methyl ethyl ketone (4 liters). After thereprecipitate was collected by filtration and then provisionally driedat 50° C. for 24 hours, the reprecipitate was dried at 220° C. for 12hours under a nitrogen gas stream, whereby polyimide powder wasobtained.

The logarithmic viscosity number, glass transition temperature and meltviscosity (360° C./5 min., 15 min., 30 min.) of the thus-obtainedpolyimide powder are shown in Table B14.

TABLE B14 Logarithmic viscosity Glass 360° C. Melt viscosity Ex./Comp.Ex. number transition [Pa · S] No. [dL/g] temp. [° C.] 5 min. 15 min. 30min. Example B28 0.718 240 4400 4990 6010 Example B29 0.419 235 10201140 1450 Example B30 0.322 231 380 400 440 Example B31 0.425 234 10801460 6540 Example B32 0.321 231 390 600 1880 Comp. Ex. B14 0.714 239 Noflow ← ← Comp. Ex. B15 0.427 236 No flow ← ← Comp. Ex. B16 0.328 23110200 No flow ←

It is appreciated from the results that thecrosslinkable-group-containing polyimide according to the presentinvention, even at various molecular weights (or logarithmic viscositynumbers correlating with the molecular weights), has good melt fluidityand is better in moldability or formability than the polyimides of thecomparative examples.

Examples B33-B37, Comparative Examples B17-B19

In each of these examples and comparative examples,3,3′,4,4′-biphenyltetracarboxylic acid dianhydride andN-methyl-2-pyrrolidone were charged in their corresponding amounts shownin Table B15 together with 3,4′-diaminodiphenyl ether (200.24 g, 1.000mol) into a vessel equipped with a stirrer and a nitrogen gas inlettube. While stirring the contents under a nitrogen atmosphere, areaction was conducted at room temperature for 12 hours, whereby apolyamic acid varnish was obtained. The corresponding end blockingagents, the kind(s) and amount(s) of which are shown in Table B15, werecharged into the thus-obtained varnish, followed by reactions at roomtemperature for 12 hours. In Table B15, “BPDA”, “NMP”, “PA” and “PCE”stand for pyromellitic dianhydride, N-methyl-2-pyrrolidone, phthalicanhydride, and 1-phenyl-2-(3,4-dicarboxyphenyl)acetylene anhydride,respectively.

TABLE B15 A- Ex./ Charged mount Charged Comp. amount of Charged amountEx. of PMDA NMP amount of PA of PCE No. [g] [mol] [g] [g] [mol] [g][mol] Exam- 291.28 0.990 3604 1.481 10.00 2.482 10.00 ple B33 Exam-282.54 0.960 2736 5.925 40.00 9.930 40.00 ple B34 Exam- 273.62 0.9302685 10.37 70.00 17.38 70.00 ple B35 Exam- 264.80 0.900 1860 14.81 100.024.82 100.00 ple B36 Exam- 235.38 0.800 1307 29.62 200.0 49.45 200.00ple B37 Comp. 291.28 0.990 3604 2.962 20.00 0 0 Ex. B17 Comp. 273.620.930 2685 20.74 140.0 0 0 Ex. B18 Comp. 235.38 0.800 1307 59.25 400.0 00 Ex. B19

The logarithmic viscosity number of the thus-obtained polyamic acidvarnish is shown in Table B16.

Using that varnish, a film was prepared.

Described specifically, the varnish was evenly cast on a soft glassplate. Within an oven through which a nitrogen gas stream was flowing,the film was heated from 50° C. to 200° C. at a heating rate of 1° C.per minute, and was then cured at 200° C. for 2 hours. Further, the filmwas heated from 200° C. to 410° C. at a heating rate of 20° C. perminute, and was then annealed at 410° C. for 30 minutes. After theresulting film was quenched, hot water was poured over the film suchthat the film was peeled off from the glass plate. Incidentally, thefilm of Comparative Example 19 was so brittle that upon quenching, itshattered into small pieces, thereby failing to obtain a film. From thefilms of the remaining examples, good films were obtained.

A tensile test of each film, which had been obtained by theabove-described procedures, was performed at room temperature (23° C.).The results are shown in Table B16.

TABLE B16 Ex./ Logarithmic Break Yield Modulus of Elong- Comp.Ex.viscosity strength strength elasticity ation No. number [dL/g] [MPa][MPa] [MPa] [%] Example 1.66 100.00 105.00 2880 79.0 B33 Example 0.80196.50 105.00 2790 84.5 B34 Example 0.447 97.70 102.00 2770 76.8 B35Example 0.352 97.00 100.00 2780 87.3 B36 Example 0.256 97.50 102.00 274079.4 B37 Comp.Ex. 1.70 90.10 94.50 2230 70.1 B17 Comp.Ex. 0.450 88.9091.70 2250 56.2 B18 Comp.Ex. 0.254 — — — — B19

From the above results, it is evident that thecrosslinkable-group-containing polyimide according to the presentinvention, at various molecular weights (or logarithmic viscositynumbers correlating with the molecular weights), exhibits betterphysical properties than the polyimides of the comparative examples.

Examples B38-B42, Comparative Examples B20-B22

In each of these examples and comparative examples, 500 mL of thecorresponding one of the varnishes—which had been obtained in ExamplesB33-B37 and Comparative Examples B17-B19, respectively—were dischargedinto methanol (10 liters) which was under vigorous agitation, and aprecipitate was collected by filtration. The precipitate was washedfurther with methanol (800 mL). After provisional drying under reducedpressure at 50° C. for 24 hours, the precipitate was dehydrated andimidated under reduced pressure at 250° C. for 12 hours under a gentlenitrogen gas stream, whereby polyimide powder was obtained. The usedvarnish and the glass transition temperature and 5% weight losstemperature of the thus-obtained polyimide powder are shown in TableB17.

Further, the powder was placed on a heat-resistant dish, annealed undernitrogen gas at 420° C. for 1 hour, and then quenched. Thereafter, itsglass transition temperature and 5% weight loss temperature weremeasured. The results are shown in Table B17.

In Table B17, “Tg” indicates a glass transition temperature, and “Td5”designates a 5% weight loss temperature.

TABLE B17 Ex./Comp. Used Before annealing After annealing Ex. No.varnish Tg [° C.], Td5 [° C.] Tg [° C.], Td5 [° C.] Example Example 248560 271 550 B38 B33 Example Example 247 560 269 554 B39 B34 ExampleExample 246 561 269 553 B40 B35 Example Example 242 554 267 552 B41 B36Example Example 236 544 268 547 B42 B37 Comp.Ex. Comp.Ex. 248 559 248552 B20 B17 Comp.Ex. Comp.Ex. 245 560 245 550 B21 B18 Comp.Ex. Comp.Ex.235 543 235 511 B22 B19

From these results, it is appreciated that, when annealed, thecrosslinkable-group-containing polyimide according to the presentinvention is significantly improved in glass transition temperature butthe polyimides of the comparative examples are not improved.

Examples B43-B45, Comparative Example B23

In each of these examples and comparative example, 3,4′-diaminodiphenylether (200.24 g, 1.000 mol) and 3,3′,4,4′-biphenyltetracarboxylic aciddianhydride (276.57 g, 0.940 mol) were charged as monomers together withm-cresol (1,707 g) as a solvent into a vessel equipped with a stirrer, areflux condenser, a water trap and a nitrogen gas inlet tube. Thecontents were heated with stirring to 200° C. over 2 hours and 30minutes under a nitrogen atmosphere, and a reaction was conducted under200° C. reflux conditions for 2 hours, whereby a solution of anend-unblocked polymer was obtained. During the reaction, thecorresponding end blocking agent(s) described in Table B18 and m-cresol(200.0 mL) were charged into another vessel and were then heatedbeforehand at 100° C. for 1 hour under a nitrogen atmosphere to providea solution. The solution of the end blocking agent(s) was charged in itsentirety into the solution of the end-unblocked polymer, and reaction(s)was(were) then conducted under 200° C. reflux conditions for 2 hours. InTable B18, “PA” stands for phthalic anhydride, and “PCE” stands for1-phenyl-2-(3,4-dicarboxyphenyl)acetylene anhydride.

TABLE B18 Ex./ Charged amount Charged amount PA/PCE Comp. of PA of PCEmolar Ex. No. [g] [mmol] [g] [mmol] ratio Example B43 33.77 228.0 2.97912.0 95/5  Example B44 31.99 216.0 5.958 24.0 90/10 Example B45 28.44192.0 11.92 48.0 80/20 Comp.Ex. B23 17.77 120.0 0 0 100/0 

The reaction mixture was thereafter cooled to 100° C. While maintainingthe resultant viscous polymer solution at 100° C., toluene (4 liters)was charged dropwise into the polymer solution over 4 hours. Aftertoluene (3 liters) which had been heated at 80° C. was additionallycharged, the resulting mixture was allowed to cool down to roomtemperature. Toluene (3 liters) was added further, followed by stirringfor 1 hour. A precipitate was then collected by filtration. Theprecipitate was again suspended and allowed to reprecipitate in toluene(4 liters). After the reprecipitate was collected by filtration and thenprovisionally dried at 50° C. for 24 hours, the reprecipitate was driedat 200° C. under reduced pressure for 12 hours under a gentle nitrogengas stream. The logarithmic viscosity number, glass transitiontemperature, crystal melting temperature, 5% weight loss temperature andmelt viscosity (420° C./5 min.) of the thus-obtained polyimide powderare shown in Table B19.

TABLE B19 Melt Logarithmic Glass Crystal 5% viscosity viscositytransition melting Weight 420 [° C.] Ex./Comp. number temp. temp. losstemp. 5 min. Ex. No. [dL/g] [° C.] [° C.] [° C.] [Pa · S] Example 0.473248 404 564 370 B43 Example 0.471 248 403 562 400 B44 Example 0.468 247403 563 490 B45 Comp.Ex. 0.468 248 403 564 350 B23

Using the polyimide powder so obtained, pelletization was conducted at420° C. by extrusion. Injection molding was then conducted at a resintemperature of from 315 to 425° C., an injection pressure of from 1,400to 1,600 kg/cm² and a mold temperature of 220° C., whereby a specimen ofthe shape specified in ASTM-D-638 was obtained.

To the thus-obtained specimen, annealing treatment was applied furtherunder a nitrogen gas stream, whereby the specimen was crystallized and,where the specimen was that of one of the examples, the specimen wassubjected to crosslinking. The annealing treatment consisted of thefollowing seven steps: {circle around (1)} heating from room temperatureto 240° C. at a heating rate of 5° C./min., {circle around (2)}annealing at 240° C. for 5 hours, {circle around (3)} heating from 240°C. to 300° C. at a heating rate of 5° C./min., {circle around (4)}annealing at 300° C. for 5 hours, {circle around (5)} heating from 300°C. to 380° C. at a heating rate of 5° C./min., {circle around (6)}annealing at 380° C. for 5 hours, and {circle around (7)} cooling toroom temperature at a cooling rate of 5° C./min.

Using the specimen, a tensile test was performed. The results are shownin Table B20.

TABLE B20 Ex./ Break Yield Modulus of Elonga- Comp. strength strengthelasticity tion Ex. No. [MPa] [MPa] [MPa] [%] Example B43 98.80 105.002560 13.5 Example B44 102.00 106.00 2580 18.6 Example B45 99.80 105.002670 24.4 Comp.Ex. B23 93.60 98.80 2490 12.0

From the above results, it is evident that thecrosslinkable-group-containing polyimide according to the presentinvention, even when crystallized, has good mechanical properties.

Examples B46-B49, Comparative Examples B24-B27

In each of these examples and comparative examples, the following tworeactions (A),(B) were conducted.

(A) 3,4′-diaminodiphenyl ether (200.24 g, 1.000 mol),3,3′,4,4′-biphenyltetracarboxylic acid anhydride (136.81 g, 0.465 mol)and bis(3,4-dicarboxyphenyl)ether dianhydride (144.25 g, 0.465 mol) werecharged as monomers together with m-cresol (1,925 g) as a solvent into avessel equipped with a stirrer, a reflux condenser, a water trap and anitrogen gas inlet tube. The contents were heated With stirring to 200°C. over 3 hours under a nitrogen atmosphere, and a reaction wasconducted under 200° C. reflux conditions for 2 hours, whereby asolution of an end-unblocked polymer was obtained. During the reaction,phthalic anhydride (20.74 g, 140.0 mmol) and1-phenyl-2-(3,4-dicarboxyphenyl)acetylene anhydride (34.75 g, 140.0mmol) were charged as end blocking agents together with m-cresol (200.0mL) into another vessel, and were then heated beforehand at 100° C. for1 hour under a nitrogen atmosphere to provide a solution. The solutionof the end blocking agents was charged in its entirety into the solutionof the end-unblocked polymer, and reactions were then conducted under200° C. reflux conditions for 2 hours. The reaction mixture wasthereafter cooled to 60° C., the resulting viscous polymer solution wasdischarged into:methanol, (10 liters) which was under vigorousagitation, and a precipitate was then collected by filtration. Theprecipitate was again suspended and allowed to reprecipitate in methanol(4 liters). After the reprecipitate was collected by filtration and thenprovisionally dried at 50° C. for 24 hours, the reprecipitate was driedat 220° C. for 12 hours under a nitrogen gas stream, whereby polyimidepowder was obtained.

(B) In each of these examples and comparative examples, polyimide powderwas obtained in exactly the same manner as in the reaction (A) exceptthat the amounts of the end blocking agents of the kinds were changed toonly phthalic anhydride (41.47 g, 280.00 mmol).

The logarithmic viscosity numbers, glass transition temperatures, 5%weight loss temperatures and melt viscosities (360° C./5 min.) of thepowders obtained in the two reactions (A), (B) are shown in Table B21.

Further, each powder was extruded into pellets at 355° C. by a 25-mmsingle-screw extruder. After the pellets were filled in a compressionmold of the shape specified in ASTM-D-638, compression molding wasconducted under the conditions described in Table B22. Using thethus-obtained specimen, a chemical resistance test was performed.Described specifically, the specimen was fixed on a jig in a statestretched by 0.5%, and was then immersed in toluene or methyl ethylketone at room temperature (23° C.) for 24 hours. Using the immersedspecimen, a tensile test was performed at room temperature (23° C.). Theresults of the tensile test were compared with those of a tensile testof a corresponding non-immersed specimen, and a break strength retention(%) was calculated. Incidentally, the term “break strength retention(%)” as used herein means a value expressed in terms of percentage bycomparing the break strength of an immersed specimen with the breakstrength of a corresponding non-immersed specimen.

The results are shown in Table B22. In Table B22, “MEK” stands formethyl ethyl ketone.

TABLE B21 Logarithmic Melt viscosity Glass 5% Weight viscosity numbertransition loss 360 [° C.] 5 min. [dL/g] temp. [° C.] temp. [° C.] [Pa ·S] (A) 0.440 228 560 950 (B) 0.441 227 560 910

TABLE B22 Ex./ Used Compression Retention of break Comp. pow- moldingstrength [%] Ex. No. der conditions Toluene MEK Example B46 (A) 390° C.,6 hr. 90.6 77.4 Example B47 (A) 370° C., 6 hr. 90.2 81.0 Example B48 (A)350° C., 6 hr. 87.6 75.1 Example B49 (A) 330° C., 6 hr. 84.1 66.5Comp.Ex. B24 (B) 390° C., 6 hr. 80.8 37.1 Comp.Ex. B25 (B) 370° C., 6hr. 83.2 41.2 Comp.Ex. B26 (B) 350° C., 6 hr. 82.6 42.4 Comp.Ex. B27 (B)330° C., 6 hr. 83.0 40.7

From the above results, it is evident that thecrosslinkable-group-containing polyimide according to the presentinvention is significantly improved in chemical resistance by annealingunder various conditions irrespective of the annealing temperature. Itis appreciated that this effect cannot be expected from the conventionalpolyimides of the comparative examples.

Examples B50-B54, Comparative Examples B28-B32

In each of these examples and comparative examples, polyimide powder wassynthesized in exactly the same manner as in Examples B13-B17 exceptthat the corresponding one of various diamines andbis(3,4-dicarboxyphenyl)ether dianhydride (288.50 g, 0.930 mol) wereused as monomers and that phthalic anhydride (20.74 g, 140.0 mmol) and1-phenyl-2-(3,4-dicarboxyphenyl)acetylene anhydride (34.75 g, 140.0mmol) were used as end blocking agents in each of the examples but onlyphthalic anhydride (41.47 g, 280.00 mmol) was used as an end blockingagent in each of the comparative examples.

Further, the thus-obtained polyimide powder was extruded into pellets at325° C. to 365° C. by a single-screw extruder of 25 mm in barreldiameter. After the pellets were filled in a compression mold of theshape specified in ASTM-D-648, compression molding was conducted underthe conditions of 360° C. and 6 hours.

Using the specimen so obtained, its heat distortion temperature wasmeasured.

The kinds and amounts of the diamines, which were used in the respectiveexamples and comparative examples, and the heat distortion temperaturesare shown in Table B23. In Table B23, the diamines are represented bythe following signs:

a) 3,3′-diaminodiphenyl ether,

b) 3,4′-diaminodiphenyl ether,

c) 4,4′-diaminodiphenyl ether,

e) 3,3′-diaminodiphenyl sulfone, and

h) 4,4′-diaminodiphenylmethane.

TABLE B23 Diamine Heat distortion Ex. Comp. Charged Charged temp. [° C.]No. Ex. No. Kind/ amount [g]/ amount [mol] Ex. Comp.Ex. B50 B28 a)200.24 1.000 255 220 B51 B29 b) 200.24 1.000 280 230 B52 B30 c) 200.241.000 290 255 B53 B31 e) 248.30 1.000 285 255 B54 B32 h) 198.27 1.000305 260

Examples B55-B59, Comparative Examples B33-B37

In each of these examples and comparative examples, polyimide powder wassynthesized in exactly the same manner as in Examples 23-32 except thatthe corresponding one of various diamines, 4,4′-diaminodiphenyl ether(180.22 g, 0.900 mol) and 1,4-bis(3,4-dicarboxyphenoxy)benzenedianhydride (374.16 g, 0.930 mol) were used as monomers and thatphthalic anhydride (20.74 g, 140.0 mmol) and1-phenyl-2-(3,4-dicarboxyphenyl)-acetylene anhydride (34.75 g, 140.0mmol) were used as end blocking agents in each of the examples but onlyphthalic anhydride (41.47 g, 280.00 mmol) was used as an end blockingagent in each of the comparative examples.

In a similar manner as in Examples B50-B54, specimens were then obtainedfrom the respective polyimide powders, and their heat distortiontemperatures were measured. The kinds and amounts of the diamines, whichwere used in the respective examples, and the heat distortiontemperatures are shown in Table B24. In Table B24, the diamines areindicated by the following signs:

a) 3,3′-diaminophenyl ether,

b) 4,4′-diaminodiphenyl ether,

c) 3,3′-diaminodiphenyl sulfide,

d) 3,3′-diaminobenzophenone,

e) 3,3′-diaminodiphenylmethane, and

f) 2,2-di(4-aminophenyl)propane.

TABLE B24 Diamine Heat distortion Ex. Comp. Charged Charged temp. [° C.]No. Ex. No. Kind/ amount [g]/ amount [mol] Ex. Comp.Ex. B55 B33 a) 20.020.100 280 250 B56 B34 c) 21.63 0.100 285 250 B57 B35 d) 21.23 0.100 280245 B58 B36 e) 19.83 0.100 275 250 B59 B37 f) 22.63 0.100 280 245

From the above tests, it is evident that crosslinkable-group-containingpolyimides according to the present invention, which have variousstructures, are considerably superior in heat resistance to similarpolymers having no crosslinkable groups.

Examples B60-B61, Comparative Example B38

Using the polyimide powders employed above in Examples B30 and B32 andComparative Example B16, their melt viscosities were measured in asimilar manner as in Examples A80-A82.

Further, with respect to those powders, their gel times at varioustemperatures were measured in a similar manner as in Examples A83-A87.

The results are shown in Table B25. Incidentally, “>120” which appearsin Table B25 indicates that no gel point was reached within themeasuring time.

TABLE B25 Ex./ Ex/Comp. Measuring Melt viscosity Gel Comp. Ex. No. temp.[Pa · S] time Ex. No. of used powder [° C.] 5 min. 30 min. [min] ExampleExample 320 6620 6770 >120 B60 B30 340 1110 1180 >120 360 380  410 62380 150  810 33 Example Example 320 6400 6720 >120 B61 B32 340 970 1160105 360 390 1880 26 380 330 10810  11 Comp. Comp. 320 6950 19000  >120Ex. Ex. 340 1080 63800  33 B38 16 360 10200 No flow 4 380 No flow ← 2

From the results, it is evident that over a wide temperature range, thecrosslinkable-group-containing polyimide according to the presentinvention has high stability in melt viscosity and is resistant togelation and hence, is excellent in moldability or formability.

Experiment C Series

In Example C1 to Example C39, a description will be made about certainexamples out of the present invention, in each of which 50 to 100 mole %of recurring structural units in a backbone structure are of a recurringunit structure represented by:

wherein X represents a divalent linking group selected from the groupconsisting of a direct bond, a carbonyl group, a sulfone group, asulfide group, an ether group, an isopropylidene group and ahexafluoroisopropylidene group; and

R represents a tetravalent aromatic group selected from the groupconsisting of:

 wherein G represents a divalent aromatic group selected from the groupconsisting of a direct bond, a carbonyl group, a sulfone group, asulfide group, an ether group, an isopropylidene group, ahexafluoroisopropylidene group, and at least one divalent linking groupselected from the group of substituent groups represented by thefollowing formulas:

Examples C1-C7, Comparative Examples C1-C3

In each of these examples and comparative examples1,3-bis(4-aminophenoxy)benzene (292.34 g, 1.000 mol),3,3′,1,4,4′-biphenyltetracarboxylic acid dianhydride (138.28 g, 0.470mol) and bis(3,4-dicarboxyphenyl)ether dianhydride (145.80 g, 0.470 mol)were charged as monomers together with the corresponding end blockingagent(s), the kind(s) and amount(s) of which are shown in Table C1, andm-cresol (3,266 g) as a solvent into a vessel equipped with a stirrer, areflux condenser, a water trap and a nitrogen gas inlet tube. Thecontents were heated with stirring to 200° C. over 2 hours and 30minutes under a nitrogen atmosphere, and reactions were conducted under200° C. reflux conditions for 4 hours. In Table C1, “PA” stands forphthalic anhydride, and “PCE” stands for1-phenyl-2-(3,4-dicarboxyphenyl)-acetylene anhydride.

TABLE C1 Ex./ Charged amount Charged amount PA/PCE Comp. of PA of PCEmolar Ex. No. [g] [mmol] [g] [mmol] ratio Example C1 17.60 118.8 0.29791.200 99/1  Example C2 16.89 114.0 1.489 6.000 95/5  Example C3 16.00108.0 2.979 12.00 90/10 Example C4 14.22 96.00 5.958 24.00 80/20 ExampleC5 10.66 72.00 11.92 48.00 60/40 Example C6 7.110 48.00 17.87 72.0040/60 Example C7 3.555 24.00 23.83 96.00 20/80 Comp.Ex. C1 2.666 18.0025.32 102.0 15/85 Comp.Ex. C2 0.0 29.79 120.0  0/100 Comp.Ex. C3 17.77120.0 0.0 100/0 

The temperature was then lowered to 190° C., at which the correspondingend blocking agent(s), the kind(s) and amount(s) of which are shown inTable C1, was(were) charged again. The resulting contents were heatedagain, and the reactions were then conducted under 200° C. refluxconditions for further 4 hours. The reaction mixture was thereaftercooled to 100° C., the resulting viscous polymer solution was dischargedinto toluene (20 liters) which was under vigorous agitation, and aprecipitate was then collected by filtration. The precipitate was againsuspended and allowed to reprecipitate in toluene (4 liters). After thereprecipitate was collected by filtration and then provisionally driedat 50° C. for 24 hours, the reprecipitate was dried at 210° C. for 12hours under a nitrogen gas stream. The yield of the thus-obtained powderand the logarithmic viscosity number, glass transition temperature, 5%weight loss temperature and melt viscosity (360° C./5 min.) are shown inTable C2.

TABLE C2 Glass Melt Logarithmic transi- viscosity viscosity tion 5%Weight 360 [° C.] Ex./Comp. Yield number temp. loss 5 min. Ex. No. [g][dL/g] [° C.] temp. [° C.] [Pa · S] Example C1 509.4 0.455 204 558 1020Example C2 510.2 0.449 203 556 1150 Example C3 510.0 0.450 203 558 1160Example C4 512.5 0.454 205 555 1110 Example C5 513.1 0.458 203 557 1250Example C6 515.9 0.460 204 556 1410 Example C7 517.6 0.452 204 559 1830Comp. Ex. 520.8 0.464 203 557 No flow C1 Comp. Ex. 519.7 0.457 204 555No flow C2 Comp. Ex. 508.4 0.458 204 554  990 C3

The present invention is characterized in that concerning the moleculeends, the molar ratio of the chemical formula (2a) to the chemicalformula (2b) ranges from 1/99 to 80/20 as recited in certain claims.From the above-described results, it is also evident that those havingmolar ratios of the chemical formula (2a) to the chemical formula (2b)greater than 80/20 are considerably inferior in moldability orformability to those having molar ratios of the chemical formula (2a) tothe chemical formula (2b) equal to or smaller than 80/20.

Examples C8-C12, Comparative Examples C4,C5

Using the powders obtained in Examples C2-C6 and Comparative Example C3,compression molding was conducted. The powders used in the respectiveexamples and comparative examples are shown next in Table C3.

TABLE C3 Ex./Comp. Ex. No. Ex./Comp. Ex. No. of used powder Example C8Example C2 Example C9 Example C3 Example C10 Example C4 Example C11Example C5 Example C12 Example C6 Comp. Ex. C4, C5 Comp. Ex. C3

Described specifically, in each of these examples and comparativeexamples, the powder was extruded into pellets at 355° C. by asingle-screw extruder of 25 mm in barrel diameter. After the pelletswere filled in a compression mold of configurations specified inASTM-D-638, compression molding was conducted at 360° C. for 12 hours(Examples C8-C12, Comparative Example C4) or under conditions of 360° C.and 5 minutes (Comparative Example C5). In all the examples andcomparative examples, good molded products were obtained. Using thosemolded products, a tensile test was performed at room temperature (23°C.). The results are shown in Table C4. In Table C4, “PA/PCE molarratio” means the molar ratio of phthalic anhydride to1-phenyl-2-(3,4-dicarboxyphenyl)acetylene anhydride.

TABLE C4 PA/PCE Break Yield Modulus of Ex./Comp. Ex. molar strengthstrength elasticity Elongation No. ratio [MPa] [MPa] [MPa] [%] ExampleC8 95/5  93.50 101.00 2180 82.6 Example C9 90/10 93.30 100.00 2220 86.4Example C10 80/20 94.00 101.00 2300 79.2 Example C11 60/40 95.20 104.002450 70.1 Example C12 40/60 94.90 105.00 2610 58.3 Comp. Ex. C4 100/0 90.80 98.80 2050 66.4 Comp. Ex. C5 100/0  91.00 98.70 2090 64.3

The present invention is characterized in that concerning the moleculeends, the molar ratio of the chemical formula (2a) to the chemicalformula (2b) ranges from 1/99 to 80/2 as recited in certain claims. Fromthe above-described results, it is also evident that those having molarratios of the chemical formula (2a) to the chemical formula (2b) notreaching 1/99 are inferior in mechanical properties to those havingmolar ratios of the chemical formula (2a) to the chemical formula (2b)equal to or greater than 1/99.

Examples C13-C17, Comparative Examples C6-C8

In each of these examples and comparative examples,1,4-bis(4-aminophenoxy)benzene (292.34 g, 1.000 mol),3,3′,4,4′-biphenyltetracarboxylic acid dianhydride (138.28 g, 0.470 mol)and bis(3,4-dicarboxyphenyl)ether dianhydride (145.80 g, 0.470 mol) werecharged as monomers together with m-cresol (2,105 g) as a solvent into avessel equipped with a stirrer, a reflux condenser, a water trap and anitrogen gas inlet tube. The contents were heated with stirring to 200°C. over 2 hours and 30 minutes under a nitrogen atmosphere, and areaction was conducted under 200° C. reflux conditions for 2 hours,whereby a solution of and-unblocked polymer was obtained. During thereaction, the corresponding end blocking agent(s) described in Table C5and m-cresol (200.0 mL) were charged into another vessel and were thenheated beforehand at 100° C. for 1 hour under a nitrogen atmosphere toprovide a solution. The solution of the end blocking agent(s) wascharged in its entirety into the solution of the end-unblocked polymer,and reaction(s) was (were) then conducted under 200° C. refluxconditions for 2 hours. In Table C5, “PA” stands for phthalic anhydride,and “PCE” stands for 1-phenyl-2-(3,4-dicarboxyphenyl)acetyleneanhydride. k

TABLE C5 Charged amount Charged amount Ex./Comp. Ex. of PA of PCE PA/PCENo. [g] [mmol] [g] [mmol] molar ratio Example C13 33.77 228.0 2.979 12.095/5  Example C14 31.99 216.0 5.958 24.0 90/10 Example C15 28.44 192.011.96 48.0 80/20 Example C16 21.33 144.0 23.83 96.00 60/40 Example C1714.21 96.00 35.75 144.0 40/60 Comp. Ex. C6 5.332 36.00 50.64 204.0 15/85Comp. Ex. C7 0 0 59.58 240.0  0/100 Comp. Ex. C8 35.55 240.0 0 0 100/0 

The reaction mixture was thereafter cooled to 100° C. While maintainingthe resultant viscous polymer solution at 100° C., toluene (2 liters)which had been heated at 100° C. was charged into the polymer solutionand further, toluene-(6 liters) was charged dropwise over 4 hours. Aftertoluene (4 liters) was charged, the resulting mixture was allowed tocool down to room temperature. A precipitate was then collected byfiltration. The precipitate was again suspended and allowed toreprecipitate in toluene (4 liters). After the reprecipitate wascollected by filtration and then provisionally dried at 50° C. for 24hours, the reprecipitate was dried at 200° C. under reduced pressure for12 hours under a gentle nitrogen gas stream. The yield of thethus-obtained powder and the logarithmic viscosity number, glasstransition temperature, 5% weight loss temperature and melt viscosity(360° C./5 min.) are shown in Table C6.

TABLE C6 Logarith- Glass Melt mic transi- viscosity viscosity tion 5%Weight 360 [° C.] Ex./Comp. Yield number temp. loss 5 min. Ex. No. [g][dL/g] [° C.] temp. [° C.] [Pa · S] Example C13 508.3 0.456 230 556 2260Example C14 510.0 0.455 229 554 2180 Example C15 511.7 0.448 231 5572440 Example C16 514.3 0.460 230 555 2730 Example C17 517.2 0.457 230556 4880 Comp. Ex. 520.6 0.454 230 551 No flow C6 Comp. Ex. 522.9 0.444231 554 No flow C7 Comp. Ex. 506.8 0.462 231 556 2190 C8

The present invention is characterized in that concerning the moleculeends, the molar ratio of the chemical formula (2a) to the chemicalformula (2b) ranges from 1/99 to 80/20 as recited in certain claims.From the above-described results, it is also evident that those havingmolar ratios of the chemical formula (2a) to the chemical formula (2b)greater than 80/20 are considerably inferior in moldability orformability to those having molar ratios of the chemical formula (2a) tothe chemical formula (2b) equal to or smaller than 80/20.

Examples C18-C22, Comparative Examples C9, C10.

Using the powders obtained in Examples C13-C17 and Comparative ExampleC8, compression molding was conducted. The powders used in therespective examples and comparative examples are shown next in Table C7.

TABLE C7 Ex./Comp. Ex. No. Ex./Comp. Ex. No. of used powder Example C18Example C13 Example C19 Example C14 Example C20 Example C15 Example C21Example C16 Example C22 Example C17 Comp. Ex. C9, C10 Comp. Ex. C8

Described specifically, in each of these examples and comparativeexamples, the powder was extruded into pellets at 355° C. by asingle-screw extruder of 25 mm in barrel diameter. After the pelletswere filled in a compression mold having a size of 10.0 mm in width and80.0 mm in length, compression molding was conducted at 360° C. for 12hours (Examples 18-22, Comparative Example 9) or under conditions of360° C. and 5 minutes (Comparative Example 10). In all the examples andcomparative examples, good molded products were obtained. Thosespecimens were all of 10.0 mm±0.010 mm in width, 80.0 mm±0.010 mm inlength and 1.500 mm±0.010 mm in thickness. Using those molded products,a chemical resistance test was performed. Described specifically, eachspecimen was held in place at portions 5.00 mm apart from opposite endsthereof, and was then adjusted and fixed such that a displacement of3.50 mm in the direction of the thickness would be given when thespecimen was bent by a jig maintained in contact with the specimen at acenter thereof (a portion 40.0 mm apart from the respective ends). Underthose conditions, the specimen was immersed in toluene or methyl ethylketone. One hour, 24 hours and 168 hours later, the specimen was takenout of the solvent and visually observed for cracks.

The results of the chemical resistance test are shown in Table C8. InTable C8, “A”, “B” and “ C” indicate “completely free of cracks”,“cracks observed in a very small number” and “cracks observed in a largenumber”, respectively, in this order. Further, “PA/PCE molar ratio”means the molar ratio of phthalic anhydride to1-phenyl-2-(3,4-dicarboxy-phenyl)acetylene an-hydride, and “MEK” standsfor methyl ethyl ketone.

TABLE C8 Ex./Comp. Toluene immer- MEK immersion PA/PCE Ex. sion timetime molar No. 1 hr. 24 hr. 168 hr. 1 hr. 24 hr. 168 hr. ratio Example AA A B B B 95/5  C18 Example A A A A A B 90/10 C19 Example A A A A A B80/20 C20 Example A A A A A A 60/40 C21 Example A A A A A A 40/60 C22Comp. Ex. A B B B C C  0/100 C9 Comp. Ex. A B B B C C  0/100 C10

The present invention is characterized in that concerning the moleculeends, the molar ratio of the chemical formula (2a) to the chemicalformula (2b) ranges from 1/99 to 80/20 as recited in certain claims.From the above-described results, it is in evident that those havingmolar ratios of the chemical formula (2a) to the chemical formula (2b)not reaching 1/99 are inferior in chemical resistance to those havingmolar ratios of the chemical formula (2a) to the chemical formula (2b)equal to or greater than 1/99.

Examples C23-C27, Comparative Examples C11-C13

In each of these examples and comparative examples, the following tworeactions (A),(B) were conducted.

(A) 1,3-Bis(3-aminophenoxy)benzene (292.34 g, 1.000 mol), pyromelliticdianhydride (102.52 g, 0.470 mol), and3,3′,4,4′-benzophenonetetracarboxylic acid dianhydride (151.45 g, 0.470mol) were charged as monomers together with phthalic anhydride (10.66 g,72.00 mmol) and 1-phenyl-2-(3,4-dicarboxyphenyl)acetylene anhydride(11.92 g, 48.00 mmol) as end blocking agents, m-cresol (2,185 g) as asolvent, and γ-picoline (13.970 g, 0.1500 mol) as a catalyst into avessel equipped with a stirrer, a reflux condenser, a water trap and anitrogen gas inlet tube. The contents were heated with stirring to 150°C. over 2 hours under a nitrogen atmosphere, and reactions wereconducted at 150° C. for 2 hours.

As end blocking agents, phthalic anhydride (5.33 g, 36.00 mmol) and1-phenyl-2-(3,4-dicarboxyphenyl)acetylene anhydride (5.96 g, 24.00 mmol)were then charged, followed by the reactions at 150° C. for further 8hours.

The reaction mixture was thereafter cooled to 60° C., the resultingviscous polymer solution was discharged into methyl ethyl ketone (10liters) which was under vigorous agitation, and a precipitate was thencollected by filtration. The precipitate was again suspended and allowedto reprecipitate in methyl ethyl ketone (4 liters). After thereprecipitate was collected by filtration and then provisionally driedat 50° C. for 24 hours, the reprecipitate was dried at 220° C. for 12hours under a nitrogen gas stream, whereby polyimide powder wasobtained.

(B) In each of these examples and comparative examples, polyimide powderwas obtained in exactly the same manner as in the reaction (A) exceptthat upon preparation of the make-up, the amount(s) of the end blockingagent(s) of the kind(s) was(were) changed to only phthalic anhydride(17.77 g, 120.00 mmol) and that during the reactions, the amount(s) ofthe end blocking agent(s) of the kind(s) was(were) changed to onlyphthalic anhydride (8.89 g, 60.00 mmol).

The yields of the powders obtained in the two reactions (A),(B) andtheir logarithmic viscosity numbers, glass transition temperatures, 5%weight loss temperatures and melt viscosities (360° C./5 min.) are shownin Table C9.

Further, each powder was extruded into pellets at 355° C. by asingle-screw extruder of 25 mm in barrel diameter. After the pelletswere filled in a compression mold of the shape specified in ASTM-D-638,compression molding was conducted under the conditions described inTable C10.

TABLE C9 Logarithmic 5% Weight Melt viscosity viscosity num- Glasstransi- loss 360 [° C.] 5 min. ber [dL/g] tion temp. [° C.] temp. [° C.][Pa · S] (A) 0.450 202 550 2650 (B) 0.452 204 548 2470

TABLE C10 Compression molding Ex./Comp. Ex. No. Used powder conditionsExamples C23 (A) 345° C., 2 hr. Examples C24 (A) 345° C., 6 hr. ExamplesC25 (A) 345° C., 12 hr. Examples C26 (A) 345° C., 24 hr. Examples C27(A) 345° C., 72 hr. Comp. Ex. C11 (B) 345° C., 2 hr. Comp. Ex. C12 (B)345° C., 12 hr. Comp. Ex. C13 (B) 345° C., 72 hr.

Using the specimens so obtained, a high-temperature tensile test at roomtemperature (23° C.) was performed. The results are shown in Table C11.

TABLE C11 Break Yield Modulus of Ex./Comp. Ex. strength strengthelasticity Elongation No. [Mpa] [MPa] [MPa] [%] Example C23 86.60 94.102420 55.5 Example C24 88.10 98.60 2510 58.9 Example C25 90.30 99.20 266052.6 Example C26 97.70 103.00 2740 55.4 Example C27 101.00 102.00 280054.8 Comp. Ex. C11 85.50 90.20 2310 50.7 Comp. Ex. C12 85.40 89.90 232038.1 Comp. Ex. C13 80.80 91.10 2280 16.6

From the foregoing, it is evident that thecrosslinkable-group-containing polyimide according to the presentinvention can be significantly improved in mechanical properties byannealing, and it is also appreciated that this effect cannot beexpected from the conventional polyimides of the comparative examples.

Examples C28-C32, Comparative Examples C14-C16

In each of these examples and comparative examples,bis(3,4-dicarboxyphenyl)ether dianhydride and1,4-bis(3,4-dicarboxyphenoxy)benzene dianhydride were charged in theircorresponding amounts shown in Table C12 together with1,3-bis(4-aminophenoxy)benzene (292.34 g, 1.000 mol), all as monomers,into a vessel equipped with a stirrer, a reflux condenser, a water trapand a nitrogen gas inlet tube. As a solvent, m-cresol was also chargedin its corresponding amount shown in Table C12. The contents were heatedwith stirring to 200° C. over 2 hours and 30 minutes under a nitrogenatmosphere, and a reaction was conducted under 200° C. reflux conditionsfor 2 hours, whereby a solution of an end-unblocked polymer wasobtained. In Table C12, “ODPA” stands for bis(3,4-dicarboxyphenyl)etherdianhydride, and “HQDA” stands for 1,4-bis(3,4-dicarboxyphenoxy)benzenedianhydride.

TABLE C12 Charged amount Charged Charged Ex./Comp. Ex. of ODPA amount ofHQDA amount of No. [g] [mol] [g] [mol] m-cresol [g] Example C28 208.470.6720 115.87 0.2880 2267 Examples C29, 31 201.95 0.6510 112.25 0.27902226 Examples C30, 32 195.44 0.6300 108.63 0.2700 2186 Comp. Ex. C14208.47 0.6720 115.87 0.2880 2267 Comp. Ex. C15 201.95 0.6510 112.250.2790 2226 Comp. Ex. C16 195.44 0.6300 108.63 0.2700 2186

During the reaction, the corresponding end blocking agents described inTable C13 and m-cresol (200.0 mL) were charged into another vessel andwere then heated beforehand at 100° C. for 1 hour under a nitrogenatmosphere to provide a solution. The solution of the end blockingagents was charged in its entirety into the solution of theend-unblocked polymer, and reactions were then conducted under 200° C.reflux conditions for 2 hours. In Table C13, “PA” stands for phthalicanhydride, and “PCE” stands for1-phenyl-2-(3,4-dicarboxyphenyl)-acetylene anhydride.

TABLE C13 Charged amount Charged amount Ex./Comp. Ex. of PA of PCEPA/PCE No. [g] [mmol] [g] [mmol] molar ratio Example C28 16.59 112.011.92 48.00 70/30 Example C29 29.03 196.0 20.85 84.00 70/30 Example C3041.47 280.0 29.79 120.0 70/30 Example C31 20.74 140.0 34.75 140.0 50/50Example C32 29.62 200.0 49.45 200.0 50/50 Comp. Ex. C14 3.555 24.0033.76 136.0 15/85 Comp. Ex. C15 6.221 42.00 59.08 238.0 15/85 Comp. Ex.C16 8.887 60.00 84.40 340.0 15/85

The reaction mixture was thereafter cooled to 60° C., the resultingviscous polymer solution was discharged into methyl ethyl ketone (10liters) which was under vigorous agitation, and a precipitate was thencollected by filtration. The precipitate was again suspended and allowedto reprecipitate in methyl ethyl ketone (4 liters). After thereprecipitate was collected by filtration and then provisionally driedat 50° C. for 24 hours, the reprecipitate was dried at 220° C. for 12hours under a nitrogen gas stream, whereby polyimide powder wasobtained.

The logarithmic viscosity number, glass transition temperature and meltviscosity (360° C./5 min., 15 min., 30 min.) of the thus-obtainedpolyimide powder are shown in Table C14.

TABLE C14 Logarithmic viscosity Glass 360° C. Melt viscosity Ex./Comp.Ex. number transition [Pa · S] No. [dL/g] temp. [° C.] 5 min. 15 min. 30min. Example C28 0.804 185 3530 3540 4140 Example C29 0.441 185 880 890970 Example C30 0.318 183 280 280 290 Example C31 0.439 185 980 15205830 Example C32 0.311 183 310 550 2460 Comp. EX. 0.786 185 No flow ← ←C14 Comp. EX. 0.428 185 No flow ← ← C15 Comp. EX. 0.306 183 18430 Noflow ← C16

It is appreciated from the results that thecrosslinkable-group-containing polyimide according to the presentinvention, even at various molecular weights (or logarithmic viscositynumbers correlating with the molecular weights), has good melt fluidityand is better in moldability or formability than the polyimides of thecomparative examples.

Examples C33-C37, Comparative Examples C17-C19

The powders which were obtained in Examples C28-C32 and ComparativeExamples C14-C16 were separately placed on heat-resistant dishes,annealed under nitrogen gas at 420° C. for 1 hour, and then quenched.Thereafter, their glass transition temperatures and 5% weight losstemperatures were measured. The results are shown in Table C15.

In Table C15, “Tg” indicates a glass transition temperature, and “Td5”designates a 5% weight loss temperature.

TABLE C15 Before annealing After annealing Ex./Comp. Ex. Tg Td5 Tg Td5No. Used powder [° C.], [° C.], [° C.], [° C.], Example C33 Example C28185 558 202 554 Example C34 Example C29 185 560 205 552 Example C35Example C30 183 552 204 550 Example C36 Example C31 185 555 207 551Example C37 Example C32 183 551 206 549 Comp. Ex. C17 Comp. Ex. C14 185556 185 548 Comp. Ex. C18 Comp. Ex. C15 185 555 187 550 Comp. Ex. C19Comp. Ex. C16 183 549 187 523

From these results, it is appreciated that, when annealed, thecrosslinkable-group-containing polyimide according to the presentinvention is significantly improved in glass transition temperature butthe polyimides of the comparative examples are not improved.

Examples C38-C39, Comparative Example C20

Using the polyimide powders employed above in Examples C29, C31 andComparative Example C15, their melt viscosities were measured in asimilar manner as in Examples A80-A82.

Further, with respect to those powders, their gel times at varioustemperatures were measured in a similar manner as in Examples A83-A87.

The results are shown in Table C16. Incidentally, “>120” which appearsin Table C16 indicates that no gel point was reached within themeasuring time.

TABLE C16 Ex./Comp. Ex./Comp. Measuring Melt viscosity Ex. Ex. No. temp.[Pa · S] Gel No. of used powder [° C.] 5 min. 30 min. time [min] ExampleExample C29 320 13200 12800 >120 C38 340 2540 2660 >120 360 880 970 68380 310 1910 30 Example Example C31 320 12600 12300 >120 C39 340 26603010 118 360 980 5830 30 380 360 9550 14 Comp. Ex. Comp. Ex. C15 32012800 18600 >120 C20 340 3550 No flow 36 360 No flow ← 4 380 No flow ← 2

From the results, it is evident that over a wide temperature range, thecrosslinkable-group-containing polyimide according to the presentinvention has high stability in melt viscosity and is resistant togelation and hence, is excellent in moldability or formability.

Experiment D Series

In Example D1 to Example D25, a description will be made about certainexamples out of the present invention, in each of which 50 to 100 mole %of recurring structural units in a backbone structure are of a recurringunit structure represented by:

wherein G represents a divalent aromatic group selected from the groupconsisting of a direct bond, a carbonyl group, a sulfone group, asulfide group, an ether group, an isopropylidene group, ahexafluoroisopropylidene group, a 3-oxyphenoxy group, a 4-oxyphenoxygroup, a 4′-oxy-4-biphenoxy group and a4-[1-(4-oxyphenyl)-1-methylethyl]phenoxy group.

Examples D1-D7, Comparative Examples D1-D3

In each of these examples and comparative examples, m-phenylenediamine(108.14 g, 1.000 mol) and 1,4-bis(3,4-dicarboxyphenoxy)benzenedianhydride (378.18 g, 0.940 mol) were charged as monomers together withthe corresponding end blocking agent(s), the kind(s) and amount(s) ofwhich are shown in Table D1, and m-cresol (1,750 g) andN,N-dimethylacetamide (195 g) as solvents into a vessel equipped with astirrer, a reflux condenser, a water trap and a nitrogen gas inlet tube.The contents were heated with stirring to 200° C. over 2 hours and 30minutes under a nitrogen atmosphere, and reactions were conducted under200° C. reflux conditions for 4 hours. In Table D1, “PA” stands forphthalic anhydride, and “PCE” stands for1-phenyl-2-(3,4-dicarboxyphenyl)-acetylene anhydride.

TABLE D1 Charged amount Charged amount Ex./Comp. Ex. of PA of PCE PA/PCENo. [g] [mmol] [g] [mmol] molar ratio Example D1 17.60 118.8 0.29791.200 99/1  Example D2 16.89 114.0 1.489 6.000 95/5  Example D3 16.00108.8 2.979 12.00 90/10 Example D4 14.22 96.00 5.958 24.00 80/20 ExampleD5 10.66 72.00 11.92 48.00 60/40 Example D6 7.110 48.00 17.87 72.0040/60 Example D7 3.555 24.00 23.83 96.00 20/80 Comp. Ex. D1 2.666 18.0025.32 102.0 15/85 Comp. Ex. D2 0 0 29.79 120.0  0/100 Comp. Ex. D3 17.77120.0 0 0 100/0 

The temperature was then lowered to 190° C., at which the correspondingend blocking agent(s), the kind(s) and amount(s) of which are shown inTable D1, was (were) charged again. The resulting contents were heatedagain, and the reactions were then conducted under 200° C. refluxconditions for further 4 hours.

Thereafter, the reaction mixture was cooled to 100° C. and thendischarged into toluene (10 liters) which was under vigorous agitation,and a precipitate was then collected by filtration. The precipitate wasagain suspended and allowed to reprecipitate in toluene (4 liters).After the reprecipitate was collected by filtration and thenprovisionally dried at 50° C. for 24 hours, the reprecipitate was driedat 220° C. for 12 hours under a nitrogen gas stream. The logarithmicviscosity number, glass transition temperature, 5% weight losstemperature and melt viscosity (360° C./5 min.) of the thus-obtainedpowder are shown in Table D2.

TABLE D2 Melt viscosity Logarithmic Glass 5% Weight 360 [° C.] Ex./Comp. Ex. viscosity num- transition loss 5 min. No. ber [dL/g] temp. [°C.] temp. [° C.] [Pa · S] Example D1 0.431 232 565 820 Example D2 0.439231 564 810 Example D3 0.499 231 565 900 Example D4 0.440 231 558 880Example D5 0.444 231 566 940 Example D6 0.437 232 564 1240  Example D70.429 231 563 2430  Comp. Ex. D1 0.455 231 564 No flow Comp. Ex. D20.452 232 556 No flow Comp. Ex. D3 0.448 231 564 800

The present invention is characterized in that concerning the moleculeends, the molar ratio of the chemical formula (2a) to the chemicalformula (2b) ranges from 1/99 to 80/20 as recited in certain claims.From the above-described results, it is also evident that those havingmolar ratios of the chemical formula (2a) to the chemical formula (2b)greater than 80/20 are considerably inferior in moldability orformability to those having molar ratios of the chemical formula (2a) tothe chemical formula (2b) equal to or smaller than 80/20.

Examples D8-D12, Comparative Examples D4,D5.

Using the powders obtained in Examples D2-D6 and Comparative Example D3,compression molding was conducted. The powders used in the respectiveexamples and comparative examples are shown next in Table D3.

TABLE D3 Ex./Comp.Ex. No. Ex./Comp.Ex. No. of used powder Example D8Example D2 Example D9 Example D3 Example D10 Example D4 Example D11Example D5 Example D12 Example D6 Comp.Ex. D4, D5 Comp.Ex. D3

Described specifically, in each of these examples and comparativeexamples, the powder was extruded into pellets at 355° C. by a 25-mm,single-screw extruder. After the pellets were filled in a compressionmold of configurations specified in ASTM-D-638, compression molding wasconducted at 360° C. for 12 hours (Examples D8-D12, Comparative ExampleD4) or under conditions of 360° C. and 5 minutes (Comparative Example5). In all the examples and comparative examples, good molded productswere obtained. Using those molded products, a tensile test was performedat room temperature (23° C.). The results are shown in Table D4. InTable D4, “PA/PCE molar ratio” means the molar ratio of phthalicanhydride to 1-phenyl-2-(3,4-dicarboxyphenyl)-acetylene anhydride.

TABLE D4 PA/PCE Break Yield Modulus of Ex./Comp.Ex. molar strengthstrength elasticity Elongation No. ratio [MPa] [MPa] [MPa] [%] ExampleD8 95/5  85.50 90.20 2360 24.3 Example D9 90/10 84.90 92.00 2380 29.1Example D10 80/20 89.40 96.00 2440 23.5 Example D11 60/40 88.80 94.002600 20.8 Example D12 40/60 90.10 98.00 2780 21.9 Comp.Ex. D4 100/0 84.80 89.80 2060 23.3 Comp.Ex. D5 100/0  84.40 89.40 2100 22.2

The present invention is characterized in that concerning the moleculeends, the molar ratio of the chemical formula (2a) to the chemicalformula (2b) ranges from 1/99 to 80/20 as recited in certain claims.From the above-described results, it is also evident that those havingmolar ratios of the chemical formula (2a) to the chemical formula (2b)not reaching 1/99 are inferior in mechanical properties to those havingmolar ratios of the chemical formula (2a) to the chemical formula (2b)equal to or greater than 1/99.

Examples D13-D22, Comparative Examples D6-D10

In each of these examples and comparative examples, the following tworeactions (A),(B) were conducted.

(A) m-Phenylenediamine (108.14 g, 1.000 mol), 3,4′-diaminodiphenyl ether(80.10 g, 0.400 mol) and bis(3,4-dicarboxyphenyl)sulfone dianhydride(336.78 g, 0.940 mol) were charged as monomers together with phthalicanhydride (10.66 g, 72.00 mmol) and1-phenyl-2-(3,4-dicarboxy-phenyl)acetylene anhydride (11.92 g, 48.00mmol) as end blocking agents, m-cresol (2,730 g) as a solvent, andγ-picoline (13.970 g, 0.1500 mol) as a catalyst into a vessel equippedwith a stirrer, a reflux condenser, a water trap and a nitrogen gasinlet tube. The contents were heated with stirring to 150° C. over 2hours under a nitrogen atmosphere, and reactions were conducted at 150°C. for 2 hours.

As end blocking agents, phthalic anhydride (5.33 g, 36.00 mmol) and1-phenyl-2-(3,4-dicarboxyphenyl)acetylene anhydride (5.96 g, 24.00 mmol)were then charged, followed by the reactions at 150° C. for further 8hours. The reaction mixture was thereafter cooled to 60° C. and thendischarged into methyl ethyl ketone (10 liters) which was under vigorousagitation, and a precipitate was then collected by filtration. Theprecipitate was again suspended and allowed to reprecipitate in methylethyl ketone (4 liters). After the reprecipitate was collected byfiltration and then provisionally dried at 50° C. for 24 hours, thereprecipitate was dried at 220° C. for 12 hours under a nitrogen gasstream, whereby polyimide powder was obtained.

(B) In each of these examples and comparative examples, polyimide powderwas obtained in exactly the same manner as in the reaction (A) exceptthat upon preparation of the make-up, the amount(s) of the end blockingagent(s) of the kind(s) was(were) changed to only phthalic anhydride(17.77 g, 120.00 mmol) and that during the reactions, the amount(s) ofthe end blocking agent(s) of the kind(s) was(were) changed to onlyphthalic anhydride (8.89 g, 60.00 mmol).

The yields of the powders obtained in the two reactions (A),(B) and thelogarithmic viscosity numbers, glass transition temperatures, 5% weightloss temperatures and melt viscosities (360° C./5 min.) of the polyimidepowders are shown in Table D5.

Further, each powder was extruded into pellets at 355° C. by a 25-mm,single-screw extruder. After the pellets were filled in a compressionmold of the shape specified in ASTM-D-638, compression molding wasconducted under the conditions described in Table D6.

TABLE D5 Logarithmic Glass 5% Weight Melt viscosity viscosity transitionloss 360 [° C.] number temp. temp. 5 min. [dL/g] [° C.] [° C.] [Pa · S](A) 0.421 236 560 1050 (B) 0.425 236 561 1000

TABLE D6 Compression molding Ex./Comp.Ex. No. Used powder conditionsExamples D13, D18 (A) 360° C., 72 hr. Examples D14, D19 (A) 360° C., 24hr. Examples D15, D20 (A) 360° C., 12 hr. Examples D16, D21 (A) 360° C.,6 hr. Examples D17, D22 (A) 360° C., 2 hr. Comp.Ex. D6, D9 (B) 360° C.,72 hr. Comp.Ex. D7, D10 (B) 360° C., 12 hr. Comp.Ex. D8, D11 (B) 360°C., 2 hr.

Using the specimens so obtained, a tensile test at room temperature (23°C.) and a high-temperature tensile test at 177° C. were performed. Theresults are shown in Table D7.

TABLE D7 Modulus PA/PCE Testing Break Yield of Ex./Comp. molar temp.strength strength elasticity Elongation Ex. No. ratio [° C.] [Mpa] [MPa][MPa] [%] Example 60/40 23 99.20 108.00 2770 41.3 D13 Example 60/40 2398.40 106.00 2590 44.4 D14 Example 60/40 23 97.90 104.00 2550 42.7 D15Example 60/40 23 98.00 105.00 2500 44.6 D16 Example 60/40 23 96.70103.00 2430 50.1 D17 Comp.Ex. 100/0  23 95.90 104.00 2290 49.4 D6Comp.Ex. 100/0  23 95.50 103.00 2270 46.6 D7 Comp.Ex. 100/0  23 95.69104.00 2250 47.0 D8 Example 60/40 177 84.80 90.20 2410 101 D18 Example60/40 177 84.40 88.20 2130 98 D19 Example 60/40 177 81.10 84.50 1960 113D20 Example 60/40 177 79.50 80.60 1700 117 D21 Example 60/40 177 75.6079.90 1580 122 D22 Comp.Ex. 100/0  177 72.20 75.10 1520 131 D9 Comp.Ex.100/0  177 72.80 77.10 1550 124 D10 Comp.Ex. 100/0  177 73.10 77.00 1530130 D11

From the above results, it is evident that, when annealed, thecrosslinkable-group-containing polyimide according to the presentinvention is significantly improved in room-temperature andhigh-temperature mechanical properties. It is also appreciated that thiseffect cannot be expected from the conventional polyimides of thecomparative examples.

Examples D2.3-25, Comparative Examples D12-13

Using the polyimide powders employed above in Examples D4-D6 andComparative Example D1,D3, their melt viscosities were measured in asimilar manner as in Examples A80-A82.

Further, with respect to those powders, their gel times at varioustemperatures were measured in a similar manner as in Examples A83-A87.

Further, those powders were separately extruded into pellets underconditions of 320° C. to 360° C., and compression molding and an MEKresistance test were performed in a similar manner as in ExamplesA18-A22.

The results are shown in Table D8. Incidentally, “>120” which appears inTable D8 indicates that no gel point was reached within the measuringtime.

TABLE D8 Ex/Comp. Ex. Melt viscosity MEK resistance test resultsEx./Comp. Ex. No. of used Measuring [Pa · S] Gel time MEK immersion timeNo. powder temp. [° C.] 5 min. 30 min. [min.] 1 Hr. 24 Hr. 168 Hr. Ex.D23 Ex. D24 360 880 1010 >120 A A B 380 330 550 65 Ex. D24 Ex. D25 360940 1760 51 A A A 380 370 1690 28 Ex. D25 Ex. D26 360 1240 7720 26 A A A380 480 8330 10 Comp. Ex. D12 Comp. Ex. D1 360 No flow ← 4 Unable tomold 380 No flow ← 2 Comp. Ex. D13 Comp. Ex. D3 360 800 810 >120 B C C380 290 330 >120 Note: “A”, “B” and “C” indicate “completely free ofcracks”, “cracks observed in a very small number” and “cracks observedin a large number”, respectively, in this order.

From the results, it is evident that over a wide temperature range, thecrosslinkable-group-containing polyimide according to the presentinvention has is also excellent in chemical resistance despite theirhigh stability in melt viscosity, good resistance to gelation andexcellent moldability or formability over a wide temperature range.

Experiment E Series

In Example E1 to Example E22, a description will be made about certainexamples out of the present invention, in each of which 50 to 100 mole %of recurring structural units in a backbone structure are of a recurringunit structure represented by:

wherein X, Z and R are groups to be indicated next, respectively, thatis,

X represents a divalent linking group selected from the group consistingof an ether group and an isopropylidene group;

Z represents a divalent linking group selected from the group consistingof:

 and

R represents a tetravalent aromatic group selected from the groupconsisting of:

 wherein G represents a divalent aromatic group selected from the groupconsisting of a direct bond, a carbonyl group, a sulfone group, asulfide group, an ether group, an isopropylidene group, ahexafluoroisopropylidene group, a 3-oxyphenoxy group, a 4-oxyphenoxygroup, a 4′-oxy-4-biphenoxy group and a4-[1-(4-oxyphenyl)-1-methylethyl]phenoxy group, and a position of eachbond, said position being unspecified, is a para-position ormeta-position.

Examples E1-E7, Comparative Examples E1-E3

In each of these examples and comparative examples1,3-bis[4-(4-aminophenoxy)-α, α-dimethylbenzyl]benzene (528.69 g, 1.000mol) and 3,3′,4,4′-biphenyltetracarboxylic acid dianhydride (276.57 g,0.940 mol) were charged as monomers together with the corresponding endblocking agent(s), the kind(s) and amount(s) of which are shown in TableE1, and m-cresol (3,220 g) as a solvent into a vessel equipped with astirrer, a reflux condenser, a water trap and a nitrogen gas inlet tube.The contents were heated with stirring to 200° C. over 2 hours and 30minutes under a nitrogen atmosphere, and reactions were conducted under200° C. reflux conditions for 4 hours. In Table E1, “PA” stands forphthalic anhydride, and “PCE” stands for1-phenyl-2-(3,4-dicarboxyphenyl)-acetylene anhydride.

TABLE E1 Charged amount Charged amount Ex./Comp.Ex. of PA of PCE PA/PCENo. [g] [mmol] [g] [mmol] molar ratio Example E1 17.60 118.8 0.29791.200 99/1  Example E2 16.89 114.0 1.489 6.000 95/5  Example E3 16.00108.0 2.979 12.00 90/10 Example E4 14.22 96.00 5.958 24.00 80/20 ExampleE5 10.66 72.00 11.92 48.00 60/40 Example E6 7.110 48.00 17.87 72.0040/60 Example E7 3.555 24.00 23.83 96.00 20/80 Comp.Ex. E1 2.666 18.0025.32 102.0 15/85 Comp.Ex. E2 0 0 29.79 120.0  0/100 Comp.Ex. E3 17.77120.0 0 0 100/0 

The temperature was then lowered to 190° C., at which the correspondingend blocking agent(s), the kind(s) and amount(s) of which are shown inTable E1, was (were) charged again. The resulting contents were heatedagain, and the reactions were then conducted under 200° C. refluxconditions for further 4 hours.

Thereafter, the reaction mixture was cooled to 100° C. and thendischarged into toluene (10 liters) which was under vigorous agitation,and a precipitate was then collected by filtration. The precipitate wasagain suspended and allowed to reprecipitate in toluene (4 liters).After the reprecipitate was collected by filtration and thenprovisionally dried at 50° C. for 24 hours, the reprecipitate was driedat 220° C. for 12 hours under a nitrogen gas stream. The logarithmicviscosity number, glass transition temperature, 5% weight losstemperature and melt viscosity (360° C./5 min.) of the thus-obtainedpowder are shown in Table E2.

TABLE E2 5% Melt Logarithmic Glass Weight viscosity viscosity transitionloss 360 [° C.] Ex./Comp.Ex. number temp. temp. 5 min. No. [dL/g] [° C.][° C.] [Pa · S] Example E1 0.454 175 558 690 Example E2 0.450 174 557680 Example E3 0.459 175 560 710 Example E4 0.448 175 556 650 Example E50.452 175 560 790 Example E6 0.455 177 561 1010 Example E7 0.460 177 5591890 Comp.Ex. E1 0.458 178 560 No flow Comp.Ex. E2 0.458 178 559 No flowComp.Ex. E3 0.454 175 555 690

The present invention is characterized in that concerning the moleculeends, the molar ratio of the chemical formula (2a) to the chemicalformula (2b) ranges from 1/99 to 80/20 as recited in certain claims.From the above-described results, it is also evident that those havingmolar ratios of the chemical formula (2a) to the chemical formula (2b)greater than 80/20 are considerably.inferior in moldability orformability to those having molar ratios of the chemical formula (2a) tothe chemical formula (2b) equal to or smaller than 80/20.

Examples E8-E12, Comparative Examples E4,E5.

Using the powders obtained in Examples E2-E6 and Comparative Example E3,compression molding was conducted. The powders used in the respectiveexamples and comparative examples are shown next in Table E3.

TABLE E3 Ex./Comp.Ex. No. Ex./Comp.Ex. No. of used powder Example E8Example E2 Example E9 Example E3 Example E10 Example E4 Example E11Example E5 Example E12 Example E6 Comp.Ex. E4, E5 Comp.Ex. E3

Described specifically, in each of these examples and comparativeexamples, the powder was extruded into pellets at 355° C. by a 25-mm,single-screw extruder. After the pellets were filled in a compressionmold of configurations specified in ASTM-D-638, compression molding wasconducted at 360° C. for 12 hours (Examples E8-E12, Comparative ExampleE4) or under conditions of 360° C. and 5 minutes (Comparative ExampleE5). In all the examples and comparative examples, good molded productswere obtained. Using those molded products, a tensile test was performedat room temperature (23° C.). The results are shown in Table E4. InTable E4, “PA/PCE molar ratio” means the molar ratio of phthalicanhydride to 1-phenyl-2-(3,4-dicarboxyphenyl)acetylene anhydride.

TABLE E4 PA/PCE Break Yield Modulus of Ex./Comp.Ex. molar strengthstrength elasticity Elongation No. ratio [MPa] [MPa] [MPa] [%] ExampleE8 95/5  92.00 98.70 2060 50.8 Example E9 90/10 91.60 97.90 2050 40.1Example E10 80/20 92.30 97.10 2090 45.2 Example E11 60/40 94.10 98.502150 44.7 Example E12 40/60 93.80 98.50 2350 50.1 Comp.Ex. E4 100/0 90.00 94.90 2040 40.6 Comp.Ex. E5 100/0  90.40 97.40 2050 45.3

The present invention is characterized in that concerning the moleculeends, the molar ratio of the chemical formula (2a) to the chemicalformula (2b) ranges from 1/99 to 80/20 as recited in certain claims.From the above-described results, it is also evident that those havingmolar ratios of the chemical formula (2a) to the chemical formula (2b)not reaching 1/99 are inferior in mechanical properties to those havingmolar ratios of the chemical formula (2a) to the chemical formula (2b)equal to or greater than 1/99.

Examples E13-E22, Comparative Examples E6-E11

In each of these examples and comparative examples, the following tworeactions (A),(B) were conducted.

(A) 4,4′-Bis[4-(4-amino-α, α-dimethylbenzyl)phenoxy]-diphenyl sulfone(668.85 g, 1,000 mol) and pyromellitic dianhydride (205.03 g, 0.940 mol)were charged as monomers together with phthalic anhydride (10.66 g,72.00 mmol) and 1-phenyl-2-(3,4-dicarboxy-phenyl)acetylene anhydride(11.92 g, 48.00 mmol) as end blocking agents, m-cresol (2,730 g) as asolvent, and γ-picoline (13.970 g, 0.1500 mol) as a catalyst into avessel equipped with a stirrer, a reflux condenser, a water trap and anitrogen gas inlet tube. The contents were heated with stirring to 150°C. over 2 hours under a nitrogen atmosphere, and reactions wereconducted at 150° C. for 2 hours.

As end blocking agents, phthalic anhydride (5.33 g, 36.00 mmol) and1-phenyl-2-(3,4-dicarboxyphenyl)acetylene anhydride (5.96 g, 24.00 mmol)were then charged, followed by the reactions at 150° C. for further 8hours.

The reaction mixture was thereafter cooled to 60° C. and then dischargedinto methyl ethyl ketone (10 liters) which was under vigorous agitation,and a precipitate was then collected by filtration. The precipitate wasagain suspended and allowed to reprecipitate in methyl ethyl ketone (4liters). After the reprecipitate was collected by filtration and thenprovisionally dried at 50° C. for 24 hours, the reprecipitate was driedat 220° C. for 12 hours under a nitrogen gas stream, whereby polyimidepowder was obtained.

(B) In each of these examples and comparative examples, polyimide powderwas obtained in exactly the same manner as in the reaction (A) exceptthat upon preparation of the make-up, the amount(s) of the end blockingagent(s) of the kind(s) was (were) changed to only phthalic anhydride(17.77 g, 120.00 mmol) and that during the reactions, the amount(s) ofthe end blocking agent(s) of the kind(s) was(were) changed to onlyphthalic anhydride (8.89 g, 60.00 mmol).

The yields of the powders obtained in the two reactions (A),(B) and thelogarithmic viscosity numbers, glass transition temperatures, 5% weightloss temperatures and melt viscosities (360° C./5 min.) of the polyimidepowders are shown in Table E5.

Further, each powder was extruded into pellets at 355° C. by a 25-mm,single-screw extruder. After the pellets were filled in a compressionmold of the shape specified in ASTM-D-638, compression molding wasconducted under the conditions described in Table E6.

TABLE E5 Logarithmic Glass 5% Weight Melt viscosity viscosity transitionloss 360 [° C.] number temp. temp. 5 min. [dL/g] [° C.] [° C.] [Pa · S](A) 0.440 265 551 1820 (B) 0.440 265 553 1790

TABLE E6 Compression molding Ex./Comp.Ex. No. Used powder conditionsExamples E13, E18 (A) 360° C., 72 hr. Examples E14, E19 (A) 360° C., 24hr. Examples E15, E20 (A) 360° C., 12 hr. Examples E16, E21 (A) 360° C.,6 hr. Examples E17, E22 (A) 360° C., 2 hr. Comp.Ex. E6, E9 (B) 360° C.,72 hr. Comp.Ex. E7, E10 (B) 360° C., 12 hr. Comp.Ex. E8, E11 (B) 360°C., 2 hr.

Using the specimens so obtained, a tensile test at room temperature (23°C.) and a high-temperature tensile test at 177° C. were performed. Theresults are shown in Table E7.

TABLE E7 Modulus PA/PCE Testing Break Yield of Ex./Comp. molar temp.strength strength elasticity Elongation Ex. No. ratio [° C.] [MPa] [MPa][MPa] [%] Example 60/40 23 94.10 97.50 2340 70.3 E13 Example 60/40 2391.60 95.00 2290 81.9 E14 Example 60/40 23 91.10 96.20 2150 74.7 E15Example 60/40 23 93.80 97.20 2130 69.9 E16 Example 60/40 23 92.60 96.702060 72.6 E17 Comp.Ex. 100/0  23 93.00 95.50 2010 68.1 E6 Comp.Ex.100/0  23 92.50 96.40 2060 76.4 E7 Comp.Ex. 100/0  23 92.60 95.70 204077.3 E8 Example 60/40 177 89.20 89.90 2210 124 E18 Example 60/40 17782.40 86.50 2010 136 E19 Example 60/40 177 76.40 79.30 1980 147 E20Example 60/40 177 77.10 70.50 1740 149 E21 Example 60/40 177 70.80 66.601530 171 E22 Comp.Ex. 100/0  177 64.70 55.10 1350 169 E9 Comp.Ex. 100/0 177 64.20 59.20 1380 166 E10 Comp.Ex. 100/0  177 66.60 56.70 1440 159E11

From the above results, it is evident that, when annealed, thecrosslinkable-group-containing polyimide according to the presentinvention is significantly improved in room-temperature andhigh-temperature mechanical properties. It is also appreciated that thiseffect cannot be expected from the conventional polyimides of thecomparative examples.

Experiment F Series

In Example F1 to Example F16, a description will be made about certainexamples out of the present invention, in each of which ascrosslinkable-group-containing end blocking agent(s), one or more endblocking agents other than those represented by the chemical formula(2a) are used or one or more end blocking agents other than thoserepresented by the chemical formula (2a) are used in combination.

In each of these examples and comparative example, a 15% (W/W) polyamicacid varnish was obtained in a similar manner as in Examples A33-A37 byusing dimethylacetamide as a solvent and4,4′-bis(3-aminophenoxy)biphenyl (368.43 g, 1.000 mol), pyromelliticdianhydride (142.00 g, 0.651 mol) and3,3′,4,4′-benzophenonetetracarboxylic acid dianhydride (89.90 g, 0.279mol) as monomers together with the corresponding end blocking agent(s)the amount(s) and kind(s) of which are shown in Table A29.

Using the thus-obtained varnishes, films were prepared under similarconditions as in Examples 33-37. Employing those films, a chemicalresistance test was performed in toluene in a similar manner as inExamples A70-A75. The results are shown together with the logarithmicviscosity numbers of the varnishes in Table F1.

Incidentally, “A”, “B” and “C” in Table F1 indicate “completely free ofcracks”, “cracks observed in a very small number” and “cracks observedin a large number”, respectively, in this order.

TABLE F1 End blocking agent (one to three kinds) Logarithmic Kind/viscosity Toluene Ex./Comp. Charged amount [g]/ number immersion timeEx. No. Charged amount [mol] [dL/g] 1 hr. 24 hr. 168 hr. Example A)14.52 0.0980 0.422 A A A F1 F) 7.230 0.0420 Example A) 14.52 0.09800.412 A A A F2 G) 10.43 0.0420 Example A) 11.41 0.0770 0.413 A A A F3 H)10.41 0.0630 Example A) 11.41 0.0770 0.413 A A A F4 I) 6.178 0.0630Example A) 11.41 0.0770 0.411 A A A F5 J) 7.067 0.0630 Example A) 14.520.0980 0.409 A A A F6 B) 8.238 0.0280 K) 8.800 0.0280 Comp.Ex. A) 17.940.140 0.418 B C C F1 [Note] In Table F1, the end blocking agents areindicated by the following signs: A) phthalic anhydride, B)1-phenyl-2-(3,4-dicarboxyphenyl) acetylene anhydride, F)4-ethynylphthalic anhydride, G) 3-(phenylethynyl)phthalic anhydride, H)5-norbornene-2,3-dicarboxylic acid anhydride, I) maleic anhydride, J)2-methylmaleic anhydride, and K) 2-(3,4-dicarboxyphenoxy)biphenyleneanhydride.

From the above results, it is evident thatcrosslinkable-group-containing polyimides according to the presentinvention, which have various structures, are far. superior in chemicalresistance to similar polymers having no crosslinkable groups.

Examples F7-F10, Comparative Example F2

In each of these examples and comparative example,1,3-bis(4-aminophenoxy)benzene (292.34 g, 1.000 mol),3,3′,4,4′-biphenyltetracarboxylic acid dianhydride (158.87 g, 0.540mol), bis(3,4-dicarboxyphenyl)ether dianhydride (167.51 g, 0.540 mol)were charged as monomers together with N-methyl-2-pyrrolidone (3,506 g)as a solvent into a vessel equipped with a stirrer, a reflux condenser,a water trap and a nitrogen inlet tube. The contents were stirred for 12hours under a nitrogen atmosphere. The end blocking agent(s), thekind(s) and amount(s) of which are shown in Table F2, was (were)charged, followed by stirring for 12 hours under a nitrogen atmosphere.

To the polymer solution so obtained, acetic anhydride (408 g) andγ-picoline (23.5 g) were added, followed by stirring at 60° C. for 3hours under a nitrogen atmosphere.

The resultant viscous polymer solution was discharged into toluene (20liters) which was under vigorous agitation, and a precipitate was thencollected by filtration. The precipitate was again suspended and allowedto reprecipitate in toluene (4 liters). After the reprecipitate wascollected by filtration and then provisionally dried at 50° C. for 24hours, the reprecipitate was dried at 150° C. under reduced pressure for12 hours under a gentle nitrogen gas stream.

Using the polyimide powders so obtained, their gel times at 150° C. weremeasured in exactly the same manner as in Examples A83-A87.

The results are shown together with the logarithmic viscosity numbers ofthe thus-obtained polyimide powders in Table F2. Incidentally, “>120”which appears in Table F2 indicates that no gel point was reached withinthe measuring time.

TABLE F2 End blocking agent (one to three kinds) Logarithmic kind/viscosity Ex./Comp.Ex. charged amount [g]/ number 360° C. No. chargedamount [mol] [dL/g] Gel time [min.] Example F7 L) 22.35 0.240 0.444 108M) 15.46 0.0800 Example F8 L) 18.63 0.200 0.440 21 N) 20.11 0.1200Example F9 L) 26.08 0.280 0.446 >120 O) 4.764 0.0400 Example F10 L)22.35 0.240 0.451 38 M) 7.730 0.0400 P) 6.688 0.0400 Comp.Ex. F2 O)38.13 0.320 0.440 2 [Note] In Table F2, the end blocking agents areshown by the following signs: L) aniline, M) 3- (phenylethynyl) aniline,N) 3-ethynylaniline, O) 3-aminostyrene, and P) 2-aminobiphenylene.

From the results, it is evident that the crosslinkable-group-containingpolyimide according to the present invention is resistant to gelationand hence, is excellent in moldability or formability.

Examples F11-F16, Comparative Example F3

In each of these examples and comparative examples,4,4′-bis(3-aminophenoxy)biphenyl (368.43 g, 1.000 mol), pyromelliticdianhydride (102.52 g, 0.470 mol) and 3,3′,4,4′-biphenyltetracarboxylicacid dianhydride (138.28 g, 0.470 mol) were charged as monomers togetherwith m-cresol (1,630 g) as a solvent into a vessel equipped with astirrer, a reflux condenser, a water trap and a nitrogen gas inlet tube.The contents were heated with stirring to 200° C. over 2 hours and 30minutes under a nitrogen atmosphere, and a reaction was conducted under200° C. reflux conditions for 2 hours, whereby a solution of anend-unblocked polymer was obtained. During the reaction, thecorresponding end blocking agent(s) described in Table F3 and m-cresol(200.0 mL) were charged into another vessel and were then heatedbeforehand at 100° C. for 1 hour under a nitrogen atmosphere to providea solution. The solution of the end blocking agent(s) was charged in itsentirety into the solution of the end-unblocked polymer, and reaction(s)was(were) then conducted under 200° C. reflux conditions for 2 hours.

The reaction mixture was thereafter cooled to 100° C. While maintainingthe resultant viscous polymer solution at 100° C. toluene (4 liters) wascharged dropwise into the polymer solution over 4 hours. After toluene(3 liters) which had been heated at 80° C. was charged, the resultingmixture was allowed to cool down to room temperature. Toluene (3 liters)was added further, followed by stirring for 1 hour. A precipitate wasthen collected by filtration. The precipitate was again suspended andallowed to reprecipitate in toluene (4 liters) After the reprecipitatewas collected by filtration and then provisionally dried at 50° C. for24 hours, the reprecipitate was dried at 200° C. under reduced pressurefor 12 hours under a gentle nitrogen gas stream.

Using the polyimide powders so obtained, their gel times at 360° C. weremeasured in exactly the same manner as in Examples A83-A87.

The results are shown together with the logarithmic viscosity numbers ofthe thus-obtained polyimide powders in Table F3.

TABLE F3 End blocking agent (one to three kinds) Logarithmic Kind/viscosity Ex./Comp.Ex. Charged amount [g]/ number 360° C. No. Chargedamount [mol] [dL/g] Gel time [min.] Example F11 A) 28.44 0.192 0.470 50F) 8.263 0.0480 Example F12 A) 28.44 0.192 0.462 109 G) 11.92 0.0480Example F13 A) 28.44 0.192 0.466 24 H) 7.931 0.0480 Example F14 A) 28.440.192 0.475 16 I) 4.707 0.0480 Example F15 A) 28.44 0.192 0.449 15 J)5.384 0.0480 Example F16 A) 28.44 0.192 0.455 61 K) 15.09 0.0480Comp.Ex. F3 B) 35.55 0.240 0.456 2 [Note] In Table F1, the end blockingagents are indicated by the following signs: A) phthalic anhydride, B)1-phenyl-2-(3,4-dicarboxyphenyl) acetylene anhydride, F)4-ethynylphthalic anhydride, G) 3-(phenylethynyl)phthalic anhydride, H)5-norbornene-2,3-dicarboxylic acid anhydride, I) maleic anhydride, J)2-methylmaleic anhydride, and K) 2-(3,4-dicarboxyphenoxy)biphenyleneanhydride

From the foregoing, it is evident that thecrosslinkable-group-containing polyimide according to the presentinvention is excellent in moldability or formability although its geltime is observed to vary somewhat depending on the crosslinkable groups.It is also appreciated that the polyimide of the comparative exampleundergoes quick gelation and its melt moldability or formability ishence extremely poor.

The present invention has made it possible to provide crosslinkedthermoplastic polyimides having various excellent properties inherent topolyimides, namely, high heat resistance, excellent mechanicalproperties, superb sliding property, low water absorption property,outstanding electrical properties, high thermal oxidation resistance,high chemical resistance and high radiation resistance, especially thoseimproved more markedly in heat resistance, chemical resistance andmechanical properties, melt-moldable or formable,crosslinkable-group-containing polyimides,crosslinkable-group-containing polyamic acids as precursors of thecrosslinkable-group-containing polyimides, and production processesthereof.

What is claimed is:
 1. A crosslinkable-group-containing polyimidecomprising crosslinkable groups at 1 to 80 mole % of molecule endsthereof.
 2. A crosslinkable-group-containing polyimide according toclaim 1, wherein a backbone structure which forms said polyimide issubstantially provided with thermoplasticity.
 3. Acrosslinkable-group-containing polyimide according to claim 1, saidpolyimide permitting melt molding or forming, wherein 1 to 80 mole % ofsaid molecule ends are crosslinkable-group-containing molecule endsrepresented by the chemical formula (2a) and 99 to 20 mole % of saidmolecule ends are crosslinking-group-free molecule ends represented bythe chemical formula (2b):

wherein Y represents a trivalent aromatic group selected from the groupconsisting:

wherein X represents a divalent linking group selected from the groupconsisting of a direct bond, a carbonyl group, a sulfone group, asulfide group, an ether group, an isopropylidene group and ahexafluoroisopropylidene group; and

wherein T represents a divalent aromatic group consisting of:

wherein X represents a divalent linking group selected from the groupconsisting of a direct bond, a carbonyl group, a sulfone group, asulfide group, an ether group, an isopropylidene group and ahexafluoroisopropylidene group.
 4. A crosslinkable-group-containingpolyimide according to claim 1, wherein said polyimide comprisespolyimide molecules of a structure represented by the chemical formula(2c):

wherein T, PI and Y are groups to be indicated next, respectively, thatis, T represents a divalent aromatic group selected from the groupconsisting of:

 wherein X represents a divalent linking group selected from the groupconsisting of a direct bond, a carbonyl group, a sulfone group, asulfide group, an ether group, an isopropylidene group and ahexafluoroisopropylidene group; PI represents a polyimide backbone; andY represents a trivalent aromatic group selected from the groupconsisting of:

 wherein X represents a divalent linking group selected from the groupconsisting of a direct bond, a carbonyl group, a sulfone group, asulfide group, an ether group, an isopropylidene group and ahexafluoroisopropylidene group.
 5. A crosslinkable-group-containingpolyimide according to claim 3, wherein in the chemical formula (2b) or(2c), T is the following chemical formula (2d):


6. A crosslinkable-group-containing polyimide according to claim 3,wherein in the chemical formula (2a) or (2c), Y is the followingchemical formula (2e):


7. A crosslinkable-group-containing polyimide according to claim 1,wherein a backbone of said polyimide has recurring structural unitsrepresented by the chemical formula (1):

wherein Ar and R are groups to be described next, that is, Ar representsa divalent aromatic group selected from the group consisting of:

 wherein J represents a divalent linking group selected from the groupconsisting of a carbonyl group, an ether group, an isopropylidene groupand a hexafluoroisopropylidene group, K represents a divalent linkinggroup selected from the group consisting of a direct bond, a carbonylgroup, a sulfone group, a sulfide group, an ether group, anisopropylidene group and a hexafluoroisopropylidene group, p and q eachindependently stand for 0 or 1, and a position of each bond, saidposition being unspecified, is a para-position or meta-position; and Rrepresents a tetravalent aromatic group selected from the groupconsisting of:

 wherein G represents a divalent aromatic group selected from the groupconsisting of a direct bond, a carbonyl group, a sulfone group, asulfide group, an ether group, an isopropylidene group, ahexafluoroisopropylidene group, a 3-oxyphenoxy group, a 4-oxyphenoxygroup, a 4′-oxy-4-biphenoxy group and a4-[1-(4-oxyphenyl)-1-methylethyl]phenoxy group.
 8. Acrosslinkable-group-containing polyimide according to claim 7, wherein50 to 100 mole % of said recurring structural units represented by thechemical formula (1) are of a recurring unit structure represented bythe chemical formula (1a):

wherein G is a divalent aromatic group selected from the groupconsisting of a direct bond, a carbonyl group, a sulfone group, asulfide group, an ether group, an isopropylidene group, ahexafluoroisopropylidene group, a 3-oxyphenoxy group, a 4-oxyphenoxygroup, a 4′-oxy-4-biphenoxy group and a4-[1-(4-oxyphenyl)-1-methylethyl]phenoxy group.
 9. Acrosslinkable-group-containing polyimide according to claim 8, whereinin the chemical formula (1a), G is a 4′-oxy-4-biphenoxy group.
 10. Acrosslinkable-group-containing polyimide according to claim 8, whereinin the chemical formula (1a), G is a4-[1-(4-oxyphenyl)-1-methylethyl]phenoxy group.
 11. Acrosslinkable-group-containing polyimide according to claim 7, wherein50 to 100 mole % of said recurring structural units represented by thechemical formula (1) are of a recurring unit structure represented bythe chemical formula (1b):

wherein X and R are groups to be indicated next, respectively, that is,X represents a divalent linking group selected from the group consistingof a direct bond, a carbonyl group, a sulfone group, a sulfide group, anether group, an isopropylidene group and a hexafluoroisopropylidenegroup; and R represents a tetravalent linking group selected from thegroup consisting of:

 wherein G represents a divalent aromatic group selected from the groupconsisting of a direct bond, a carbonyl group, a sulfone group, asulfide group, an ether group, an isopropylidene group, ahexafluoroisopropylidene group, a 3-oxyphenoxy group, a 4-oxyphenoxygroup, a 4′-oxy-4-biphenoxy group and a4-[1-(4-oxyphenyl)-1-methylethyl]phenoxy group, and a position of eachbond, said position being unspecified, is a para-position ormeta-position.
 12. A crosslinkable-group-containing polyimide accordingto claim 11, wherein in the chemical formula (1b), X is an oxygen atom;imido-bonded positions of two benzenes to which X is directly bonded area m-position and a p-position, respectively; and R is a3,4,3′,4′-substituted biphenyl.
 13. A crosslinkable-group-containingpolyimide according to claim 7, wherein among said recurring structuralunits represented by the chemical formula (1), 50 to 100 mole % are of arecurring unit structure represented by the chemical formula (1c):

wherein X and R are groups to be indicated next, respectively, that is,X represents a divalent linking group selected from the group consistingof a direct bond, a carbonyl group, a sulfone group, a sulfide group, anether group, an isopropylidene group and a hexafluoroisopropylidenegroup; and R represents a tetravalent linking group selected from thegroup consisting of:

 wherein G represents a divalent aromatic group selected from the groupconsisting of a direct bond, a carbonyl group, a sulfone group, asulfide group, an ether group, an isopropylidene group, ahexafluoroisopropylidene group, a 3-oxyphenoxy group, a 4-oxyphenoxygroup, a 4′-oxy-4-biphenoxy group and a4-[1-(4-oxyphenyl)-1-methylethyl]phenoxy group, and a position of eachbond, said position being unspecified, is a para-position ormeta-position.
 14. A crosslinkable-group-containing polyimide accordingto claim 13, wherein in the chemical formula (1c), X is an oxygen atom.15. A crosslinkable-group-containing polyimide according to claim 13,wherein in the chemical formula (1c), X is an oxygen atom; positions ofa benzene ring, at which two Xs are directly bonded, respectively, arem-positions relative to each other; bonded positions of each of twobenzenes to each of which X and an imido group are directly bonded arep-positions relative to each other; and R is a 3,4,3′,4′-substitutedbiphenyl.
 16. A crosslinkable-group-containing polyimide according toclaim 7, wherein among said recurring structural units represented bythe chemical formula (1), 50 to 100 mole % are of a recurring unitstructure represented by the chemical formula (1e):

wherein Q, Z and R are groups to be indicated next, respectively, thatis, Q represents a divalent aromatic group selected from the groupconsisting of an ether group and an isopropylidene group; Z represents adivalent aromatic group selected from the group consisting of a directbond, a carbonyl group, a sulfone group, a sulfide group, an ethergroup, an isopropylidene group, a hexafluoroisopropylidene group, and

R represents a tetravalent aromatic group selected from the groupconsisting of:

 wherein G represents a divalent aromatic group selected from the groupconsisting of a direct bond, a carbonyl group, a sulfone group, asulfide group, an ether group, an isopropylidene group, ahexafluoroisopropylidene group, a 3-oxyphenoxy group, a 4-oxyphenoxygroup, a 4′-oxy-4-biphenoxy group and a4-[1-(4-oxyphenyl)-1-methylethyl]phenoxy group, and a position of eachbond, said position being unspecified, is a para-position ormeta-position.
 17. A crosslinkable-group-containing polyimide accordingto claim 16, wherein in the chemical formula (1e), Q is an oxygen atom;and Z is at least one divalent group selected from the group consistingof a direct bond, a carbonyl group, a sulfone group, a sulfide group, anether group, an isopropylidene group and a hexafluoroisopropylidenegroup.
 18. A crosslinkable-group-containing polyimide according to claim16, wherein in the chemical formula (1e), Q is an oxygen atom; Z is adirect bond; and R is a 1,2,4,5-substituted benzene.
 19. A process forthe production of a melt-moldable or formable,crosslinkable-group-containing polyimide, 1 to 80 mole % of moleculeends of said polyimide being crosslinkable-group-containing moleculeends represented by a chemical formula (2a) and 99 to 20 mole % of saidmolecule ends being crosslinkable-group-free molecule ends representedby a chemical formula (2b), which comprises end-blocking ends ofpolyimide backbones by using dicarboxylic acid anhydrides represented bythe chemical formula (3a) and the chemical formula (3b):

wherein Y represents a trivalent aromatic group selected from the groupconsisting:

wherein X represents a divalent linking group selected from the groupconsisting of a direct bond, a carbonyl group, a sulfone group, asulfide group, an ether group, an isopropylidene group and ahexafluoroisopropylidene group;

wherein T represents a divalent aromatic group consisting of:

wherein X represents a divalent linking group selected from the groupconsisting of a direct bond, a carbonyl group, a sulfone group, asulfide group, an ether group, an isopropylidene group and ahexafluoroisopropylidene group;

wherein Y represents a trivalent aromatic group selected from the groupconsisting:

wherein X represents a divalent linking group selected from the groupconsisting of a direct bond, a carbonyl group, a sulfone group, asulfide group, an ether group, an isopropylidene group and ahexafluoroisopropylidene group; and

wherein T represents a divalent aromatic group consisting of:

wherein X represents a divalent linking group selected from the groupconsisting of a direct bond, a carbonyl group, a sulfone group, asulfide group, an ether group, an isopropylidene group and ahexafluoroisopropylidene group.
 20. A process according to claim 19,wherein said dicarboxylic acid anhydrides represented by the chemicalformula (3a) and the chemical formula (3b) are used in amountsrepresented, on a molar ratio basis, by the numerical formula [1]:1/99≦the dicarboxylic acid anhydride represented by the chemical formula(3a)/the dicarboxylic acid anhydride represented by the chemical formula(3b)≦80/20  [1]

Y represents a trivalent aromatic group selected from the groupconsisting of:

 wherein X represents a divalent linking group selected from the groupconsisting of a direct bond, a carbonyl group, a sulfone group, asulfide group, an ether group, an isopropylidene group and ahexafluoroisopropylidene group.

T represents a divalent aromatic group selected from the groupconsisting of:

 wherein X represents a divalent linking group selected from the groupconsisting of a direct bond, a carbonyl group, a sulfone group, asulfide group, an ether group, an isopropylidene group and ahexafluoroisopropylidene group.
 21. A process according to claim 19,wherein in the chemical formula (3a) and/or the chemical formula (3b), Tis the chemical formula (2a) and/or Y is the chemical formula (2e):


22. A process according to claim 19, wherein said polyimide backboneshave been obtained by thermally and/or chemically imidating a polyamicacid obtained as a polyimide precursor by polymerizing a diaminecomponent and a tetracarboxylic acid anhydride component.
 23. A processaccording to claim 22, wherein said diamine component is, at least onediamine component selected from the group consisting of diaminecomponents represented by the chemical formula (4): H₂N—Ar—NH₂  (4)wherein Ar represents a divalent aromatic group selected from the groupconsisting of:

wherein J represents a divalent linking group selected from the groupconsisting of a carbonyl group, an ether group, an isopropylidene groupand a hexafluoroisopropylidene group, K represents a divalent linkinggroup selected from the group consisting of a direct bond, a carbonylgroup, a sulfone group, a sulfide group, an ether group, anisopropylidene group and a hexafluoroisopropylidene group, p and q eachindependently stand for 0 or 1, and a position of each bond, saidposition being unspecified, is a para-position or meta-position.
 24. Aprocess according to claim 23, wherein of said diamine componentrepresented by the chemical formula (4), 50 to 100 mole % arerepresented by the chemical formula (4c):

wherein X represents a divalent linking group selected from the groupconsisting of a direct bond, a carbonyl group, a sulfone group, asulfide group, an ether group, an isopropylidene group and ahexafluoroisopropylidene group, and a position of each bond, saidposition being unspecified, is a para-position or meta-position.
 25. Aprocess according to claim 24, wherein in the chemical formula (4c), Xis an oxygen atom.
 26. A process according to claim 24, wherein in thechemical formula (4c), X is an oxygen; positions of a benzene ring, atwhich two Xs are directly bonded, respectively, are m-positions relativeto each other; and bonded positions of each of two benzenes to each ofwhich X and an amino group are directly bonded are p-positions relativeto each other.
 27. A process according to claim 24, wherein of thediamine component represented by the chemical formula (4), 50 to 100mole % are represented by the chemical formula (4d):

wherein X represents a divalent linking group selected from the groupconsisting of a direct bond, a carbonyl group, a sulfone group, asulfide group, an ether group, an isopropylidene group and ahexafluoroisopropylidene group.
 28. A process according to claim 27,wherein in the chemical formula (4d), X is a direct bond.
 29. A processaccording to claim 22, wherein said tetracarboxylic acid dihydridecomponent is represented by the chemical formula (5):

wherein R represents a tetravalent linking group selected from the groupconsisting of:

wherein G represents a divalent aromatic group selected from the groupconsisting of a direct bond, a carbonyl group, a sulfone group, asulfide group, an ether group, an isopropylidene group, ahexafluoroisopropylidene group, a 3-oxyphenoxy group, a 4-oxyphenoxygroup, a 4′-oxy-4-biphenoxy group and a4-[1-(4-oxyphenyl)-1-methylethyl]phenoxy group.
 30. Acrosslinkable-group-containing polyimide according to claim 1, whereinthere is a temperature T [° C.] which simultaneously satisfy thefollowing numerical formulas [2] and [3]:  1≦MV30(T)/MV5(T)≦10  [2]10≦MV5(T)≦10,000  [3] where MV5(T): melt viscosity [Pa·sec] of saidpolyimide as measured under a desired constant shearing stress in arange of from 0.1 to 1 [MPa] after causing said polyimide to melt byholding said polyimide at a temperature T [° C.] for 5 minutes; andMV30(T): melt viscosity [Pa·sec] of said polyimide as measured undersaid desired constant shearing stress in the range of from 0.1 to 1[MPa] after causing said polyimide to melt by holding said polyimide atthe temperature T [° C.] for 30 minutes.
 31. Acrosslinkable-group-containing polyimide according to claim 1, whereinthere is a temperature T [° C.] which simultaneously satisfy thefollowing numerical formulas [2], [3] and [4]: 1≦MV30(T)/MV5(T)≦10  [2]10≦MV5(T)≦10,000  [3] MV30(T+20)/MV5(T+20)≦20  [4] where MV5(T): meltviscosity [Pa·sec] of said polyimide as measured under a desiredconstant shearing stress in a range of from 0.1 to 1 [MPa] after causingsaid polyimide to melt by holding said polyimide at a temperature T [°C.] for 5 minutes; MV5(T+20): melt viscosity [Pa·sec] of said polyimideas measured under said desired constant shearing stress in the range offrom 0.1 to 1 [MPa] after causing said polyimide to melt by holding saidpolyimide at a temperature T+20 [° C.] for 5 minutes; MV30(T): meltviscosity [Pa·sec] of said polyimide as measured under said desiredconstant shearing stress in the range of from 0.1 to 1 [MPa] aftercausing said polyimide to melt by holding said polyimide at thetemperature T [° C.] for 30 minutes; and MV30(T+20): melt viscosity[Pa·sec] of said polyimide as measured under said desired constantshearing stress in the range of from 0.1 to 1 [MPa] after causing saidpolyimide to melt by holding said polyimide at a temperature T+20 [° C.]for 30 minutes.
 32. A crosslinkable-group-containing polyimide accordingto claim 1, which simultaneously satisfies the following numericalformulas [5] and [6]: 1≦MV30(360)/MV5(360)≦10   [5]10≦MV5(360)≦10,000  [6] where MV5(360) melt viscosity [Pa·sec] of saidpolyimide as measured under a desired constant shearing stress in arange of from 0.1 to 1 [MPa] after causing said polyimide to melt byholding said polyimide at 360 [° C.] for 5 minutes; and MV30(360): meltviscosity [Pa·sec] of said polyimide as measured under said desiredconstant shearing stress in the range of from 0.1 to 1 [MPa] aftercausing said polyimide to melt by holding said polyimide at 360 [° C.]for 30 minutes.
 33. A crosslinkable-group-containing polyimide accordingto claim 1, wherein a time t (min) which satisfies the numerical formula[7] lasts 10 minutes or longer: G′(t)=G″(t)  [7] where G′ (t) storagemodulus of said polyimide as measured at 360° C. and 1 Hz after anelapse of said time t (min); and G″ (t): loss modulus of said polyimideas measured at 360° C. and 1 Hz after an elapse of said time t (min).34. A crosslinked polyimide obtained by heat-treating acrosslinkable-group-containing polyimide according to claim
 1. 35. Asolution or suspension comprising a crosslinkable-group-containingpolyimide according to claim 1.